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TDB6HK180N16RRBOSA1

Infineon Technologies

TDB6HK180N16RRBOSA1 by Infineon Technologies

TDB6HK180N16RRBOSA1 by Infineon Technologies is an N-CHANNEL IGBT with 1200V VCEsat, 140A IC, and 515W power dissipation. Ideal for POWER CONTROL applications due to its fast turn-off time of 410ns and high operating temperature range from -40°C to 150°C.

Median Price

$99.650

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2 parts In-Stock

1+ parts

-

100+ parts

$99.650

1k+ parts

$89.160

10k+ parts

$83.910

2

-

$99.650

$89.160

$83.910

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 839 parts In-Stock

1+ parts

$105.440

100+ parts

-

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839

$105.440

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Vyrian

USA . 1,996 parts In-Stock

1+ parts

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1,996

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Nova Conductors

Japan . 300 parts In-Stock

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300

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 98 parts In-Stock

1+ parts

$0.637

100+ parts

-

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98

$0.637

-

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Modulus Dynamics

Lithuania . 25,920 parts In-Stock

1+ parts

$0.728

100+ parts

$0.699

1k+ parts

$0.670

10k+ parts

-

25,920

$0.728

$0.699

$0.670

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Aztec Data Supply Inc.

USA . 842 parts In-Stock

1+ parts

$1.471

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842

$1.471

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AZTECH Wire

Italy . 713 parts In-Stock

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$10.620

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713

$10.620

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Ampacity Inc.

Singapore . 2 parts In-Stock

1+ parts

$94.340

100+ parts

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2

$94.340

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Semicontronic

India . 2 parts In-Stock

1+ parts

$94.340

100+ parts

$91.982

1k+ parts

$91.510

10k+ parts

-

2

$94.340

$91.982

$91.510

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Corphita

USA . 987 parts In-Stock

1+ parts

$99.891

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987

$99.891

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Microchip USA

USA . 5,602 parts In-Stock

1+ parts

$239.730

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5,602

$239.730

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Argo Parts USA

USA . 4,398 parts In-Stock

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4,398

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Continental Prestige Electronics

USA . 1,361 parts In-Stock

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1,361

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Bastille Electronics

Australia . 800 parts In-Stock

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800

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Overview

Experience superior power control with the TDB6HK180N16RRBOSA1 Insulated Gate Bipolar Transistor by Infineon Technologies. Known for their high-quality products, Infineon Technologies delivers top-notch performance in the field of power control applications. This N-CHANNEL transistor offers a complex configuration and a maximum collector-emitter voltage of 1200V, making it ideal for demanding tasks. With a maximum power dissipation of 515W and fast turn on/off times, this IGBT provides customers with unparalleled value and efficiency. Upgrade your power control systems with the TDB6HK180N16RRBOSA1 for reliable and high-performance operation.

Feature Benefit Bullets

Polarity or Channel Type:

N-CHANNEL - N-channel IGBTs have lower conduction losses and higher efficiency, making them a good choice for power control applications.

Configuration:

COMPLEX - The complex configuration allows for more advanced power control capabilities, making this IGBT suitable for complex power control requirements.

Transistor Application:

POWER CONTROL - Specifically designed for power control applications, this IGBT is optimized for handling high power loads efficiently.

Maximum VCEsat:

2.2 V - With a low VCEsat value, this IGBT offers reduced power dissipation and improved overall efficiency in power control circuits.

Package Shape:

RECTANGULAR - The rectangular package shape provides a standard form factor for easy integration into existing circuit designs.

Nominal Turn Off Time (toff):

410 ns - The fast turn-off time of this IGBT allows for quick switching capabilities, ideal for applications requiring precise power control.

No. of Terminals:

29 - With a high number of terminals, this IGBT offers versatile connectivity options for complex circuit configurations.

Maximum Power Dissipation (Abs):

515 W - The high power dissipation capability of this IGBT ensures it can handle heavy load conditions without overheating.

Package Style (Meter):

FLANGE MOUNT - The flange mount package style provides secure mounting options for rugged environments, making this IGBT suitable for industrial applications.

Maximum Operating Temperature:

150 °C - With a high maximum operating temperature, this IGBT can withstand harsh environmental conditions without compromising performance.

Maximum Collector-Emitter Voltage:

1200 V - The high collector-emitter voltage rating makes this IGBT suitable for high voltage power control applications.

Transistor Element Material:

SILICON - Silicon-based transistors offer high reliability and performance, ensuring long-term stability in power control circuits.

Maximum Gate-Emitter Voltage:

20 V - The high gate-emitter voltage rating provides a wide margin of safety for stable and reliable operation in power control systems.

Minimum Operating Temperature:

40 °C - With a low minimum operating temperature, this IGBT can function effectively in cold environments without performance degradation.

Maximum Collector Current (IC):

140 A - The high collector current rating allows this IGBT to handle high current loads, making it suitable for power-hungry applications.

Maximum Gate-Emitter Threshold Voltage:

6.5 V - The gate-emitter threshold voltage ensures precise control over the switching characteristics of the IGBT, resulting in efficient power management.

Terminal Position:

UPPER - The upper terminal position simplifies circuit layout and connectivity, making installation and maintenance easier for this IGBT.

Case Connection:

ISOLATED - The isolated case connection ensures electrical safety and protection against short circuits, making this IGBT a reliable choice for demanding applications.

Nominal Turn On Time (ton):

190 ns - The fast turn-on time of this IGBT allows for quick response in power control applications, enhancing overall system performance.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) TDB6HK180N16RRBOSA1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Additional Features:

UL RECOGNIZED

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Configuration:

Maximum Gate-Emitter Threshold Voltage:

6.5 V

Maximum Gate-Emitter Voltage:

20 V

JESD-30 Code:

R-XUFM-X29

No. of Elements:

1

No. of Terminals:

29

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

410 ns

Nominal Turn On Time (ton):

190 ns

Maximum VCEsat:

2.2 V

Trade Compliance

TDB6HK180N16RRBOSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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