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ISL9V3036S3ST

Onsemi

ISL9V3036S3ST by Onsemi

ISL9V3036S3ST by Onsemi is an N-CHANNEL IGBT with a max VCEsat of 1.6V and a max IC of 21A. Ideal for automotive ignition applications, it features a built-in diode and resistor, operates at temperatures ranging from -40 to 175 °C, and has a package style of SMALL OUTLINE.

Median Price

$2.000

Lifecycle Status

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10

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1k+

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Arrow

USA . 484 parts In-Stock

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$0.830

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484

$0.830

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Chip1Stop

Japan . 484 parts In-Stock

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$1.170

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484

$1.170

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Rochester

USA . 22,855 parts In-Stock

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$2.000

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$1.790

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$1.680

22,855

-

$2.000

$1.790

$1.680

Verical

USA . 6,457 parts In-Stock

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$2.337

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$2.200

6,457

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$2.200

DigiKey

USA . 2,175 parts In-Stock

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$2.750

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Mouser Electronics

USA . 931 parts In-Stock

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$2.000

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931

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$2.000

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Digiode

USA . 3,194 parts In-Stock

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$0.788

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$0.788

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Vyrian

USA . 5,140 parts In-Stock

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DigiKey Marketplace

USA . 3,080 parts In-Stock

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Nova Conductors

Japan . 750 parts In-Stock

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750

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Ampacity Inc.

Singapore . 5,501 parts In-Stock

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$0.710

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5,501

$0.710

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Semicontronic

India . 5,473 parts In-Stock

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$0.710

100+ parts

$0.692

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$0.689

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5,473

$0.710

$0.692

$0.689

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Corphita

USA . 1,829 parts In-Stock

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$0.747

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1,829

$0.747

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Corohmni

South Africa . 430 parts In-Stock

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$0.850

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430

$0.850

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Aztec Data Supply Inc.

USA . 1,180 parts In-Stock

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$1.864

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$1.864

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Microchip USA

USA . 442 parts In-Stock

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$14.625

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442

$14.625

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QUARKTWIN TECHNOLOGY LTD

USA . 24,670 parts In-Stock

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Authorized Procurement Solutions

USA . 12,000 parts In-Stock

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SupplyDigital Components

Austria . 8,261 parts In-Stock

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Kulean Microsystems

USA . 5,751 parts In-Stock

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TANS Electronics

Latvia . 4,994 parts In-Stock

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Supply Digital

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Metaverse IC Inc.

Canada . 1,600 parts In-Stock

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Bastille Electronics

Australia . 900 parts In-Stock

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Continental Prestige Electronics

USA . 807 parts In-Stock

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GreenTree Electronics

Israel . 800 parts In-Stock

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Argo Parts USA

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Problanco Electronics

Mexico . 550 parts In-Stock

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Kepictronics

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UHIMA Technologies

Türkiye . 152 parts In-Stock

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Overview

Revolutionize your automotive ignition systems with the ISL9V3036S3ST by Onsemi. This N-Channel IGBT offers unparalleled quality and reliability, thanks to Onsemi's reputation as a leading manufacturer in the industry. With a built-in diode and resistor configuration, this IGBT is perfect for applications requiring high power dissipation and fast switching speeds. From its small outline package style to its wide operating temperature range, this transistor provides exceptional value and performance for your automotive projects. Experience the advantages of Onsemi technology today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good insulation and protection for the internal components.

Polarity or Channel Type: N-CHANNEL

N-channel type allows for efficient current flow and better performance in automotive ignition applications.

Configuration: SINGLE WITH BUILT-IN DIODE AND RESISTOR

Built-in diode and resistor help in simplifying circuit design and improve reliability.

Transistor Application: AUTOMOTIVE IGNITION

Specifically designed for automotive ignition applications, ensuring reliable performance under high voltage conditions.

Surface Mount: YES

Surface mount capability allows for easy installation and space-saving on circuit boards.

Maximum Collector-Emitter Voltage: 350 V

High collector-emitter voltage rating offers robustness and reliability in automotive ignition systems.

Maximum Power Dissipation (Abs): 150 W

High power dissipation capability allows for handling high power levels without overheating.

Maximum Turn On Time (ton): 11000 ns

Fast turn on time ensures quick response and efficient operation in automotive ignition systems.

Maximum Collector Current (IC): 21 A

High collector current rating enables handling of high-current loads in automotive ignition systems.

Maximum Gate-Emitter Threshold Voltage: 2.2 V

Low gate-emitter threshold voltage ensures efficient switching and minimal power loss.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) ISL9V3036S3ST attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

350 V

Maximum Fall Time (tf):

15000 ns

Maximum Gate-Emitter Threshold Voltage:

2.2 V

Maximum Gate-Emitter Voltage:

10 V

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Maximum Rise Time (tr):

7000 ns

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

AUTOMOTIVE IGNITION

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

30000 ns

Nominal Turn Off Time (toff):

7600 ns

Maximum Turn On Time (ton):

11000 ns

Nominal Turn On Time (ton):

2800 ns

Maximum VCEsat:

1.6 V

Trade Compliance

ISL9V3036S3ST Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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