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ISL9V2540S3ST

Onsemi

ISL9V2540S3ST by Onsemi

ISL9V2540S3ST by Onsemi is an N-CHANNEL IGBT with a max collector-emitter voltage of 430V and a max collector current of 15.5A. It is designed for power control applications, featuring a built-in diode and resistor in a small outline package style for surface mount assembly.

Median Price

$1.492

Lifecycle Status

EOL

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

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Adafruit Industries

USA . 1,000 parts In-Stock

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$2.096

100+ parts

$1.907

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$1.719

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-

1,000

$2.096

$1.907

$1.719

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Rochester

USA . 15,627 parts In-Stock

1+ parts

-

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$1.230

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$1.100

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$1.030

15,627

-

$1.230

$1.100

$1.030

DigiKey

USA . 14,852 parts In-Stock

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$1.610

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14,852

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$1.610

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Flip Electronics (Authorized)

USA . 12,800 parts In-Stock

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12,800

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Verical

USA . 4,800 parts In-Stock

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$1.375

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$1.288

4,800

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$1.375

$1.288

Distributors (In-Stock)

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Digiode

USA . 1,151 parts In-Stock

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$1.292

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$1.292

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Vyrian

USA . 1,016 parts In-Stock

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$1.360

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1,016

$1.360

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J2 Sourcing AB

Sweden . 21,456 parts In-Stock

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Flip Electronics

USA . 12,800 parts In-Stock

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12,800

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DigiKey Marketplace

USA . 12,800 parts In-Stock

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12,800

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ACDS - Activité Composants Distribution Service

France . 365 parts In-Stock

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365

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Bristol Electronics

USA . 365 parts In-Stock

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365

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Dan-Mar Components

USA . 365 parts In-Stock

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Corphita

USA . 1,603 parts In-Stock

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$1.224

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$1.224

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Corohmni

South Africa . 73 parts In-Stock

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$1.360

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73

$1.360

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$2.096

100+ parts

$1.907

1k+ parts

$1.719

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1,000

$2.096

$1.907

$1.719

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 25,728 parts In-Stock

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TANS Electronics

Latvia . 8,001 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,256 parts In-Stock

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Microchip USA

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Kulean Microsystems

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Alle Elektronik GmbH

Germany . 3,504 parts In-Stock

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Problanco Electronics

Mexico . 3,088 parts In-Stock

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Supply Digital

USA . 1,788 parts In-Stock

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SupplyDigital Components

Austria . 1,156 parts In-Stock

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Perfect Parts

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Kepictronics

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UHIMA Technologies

Türkiye . 19 parts In-Stock

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Overview

Discover the power of Onsemi's ISL9V2540S3ST Insulated Gate Bipolar Transistor, a game-changer in power control applications. With a single built-in diode and resistor, this N-Channel transistor offers unmatched efficiency and reliability. From its high maximum power dissipation to its low gate-emitter threshold voltage, this product is designed to exceed expectations. Trust Onsemi's reputation for quality and innovation, and unlock the full potential of your power control systems with the ISL9V2540S3ST.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a rugged enclosure for the components, ensuring durability and protection against external factors.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs generally have lower ON-resistance and higher switching speeds compared to P-channel, making them suitable for high-power applications.

Configuration: SINGLE WITH BUILT-IN DIODE AND RESISTOR

Simplifies circuit design by integrating necessary components, reducing overall complexity and space requirements.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, offering high efficiency and reliable performance in such scenarios.

Maximum Power Dissipation (Abs): 166.7 W

Capable of handling high power levels without thermal breakdown, ensuring the longevity of the component in demanding environments.

Maximum Operating Temperature: 175 °C

Can operate at high temperatures without compromising performance, suitable for industrial applications where heat dissipation is critical.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) ISL9V2540S3ST attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

430 V

Maximum Gate-Emitter Threshold Voltage:

2.2 V

Maximum Gate-Emitter Voltage:

12 V

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

6000 ns

Nominal Turn On Time (ton):

2780 ns

Trade Compliance

ISL9V2540S3ST Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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