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FS25R12W1T4

Infineon Technologies

FS25R12W1T4 by Infineon Technologies

FS25R12W1T4 by Infineon Technologies is an N-CHANNEL IGBT with 6 elements in a bridge configuration. It has a max VCEsat of 2.25V and can handle up to 45A collector current. Ideal for power control applications, this IGBT operates at temperatures up to 175°C with a turn-off time of 505ns.

Median Price

$40.170

Lifecycle Status

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10

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1k+

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Mouser Electronics

USA . 56 parts In-Stock

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$33.620

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$24.300

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$24.300

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Chip1Stop

Japan . 24 parts In-Stock

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Master Electronics

USA . 14 parts In-Stock

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$46.720

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$44.860

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14

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$46.720

$44.860

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Digiode

USA . 833 parts In-Stock

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$33.374

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833

$33.374

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Vyrian

USA . 47 parts In-Stock

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$35.130

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Nova Conductors

Japan . 100 parts In-Stock

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Rapid Electronics

USA . 24 parts In-Stock

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IBS Electronics

USA . 14 parts In-Stock

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Bristol Electronics

USA . 6 parts In-Stock

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Atlantic Semiconductor

USA . 6 parts In-Stock

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Distributors (Availability)

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Modulus Dynamics

Lithuania . 9,165 parts In-Stock

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$1.198

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$1.150

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$1.102

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$1.198

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Ampacity Inc.

Singapore . 26 parts In-Stock

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$29.360

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Corphita

USA . 204 parts In-Stock

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$31.617

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Perfect Parts

USA . 16,800 parts In-Stock

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Futuretech Components

Singapore . 3,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,344 parts In-Stock

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Microchip USA

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Netroflash

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Authorized Procurement Solutions

USA . 100 parts In-Stock

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Overview

Infineon Technologies EasyPACK™ 1B IGBT Power Modules are a scalable power module solution with a flexible pin grid system perfect for customizing layout and pinout. The packages are without a base plate enabling use in various applications. The Infineon EasyPACK 1B IGBT power modules cover the full power range from 20A up to 100A at 600V/650V/1200V in PIM or Six-Pack configurations. These modules offer a 135W to 275W power dissipation range and operate from -40°C up to +150°C or +175°C.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL IGBTs are known for their high efficiency and fast switching speed, making them suitable for power control applications.

Configuration: BRIDGE, 6 ELEMENTS WITH BUILT-IN DIODE AND THERMISTOR

The bridge configuration with built-in diode and thermistor provides convenience and reliability in power control setups.

Maximum VCEsat: 2.25 V

Low VCEsat value indicates minimal power loss in the transistor, resulting in high efficiency and reduced heat generation.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy mounting and integration into various systems.

No. of Elements: 6

Having 6 elements provides higher power handling capacity and flexibility in controlling different circuits.

Nominal Turn Off Time (toff): 505 ns

Fast turn-off time ensures quick switching and improved performance in power control applications.

Maximum Power Dissipation (Abs): 205 W

High power dissipation rating allows the IGBT to handle large amounts of power without overheating.

Package Style (Meter): FLANGE MOUNT

Flange mount package style provides secure mounting and thermal stability for the IGBT.

Maximum Operating Temperature: 175 °C

With a high maximum operating temperature, the IGBT can withstand higher temperature environments without compromising performance.

Maximum Collector-Emitter Voltage: 1200 V

High voltage rating enables the IGBT to be used in high voltage applications safely and efficiently.

Transistor Element Material: SILICON

Silicon material offers reliable performance and durability in power control applications.

Maximum Gate-Emitter Voltage: 20 V

A moderate gate-emitter voltage rating ensures optimal gate control and responsiveness in switching operations.

Maximum Collector Current (IC): 45 A

High collector current rating allows the IGBT to handle large current flows in power circuits.

Terminal Position: UPPER

Upper terminal position offers convenience in connection and installation of the IGBT in circuits.

Case Connection: ISOLATED

Isolated case connection provides safety and protection against electrical circuits, reducing the risk of short circuits.

Nominal Turn On Time (ton): 80 ns

Fast turn-on time ensures quick response and efficient switching in power control operations.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FS25R12W1T4 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Maximum Gate-Emitter Voltage:

20 V

JESD-30 Code:

R-XUFM-X23

No. of Elements:

6

No. of Terminals:

23

Maximum Operating Temperature:

175 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

505 ns

Nominal Turn On Time (ton):

80 ns

Maximum VCEsat:

2.25 V

Trade Compliance

FS25R12W1T4 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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