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STGW45HF60WDI

STMicroelectronics

STGW45HF60WDI by STMicroelectronics

STGW45HF60WDI by STMicroelectronics is an N-CHANNEL IGBT with 600V max collector-emitter voltage, 70A max collector current, and 250W max power dissipation. Ideal for power control applications requiring a single transistor with built-in diode in a rectangular package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,347 parts In-Stock

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6,347

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Digiode

USA . 3,882 parts In-Stock

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3,882

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Anansix

USA . 2,645 parts In-Stock

1+ parts

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2,645

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Nova Conductors

Japan . 870 parts In-Stock

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870

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ComSIT Distribution GmbH

Germany . 120 parts In-Stock

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120

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 461 parts In-Stock

1+ parts

$1.276

100+ parts

-

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$1.148

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461

$1.276

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$1.148

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MKK Technologies

India . 1,518 parts In-Stock

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$2.400

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1,518

$2.400

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DigiPath Technology Company

USA . 1,518 parts In-Stock

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$2.400

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1,518

$2.400

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AZTECH Wire

Italy . 283 parts In-Stock

1+ parts

$9.992

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283

$9.992

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Ampacity Inc.

Singapore . 158 parts In-Stock

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$37.050

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158

$37.050

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Perfect Parts

USA . 8,795 parts In-Stock

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8,795

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Authorized Procurement Solutions

USA . 6,000 parts In-Stock

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6,000

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Continental Prestige Electronics

USA . 5,711 parts In-Stock

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Argo Parts USA

USA . 4,594 parts In-Stock

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Corphita

USA . 2,229 parts In-Stock

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2,229

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Parana Technologies

USA . 2,111 parts In-Stock

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$1.526

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2,111

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$1.526

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Bastille Electronics

Australia . 96 parts In-Stock

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96

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Assy Fe

Spain . 28 parts In-Stock

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28

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Overview

Elevate your power control applications with the STGW45HF60WDI by STMicroelectronics, a high-quality Insulated Gate Bipolar Transistor (IGBT) that guarantees reliability and efficiency. With its N-CHANNEL configuration and built-in diode, this transistor offers seamless integration and optimum performance. Whether you're looking to enhance industrial machinery or renewable energy systems, this product's maximum power dissipation of 250W and maximum collector-emitter voltage of 600V ensure smooth operations even in the most demanding environments. Trust STMicroelectronics to deliver cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for the transistor, ensuring its durability and reliability.

Polarity or Channel Type: N-CHANNEL

Allows for efficient power control and management in electronic circuits.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies circuit design and saves space by integrating a diode within the transistor package.

Transistor Application: POWER CONTROL

Specifically designed for power control applications, ensuring optimal performance in such scenarios.

Package Shape: RECTANGULAR

Offers versatility in mounting options and fits well in various circuit layouts.

Terminal Form: THROUGH-HOLE

Facilitates easy and secure PCB mounting, enhancing the overall reliability of the product.

Maximum Power Dissipation (Abs): 250 W

Can handle high power levels effectively, making it suitable for demanding applications.

Package Style (Meter): FLANGE MOUNT

Enables easy attachment to heat sinks for efficient heat dissipation, ideal for high-power operations.

Maximum Operating Temperature: 150 °C

Can operate efficiently at high temperatures, ensuring reliability even in challenging conditions.

Maximum Collector-Emitter Voltage: 600 V

Capable of withstanding high voltages, suitable for power control applications requiring such levels.

Transistor Element Material: SILICON

Known for its reliability and performance, ensuring stable operation over an extended period.

Maximum Gate-Emitter Voltage: 20 V

Provides a margin of safety for the gate control, preventing damage from voltage spikes or transients.

Maximum Collector Current (IC): 70 A

Can handle high currents efficiently, suitable for power control applications with substantial current requirements.

Maximum Gate-Emitter Threshold Voltage: 5.75 V

Allows for precise gate control, ensuring optimal performance in power management applications.

Terminal Finish: Matte Tin (Sn)

Provides a reliable and corrosion-resistant terminal finish, ensuring a secure electrical connection.

Terminal Position: SINGLE

Simplifies PCB layout and connection, making installation and maintenance easier.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) STGW45HF60WDI attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from STMicroelectronics

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Maximum Gate-Emitter Threshold Voltage:

5.75 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Trade Compliance

STGW45HF60WDI Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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