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ISL9V3040D3S

Onsemi

ISL9V3040D3S by Onsemi

ISL9V3040D3S by Onsemi is an N-CHANNEL IGBT with a max VCEsat of 1.6V and a max IC of 21A. Ideal for automotive ignition applications, it features a built-in diode and resistor in a small outline package style. With an operating temperature range from -40 to 175 °C, this transistor offers fast rise time (tr) of 7000 ns and fall time (tf) of 15000 ns.

Median Price

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Lifecycle Status

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4

In-Stock Inventory

1k+

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Chip Stock

USA . 120,600 parts In-Stock

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Vyrian

USA . 1,451 parts In-Stock

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Digiode

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Electronic Expediters

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

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Supply Digital

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TANS Electronics

Latvia . 2,336 parts In-Stock

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Problanco Electronics

Mexico . 1,988 parts In-Stock

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Corphita

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Kulean Microsystems

USA . 1,833 parts In-Stock

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Glotronic Ltd.

UK . 1,800 parts In-Stock

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SupplyDigital Components

Austria . 970 parts In-Stock

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UHIMA Technologies

Türkiye . 842 parts In-Stock

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Overview

Unleash the power of automotive ignition systems with the ISL9V3040D3S by Onsemi. This Insulated Gate Bipolar Transistor (IGBT) comes with a single built-in diode and resistor, offering exceptional efficiency and reliability. With a maximum collector-emitter voltage of 390V and a maximum operating temperature of 175 °C, this IGBT is designed to withstand the toughest conditions. Whether you're in the automotive industry or looking for high-performance components, the ISL9V3040D3S provides the quality and value you need to drive innovation forward.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and protection for the transistor, making it durable and reliable for automotive applications.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs are known for their faster switching speeds and lower conduction losses, making them suitable for automotive ignition systems.

Configuration: SINGLE WITH BUILT-IN DIODE AND RESISTOR

The built-in diode and resistor help improve efficiency and simplify circuit design for automotive ignition applications.

Transistor Application: AUTOMOTIVE IGNITION

Specifically designed for automotive ignition systems, ensuring optimal performance and reliability in demanding environments.

Maximum Power Dissipation (Abs): 150 W

With a maximum power dissipation of 150W, this IGBT can handle high power levels effectively, making it suitable for automotive ignition applications.

Maximum Operating Temperature: 175 °C

Capable of operating in high-temperature environments commonly found in automotive applications, ensuring reliability under extreme conditions.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) ISL9V3040D3S attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

390 V

Maximum Fall Time (tf):

15000 ns

Maximum Gate-Emitter Threshold Voltage:

2.2 V

Maximum Gate-Emitter Voltage:

10 V

JEDEC-95 Code:

TO-252AA

JESD-30 Code:

R-PSSO-G2

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Rise Time (tr):

7000 ns

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

AUTOMOTIVE IGNITION

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

30000 ns

Nominal Turn Off Time (toff):

7600 ns

Maximum Turn On Time (ton):

11000 ns

Nominal Turn On Time (ton):

2800 ns

Maximum VCEsat:

1.6 V

Trade Compliance

ISL9V3040D3S Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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