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NGTB30N120LWG

Onsemi

NGTB30N120LWG by Onsemi

NGTB30N120LWG by Onsemi is an N-CHANNEL IGBT with 1200V max collector-emitter voltage, 60A max collector current, and 560W max power dissipation. Ideal for motor control applications due to its single configuration with built-in diode and fast turn-off time of 596ns.

Median Price

$3.115

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 90 parts In-Stock

1+ parts

-

100+ parts

$2.890

1k+ parts

$2.580

10k+ parts

$2.430

90

-

$2.890

$2.580

$2.430

DigiKey

USA . 90 parts In-Stock

1+ parts

-

100+ parts

$3.340

1k+ parts

$3.340

10k+ parts

$3.340

90

-

$3.340

$3.340

$3.340

Distributors (In-Stock)

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Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$2.735

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300

$2.735

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Digiode

USA . 1,287 parts In-Stock

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$3.050

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1,287

$3.050

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Vyrian

USA . 5,811 parts In-Stock

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5,811

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DigiKey Marketplace

USA . 90 parts In-Stock

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90

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Distributors (Availability)

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Ampacity Inc.

Singapore . 90 parts In-Stock

1+ parts

$2.730

100+ parts

-

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90

$2.730

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Corohmni

South Africa . 316 parts In-Stock

1+ parts

$2.747

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316

$2.747

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Argo Parts USA

USA . 319 parts In-Stock

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$2.797

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319

$2.797

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Aranea Global

USA . 50 parts In-Stock

1+ parts

$2.803

100+ parts

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$2.691

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50

$2.803

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$2.691

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Corphita

USA . 2,436 parts In-Stock

1+ parts

$2.889

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2,436

$2.889

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AZTECH Wire

Italy . 381 parts In-Stock

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$7.448

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381

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Problanco Electronics

Mexico . 7,600 parts In-Stock

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SupplyDigital Components

Austria . 5,008 parts In-Stock

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Kulean Microsystems

USA . 971 parts In-Stock

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UHIMA Technologies

Türkiye . 165 parts In-Stock

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TANS Electronics

Latvia . 43 parts In-Stock

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Overview

Unleash the power of your motor control applications with the NGTB30N120LWG by Onsemi. As a leader in the industry, Onsemi delivers top-quality Insulated Gate Bipolar Transistors that are designed for optimal performance and efficiency. Whether you're looking to enhance the speed or precision of your motor control systems, this N-CHANNEL transistor with a built-in diode offers unmatched reliability and durability. With a maximum collector-emitter voltage of 1200V and a maximum power dissipation of 560W, this transistor is built to handle even the most demanding tasks. Trust Onsemi to provide you with the tools you need to take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and protection for the internal components of the IGBT, ensuring reliability and durability.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs are known for their high efficiency and fast switching speed, making them suitable for motor control applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and improves overall efficiency by allowing for faster commutation and reduced losses.

Transistor Application: MOTOR CONTROL

Specifically designed for motor control applications, this IGBT provides precise control over the speed and direction of motors.

Maximum Power Dissipation (Abs): 560 W

With a high power dissipation capability, this IGBT can handle large amounts of power without overheating, ensuring reliable operation.

Maximum Collector-Emitter Voltage: 1200 V

With a high voltage rating, this IGBT can be used in high voltage applications without the risk of breakdown or failure.

Maximum Collector Current (IC): 60 A

Capable of handling high currents, this IGBT is suitable for driving large loads such as motors with ease.

Maximum Operating Temperature: 150 °C

With a high operating temperature range, this IGBT can withstand heat without compromising performance, making it suitable for demanding environments.

Nominal Turn Off Time (toff): 596 ns

With a fast turn-off time, this IGBT can quickly switch off to prevent damage to the circuit and improve efficiency.

Nominal Turn On Time (ton): 167 ns

The fast turn-on time ensures quick response and accurate control in motor control applications, improving overall system performance.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) NGTB30N120LWG attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Maximum Gate-Emitter Threshold Voltage:

6.5 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

MOTOR CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

596 ns

Nominal Turn On Time (ton):

167 ns

Trade Compliance

NGTB30N120LWG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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