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FS25R12YT3

Infineon Technologies

FS25R12YT3 by Infineon Technologies

Infineon FS25R12YT3 is an N-CHANNEL IGBT with VCEsat of 2.15V, IC of 40A, and Pmax of 165W. Ideal for high-power applications like motor drives due to its fast turn-off time (toff) of 640ns and turn-on time (ton) of 120ns in a RECTANGULAR package style.

Median Price

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Lifecycle Status

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6

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1k+

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Vyrian

USA . 1,501 parts In-Stock

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Digiode

USA . 973 parts In-Stock

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Nova Conductors

Japan . 700 parts In-Stock

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700

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ACDS - Activité Composants Distribution Service

France . 90 parts In-Stock

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Fibra_Brandt Electronic GMBH

Germany . 3 parts In-Stock

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ECAB

Sweden . 1 parts In-Stock

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Modulus Dynamics

Lithuania . 23,262 parts In-Stock

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$0.406

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$0.390

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$0.374

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Corohmni

South Africa . 779 parts In-Stock

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$1.412

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Aztec Data Supply Inc.

USA . 1,610 parts In-Stock

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$1.910

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AZTECH Wire

Italy . 868 parts In-Stock

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$17.907

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Semicontronic

India . 712 parts In-Stock

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$59.050

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$57.574

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$57.278

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712

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Continental Prestige Electronics

USA . 6,834 parts In-Stock

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Bastille Electronics

Australia . 800 parts In-Stock

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Corphita

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Argo Parts USA

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Overview

Experience the superior quality and reliability of the FS25R12YT3 by Infineon Technologies, a leading manufacturer in the industry. This Insulated Gate Bipolar Transistor (IGBT) offers exceptional performance and efficiency in a wide range of applications. With a maximum power dissipation of 165W and a maximum collector-emitter voltage of 1200V, this complex N-Channel transistor is perfect for high-power industrial and automotive applications. Trust in Infineon Technologies to deliver cutting-edge technology that exceeds your expectations.

Feature Benefit Bullets

Polarity or Channel Type:

N-CHANNEL - Provides higher efficiency and better power handling capabilities compared to P-CHANNEL IGBTs.

Configuration:

COMPLEX - Allows for more precise control over the switching characteristics, ideal for applications with specific requirements.

Maximum VCEsat:

2.15 V - Low VCEsat value leads to reduced power losses and improved overall efficiency of the device.

Package Shape:

RECTANGULAR - Enables easy mounting and integration into various electronic systems.

No. of Elements:

6 - Offers redundancy and parallel operation for increased reliability and performance.

Nominal Turn Off Time (toff):

640 ns - Short turn-off time ensures quick switching and minimal power dissipation.

No. of Terminals:

22 - Provides multiple connection points for versatile circuit configurations.

Maximum Power Dissipation (Abs):

165 W - High power dissipation capability allows for handling heavy loads and high current applications.

Package Style (Meter):

FLANGE MOUNT - Securely mounts the IGBT for stable operation in different environments.

Maximum Operating Temperature:

150 °C - Can withstand high temperatures, ensuring reliable performance in harsh conditions.

Maximum Collector-Emitter Voltage:

1200 V - High breakdown voltage supports operation in applications requiring high voltage ratings.

Transistor Element Material:

SILICON - Silicon IGBTs offer good thermal conductivity and switching performance for efficient operation.

Maximum Gate-Emitter Voltage:

20 V - Allows for precise gate control and reliable switching characteristics.

Maximum Collector Current (IC):

40 A - Capable of handling high current loads for a wide range of applications.

Terminal Position:

UPPER - Ease of connection and board layout for simplified installation and maintenance.

Case Connection:

ISOLATED - Provides electrical isolation for enhanced safety and protection against voltage spikes.

Nominal Turn On Time (ton):

120 ns - Fast turn-on time ensures efficient switching and control over the device operation.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FS25R12YT3 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Configuration:

Maximum Gate-Emitter Voltage:

20 V

JESD-30 Code:

R-XUFM-X22

No. of Elements:

6

No. of Terminals:

22

Maximum Operating Temperature:

150 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

640 ns

Nominal Turn On Time (ton):

120 ns

Maximum VCEsat:

2.15 V

Trade Compliance

FS25R12YT3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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