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ISL9V3036D3ST

Onsemi

ISL9V3036D3ST by Onsemi

ISL9V3036D3ST by Onsemi is an N-CHANNEL IGBT with a max VCEsat of 1.6V, ideal for AUTOMOTIVE IGNITION applications. It has a max Collector-Emitter Voltage of 350V and can handle a Max Collector Current of 21A. With a Package Style of SMALL OUTLINE, it operates b/w -40 to 175 °C temperature range.

Median Price

$1.940

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 12,089 parts In-Stock

1+ parts

-

100+ parts

$1.830

1k+ parts

$1.640

10k+ parts

$1.540

12,089

-

$1.830

$1.640

$1.540

Verical

USA . 1,982 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.050

10k+ parts

$1.925

1,982

-

-

$2.050

$1.925

Distributors (In-Stock)

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Vyrian

USA . 836 parts In-Stock

1+ parts

$1.680

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-

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836

$1.680

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Digiode

USA . 298 parts In-Stock

1+ parts

$1.938

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298

$1.938

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DigiKey Marketplace

USA . 14,591 parts In-Stock

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14,591

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ComSIT Distribution GmbH

Germany . 1,375 parts In-Stock

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1,375

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Distributors (Availability)

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Corohmni

South Africa . 152 parts In-Stock

1+ parts

$1.680

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152

$1.680

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Corphita

USA . 1,429 parts In-Stock

1+ parts

$1.836

100+ parts

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1,429

$1.836

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Ampacity Inc.

Singapore . 13,297 parts In-Stock

1+ parts

$3.110

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13,297

$3.110

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Metaverse IC Inc.

Canada . 36,800 parts In-Stock

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36,800

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Perfect Parts

USA . 23,890 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 21,662 parts In-Stock

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21,662

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Continental Prestige Electronics

USA . 14,591 parts In-Stock

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$2.450

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$2.450

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Kulean Microsystems

USA . 7,321 parts In-Stock

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7,321

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A-Z Elektronik GmbH

Germany . 7,270 parts In-Stock

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7,270

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Problanco Electronics

Mexico . 6,102 parts In-Stock

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SupplyDigital Components

Austria . 5,230 parts In-Stock

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TANS Electronics

Latvia . 3,681 parts In-Stock

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3,681

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Microchip USA

USA . 3,486 parts In-Stock

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3,486

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Alle Elektronik GmbH

Germany . 3,144 parts In-Stock

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3,144

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Supply Digital

USA . 1,417 parts In-Stock

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1,417

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UHIMA Technologies

Türkiye . 113 parts In-Stock

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113

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Overview

Unlock the power of automotive ignition systems with the ISL9V3036D3ST from Onsemi. This Insulated Gate Bipolar Transistor (IGBT) offers unparalleled quality and reliability, thanks to Onsemi's reputation for excellence in manufacturing. Ideal for a wide range of applications, this N-channel transistor provides customers with a single solution that includes a built-in diode and resistor, making it both convenient and cost-effective. Trust Onsemi to deliver the performance you need for your automotive projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation for the transistor, helping to protect it from external factors and ensuring reliable performance.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs typically offer lower ON-state voltage drop and faster switching speeds compared to P-channel types, making them suitable for high power applications.

Configuration: SINGLE WITH BUILT-IN DIODE AND RESISTOR

The built-in diode and resistor simplify circuit design and reduce component count, making this IGBT convenient and cost-effective for automotive ignition applications.

Transistor Application: AUTOMOTIVE IGNITION

Designed specifically for automotive ignition systems, this IGBT meets the necessary requirements for efficient and reliable performance in such applications.

Maximum Power Dissipation (Abs): 150 W

With a high maximum power dissipation rating, this IGBT can handle significant power loads without overheating, ensuring long-term reliability.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) ISL9V3036D3ST attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

350 V

Maximum Fall Time (tf):

15000 ns

Maximum Gate-Emitter Threshold Voltage:

2.2 V

Maximum Gate-Emitter Voltage:

10 V

JEDEC-95 Code:

TO-252AA

JESD-30 Code:

R-PSSO-G2

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Rise Time (tr):

7000 ns

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

AUTOMOTIVE IGNITION

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

30000 ns

Nominal Turn Off Time (toff):

7600 ns

Maximum Turn On Time (ton):

11000 ns

Nominal Turn On Time (ton):

2800 ns

Maximum VCEsat:

1.6 V

Trade Compliance

ISL9V3036D3ST Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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