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ISL9V2040P3

Onsemi

ISL9V2040P3 by Onsemi

ISL9V2040P3 by Onsemi is an N-CHANNEL IGBT with VCEsat of 2.3V, IC of 10A, and Ptot of 130W. Ideal for automotive ignition applications due to its built-in diode and resistor, it operates b/w -40 to 175 °C with a VCEmax of 390V.

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Problanco Electronics

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Overview

Discover the Onsemi ISL9V2040P3, a high-quality Insulated Gate Bipolar Transistor designed for automotive ignition applications. With built-in diode and resistor, this N-channel transistor offers superior performance and reliability. The Onsemi brand ensures top-notch manufacturing standards, providing customers with a trusted product that delivers exceptional value. Ideal for demanding environments, this IGBT boasts a maximum power dissipation of 130W and a maximum collector-emitter voltage of 390V. Trust Onsemi for cutting-edge technology that meets your automotive ignition needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material ensures durability and reliability in various operating conditions.

Polarity or Channel Type: N-CHANNEL

N-Channel type offers better performance and efficiency compared to P-Channel in many applications.

Configuration: SINGLE WITH BUILT-IN DIODE AND RESISTOR

Built-in diode and resistor simplify the circuit design and save space in automotive ignition systems.

Transistor Application: AUTOMOTIVE IGNITION

Specifically designed for automotive ignition systems, ensuring high performance and reliability in such applications.

Maximum VCEsat: 2.3 V

Low VCEsat value indicates minimal saturation voltage, leading to lower power dissipation and improved efficiency.

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration and mounting in electronic systems.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide secure and reliable connections in circuit boards.

Nominal Turn Off Time (toff): 6000 ns

Fast turn off time enhances the switching speed and efficiency of the transistor.

No. of Terminals: 3

3 terminals offer flexibility in circuit connections and configurations.

Maximum Power Dissipation (Abs): 130 W

High power dissipation capacity allows for reliable operation under high load conditions.

Package Style (Meter): FLANGE MOUNT

Flange mount design facilitates easy installation and heat dissipation in automotive ignition systems.

Maximum Operating Temperature: 175 °C

High operating temperature range ensures stability and performance in harsh automotive environments.

Maximum Collector-Emitter Voltage: 390 V

High collector-emitter voltage rating provides robustness and protection against overvoltage conditions.

Transistor Element Material: SILICON

Silicon material offers high switching speed, low on-state resistance, and high temperature tolerance.

Maximum Gate-Emitter Voltage: 12 V

High gate-emitter voltage ensures proper gate control and reliability in the transistor's operation.

Minimum Operating Temperature: -40 °C

Wide temperature range allows for reliable performance in extreme cold conditions.

Maximum Collector Current (IC): 10 A

High collector current rating enables the transistor to handle significant power loads.

Maximum Gate-Emitter Threshold Voltage: 2.2 V

Low gate-emitter threshold voltage ensures efficient switching and control of the transistor.

Terminal Position: SINGLE

Single terminal position simplifies circuit layout and connections, reducing complexity.

Case Connection: COLLECTOR

Collector connection design offers efficient current handling and heat dissipation capabilities.

Nominal Turn On Time (ton): 2780 ns

Fast turn on time ensures quick response and efficient operation of the transistor in automotive ignition systems.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) ISL9V2040P3 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

390 V

Maximum Gate-Emitter Threshold Voltage:

2.2 V

Maximum Gate-Emitter Voltage:

12 V

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

AUTOMOTIVE IGNITION

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

6000 ns

Nominal Turn On Time (ton):

2780 ns

Maximum VCEsat:

2.3 V

Trade Compliance

ISL9V2040P3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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