Loading...

ISL9V2040D3STV

Onsemi

ISL9V2040D3STV by Onsemi

ISL9V2040D3STV by Onsemi is an N-CHANNEL IGBT with a max VCEsat of 1.9V and a collector-emitter voltage of 390V. Ideal for automotive ignition applications, it has a built-in diode and resistor, GULL WING terminals, and can operate b/w -40 to 175 °C.

Median Price

-

Lifecycle Status

EOL

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,650 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,650

-

-

-

-

Digiode

USA . 1,389 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,389

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 1,099 parts In-Stock

1+ parts

$19.300

100+ parts

-

1k+ parts

-

10k+ parts

-

1,099

$19.300

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 16,916 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

16,916

-

-

-

-

Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10,000

-

-

-

-

SupplyDigital Components

Austria . 6,454 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,454

-

-

-

-

Problanco Electronics

Mexico . 5,595 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,595

-

-

-

-

Corphita

USA . 1,650 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,650

-

-

-

-

TANS Electronics

Latvia . 958 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

958

-

-

-

-

UHIMA Technologies

Türkiye . 840 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

840

-

-

-

-

Kulean Microsystems

USA . 398 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

398

-

-

-

-

Corohmni

South Africa . 302 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

302

-

-

-

-

Overview

Enhance your automotive ignition systems with the high-quality ISL9V2040D3STV Insulated Gate Bipolar Transistor by Onsemi. Designed with a built-in diode and resistor, this N-CHANNEL transistor offers superior performance and reliability. Ideal for automotive applications, this product ensures efficient power management and enhanced ignition control. Trust Onsemi's reputation for excellence and elevate your projects with the ISL9V2040D3STV for optimal results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for the internal components, increasing the durability of the IGBT.

Polarity or Channel Type: N-CHANNEL

Offers efficient performance and low conduction losses, making it suitable for high-power applications.

Configuration: SINGLE WITH BUILT-IN DIODE AND RESISTOR

Simplifies the design and integration process, reducing the need for additional components and saving space.

Transistor Application: AUTOMOTIVE IGNITION

Designed specifically for automotive ignition systems, ensuring reliable and precise performance in this application.

Surface Mount: YES

Enables easy and compact installation on circuit boards, making it ideal for modern electronic systems.

Maximum VCEsat: 1.9 V

Low VCEsat results in minimal power loss and improved efficiency in operation.

Package Shape: RECTANGULAR

Allows for easy placement and secure mounting on the PCB, contributing to overall system reliability.

Terminal Form: GULL WING

Facilitates easy soldering and connection, ensuring a reliable electrical connection in the circuit.

Nominal Turn Off Time (toff): 6000 ns

Fast turn-off time helps in preventing short circuits and improves overall system performance.

No. of Terminals: 2

Simple 2-terminal design simplifies the installation and reduces the complexity of the circuit layout.

Maximum Power Dissipation (Abs): 130 W

High power dissipation capability allows for reliable operation under heavy load conditions.

Package Style (Meter): SMALL OUTLINE

Compact package style saves space on the PCB and allows for efficient heat dissipation.

Maximum Operating Temperature: 175 °C

Wide operating temperature range ensures reliable performance in various environmental conditions.

Maximum Collector-Emitter Voltage: 390 V

High VCE voltage rating enables the IGBT to handle high voltage applications with ease.

Transistor Element Material: SILICON

Silicon material provides high thermal and electrical conductivity, enhancing the performance of the IGBT.

Maximum Gate-Emitter Voltage: 12 V

Adequate gate-emitter voltage rating ensures proper switching control and reliable operation.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for reliable performance in cold environments.

Maximum Collector Current (IC): 10 A

High collector current rating allows the IGBT to handle large current flows without failure.

Maximum Gate-Emitter Threshold Voltage: 2.2 V

Suitable gate-emitter threshold voltage ensures efficient switching and control of the IGBT.

Terminal Position: SINGLE

Single terminal position simplifies the installation and connection process, reducing assembly time.

Case Connection: COLLECTOR

Collector case connection ensures efficient heat dissipation and helps in maintaining low operating temperatures.

Nominal Turn On Time (ton): 2780 ns

Fast turn-on time enables quick response and efficient switching in the circuit.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) ISL9V2040D3STV attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

390 V

Maximum Gate-Emitter Threshold Voltage:

2.2 V

Maximum Gate-Emitter Voltage:

12 V

JEDEC-95 Code:

TO-252AA

JESD-30 Code:

R-PSSO-G2

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

AUTOMOTIVE IGNITION

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

6000 ns

Nominal Turn On Time (ton):

2780 ns

Maximum VCEsat:

1.9 V

Trade Compliance

ISL9V2040D3STV Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20