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NGTB25N120FL3WG

Onsemi

NGTB25N120FL3WG by Onsemi

NGTB25N120FL3WG by Onsemi is an N-CHANNEL IGBT with 1200V VCEsat, 50A IC, and 349W power dissipation. Ideal for power control applications, it features a built-in diode and operates b/w -55 to 175 °C. This FLANGE MOUNT device has a turn-off time of 282ns and turn-on time of 36ns.

Median Price

$4.378

Lifecycle Status

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Mouser Electronics

USA . 129 parts In-Stock

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$7.540

100+ parts

-

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$3.670

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129

$7.540

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$3.670

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Newark

USA . 24 parts In-Stock

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$9.120

100+ parts

$5.650

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$5.370

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24

$9.120

$5.650

$5.370

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Verical

USA . 278,670 parts In-Stock

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$3.225

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$3.225

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Flip Electronics (Authorized)

USA . 240,000 parts In-Stock

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DigiKey

USA . 1,380 parts In-Stock

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$4.140

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$4.140

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Arrow

USA . 120 parts In-Stock

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$4.370

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$3.257

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120

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$4.370

$3.257

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RS (Exports)

UK . 22 parts In-Stock

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$4.385

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$3.884

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22

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$4.385

$3.884

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Maritex

Poland . 20 parts In-Stock

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$4.044

100+ parts

$2.441

1k+ parts

$2.061

10k+ parts

-

20

$4.044

$2.441

$2.061

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Nova Conductors

Japan . 30 parts In-Stock

1+ parts

$4.237

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30

$4.237

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Digiode

USA . 552 parts In-Stock

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$6.688

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552

$6.688

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Flip Electronics

USA . 170,700 parts In-Stock

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Vyrian

USA . 8,569 parts In-Stock

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Aztec Data Supply Inc.

USA . 584 parts In-Stock

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$1.260

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584

$1.260

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Ampacity Inc.

Singapore . 60,010 parts In-Stock

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$3.730

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60,010

$3.730

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Semicontronic

India . 59,989 parts In-Stock

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$3.730

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$3.637

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$3.618

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59,989

$3.730

$3.637

$3.618

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Corohmni

South Africa . 388 parts In-Stock

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$4.152

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388

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Argo Parts USA

USA . 4,615 parts In-Stock

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$4.237

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4,615

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Continental Prestige Electronics

USA . 3,611 parts In-Stock

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$4.237

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$4.152

3,611

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$4.152

Netroflash

USA . 100 parts In-Stock

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$4.237

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100

$4.237

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Corphita

USA . 1,340 parts In-Stock

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$6.336

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Microchip USA

USA . 9,379 parts In-Stock

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$18.648

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Lixinc

USA . 18,660 parts In-Stock

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RC Electronics

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TANS Electronics

Latvia . 7,332 parts In-Stock

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Problanco Electronics

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A-Z Elektronik GmbH

Germany . 5,783 parts In-Stock

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Kulean Microsystems

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Authorized Procurement Solutions

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UHIMA Technologies

Türkiye . 244 parts In-Stock

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GreenTree Electronics

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Overview

Enhance your power control applications with the NGTB25N120FL3WG by Onsemi. Designed with precision and quality in mind, this N-channel insulated gate bipolar transistor offers a single configuration with a built-in diode for seamless performance. With a maximum collector-emitter voltage of 1200V and a maximum operating temperature of 175°C, this transistor ensures reliable and efficient power control. Trust Onsemi's expertise in semiconductor manufacturing to deliver a product that meets your needs for high-power applications. Elevate your projects with the NGTB25N120FL3WG and experience the difference in performance and reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a long lifespan.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and improves efficiency in power control applications.

Maximum Power Dissipation (Abs): 349 W

High power dissipation capability allows for handling large amounts of power without overheating.

Maximum Collector-Emitter Voltage: 1200 V

Can withstand high voltages, making it suitable for high-power applications.

Maximum Collector Current (IC): 50 A

Handles large currents, providing high power capability.

Nominal Turn On Time (ton): 36 ns

Fast turn-on time allows for quick switching, improving overall performance.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) NGTB25N120FL3WG attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Maximum Gate-Emitter Threshold Voltage:

6.5 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

282 ns

Nominal Turn On Time (ton):

36 ns

Maximum VCEsat:

1.95 V

Trade Compliance

NGTB25N120FL3WG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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