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STGW25H120DF2

STMicroelectronics

STGW25H120DF2 by STMicroelectronics

STGW25H120DF2 by STMicroelectronics is an N-CHANNEL IGBT with a max VCEsat of 2.6V and a max collector-emitter voltage of 1200V. It is used for power control applications, with a nominal turn off time of 339ns.

Median Price

$4.760

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 60 parts In-Stock

1+ parts

$1.700

100+ parts

$1.675

1k+ parts

-

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60

$1.700

$1.675

-

-

Farnell

UK . 120 parts In-Stock

1+ parts

$3.080

100+ parts

$2.390

1k+ parts

$1.920

10k+ parts

-

120

$3.080

$2.390

$1.920

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Mouser Electronics

USA . 1,313 parts In-Stock

1+ parts

$4.760

100+ parts

$1.960

1k+ parts

-

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1,313

$4.760

$1.960

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DigiKey

USA . 298 parts In-Stock

1+ parts

$4.760

100+ parts

$2.652

1k+ parts

$1.846

10k+ parts

$1.713

298

$4.760

$2.652

$1.846

$1.713

Newark

USA . 118 parts In-Stock

1+ parts

$4.960

100+ parts

$3.760

1k+ parts

$2.900

10k+ parts

-

118

$4.960

$3.760

$2.900

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Chip1Stop

Japan . 60 parts In-Stock

1+ parts

$7.910

100+ parts

$3.990

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-

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60

$7.910

$3.990

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Avnet

USA . 600 parts In-Stock

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600

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Verical

USA . 60 parts In-Stock

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-

100+ parts

$1.679

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60

-

$1.679

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,438 parts In-Stock

1+ parts

$2.951

100+ parts

-

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3,438

$2.951

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Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$4.230

100+ parts

-

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10

$4.230

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Vyrian

USA . 4,902 parts In-Stock

1+ parts

-

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4,902

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Anansix

USA . 1,978 parts In-Stock

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1,978

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 193 parts In-Stock

1+ parts

$0.460

100+ parts

-

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193

$0.460

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IDEA Electronic Components Group

UK . 1,214 parts In-Stock

1+ parts

$0.636

100+ parts

-

1k+ parts

$0.572

10k+ parts

-

1,214

$0.636

-

$0.572

-

MKK Technologies

India . 1,323 parts In-Stock

1+ parts

$1.195

100+ parts

-

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1,323

$1.195

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DigiPath Technology Company

USA . 1,323 parts In-Stock

1+ parts

$1.195

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-

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1,323

$1.195

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Semicontronic

India . 36 parts In-Stock

1+ parts

$1.430

100+ parts

$1.394

1k+ parts

$1.387

10k+ parts

-

36

$1.430

$1.394

$1.387

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Corohmni

South Africa . 96 parts In-Stock

1+ parts

$1.990

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-

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96

$1.990

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Corphita

USA . 1,333 parts In-Stock

1+ parts

$2.795

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1,333

$2.795

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Ampacity Inc.

Singapore . 218 parts In-Stock

1+ parts

$3.110

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218

$3.110

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Aranea Global

USA . 1,000 parts In-Stock

1+ parts

$4.145

100+ parts

-

1k+ parts

$3.980

10k+ parts

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1,000

$4.145

-

$3.980

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Argo Parts USA

USA . 2,228 parts In-Stock

1+ parts

$4.230

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2,228

$4.230

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Continental Prestige Electronics

USA . 1,293 parts In-Stock

1+ parts

$4.230

100+ parts

-

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$4.145

1,293

$4.230

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$4.145

Component Stockers USA

USA . 561 parts In-Stock

1+ parts

$6.090

100+ parts

$4.360

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561

$6.090

$4.360

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Microchip USA

USA . 6,909 parts In-Stock

1+ parts

$18.144

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6,909

$18.144

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Lixinc

USA . 9,217 parts In-Stock

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9,217

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Parana Technologies

USA . 854 parts In-Stock

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$0.760

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854

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$0.760

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Perfect Parts

USA . 605 parts In-Stock

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605

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Glotronic Ltd.

UK . 48 parts In-Stock

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48

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Overview

Discover the STGW25H120DF2 by STMicroelectronics, a high-quality Insulated Gate Bipolar Transistor (IGBT) that offers unbeatable value and benefits. With its N-CHANNEL polarity and built-in diode, this powerful transistor is perfect for power control applications. Its maximum VCEsat of 2.6 V ensures efficient performance, while the rectangular package shape and through-hole terminals make installation a breeze. Whether you're in the automotive, industrial, or consumer electronics industry, the STGW25H120DF2 delivers exceptional power and reliability. Trust in STMicroelectronics' expertise and experience to meet all your IGBT needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy packaging provides durability and protection for the IGBT, ensuring a longer lifespan.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs typically have lower conduction losses and higher efficiency compared to P-channel IGBTs.

Configuration: SINGLE WITH BUILT-IN DIODE

Built-in diode allows for easy implementation of reverse polarity protection and simplifies circuit design.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, ensuring high performance and reliability in controlling power circuits.

Maximum VCEsat: 2.6 V

Low VCEsat minimizes power dissipation and heat generation, leading to improved efficiency in power control.

Package Shape: RECTANGULAR

Rectangular shape allows for easy mounting and installation in various electronic devices and systems.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide secure connections and mechanical stability, suitable for industrial applications.

Nominal Turn Off Time (toff): 339 ns

Fast turn-off time allows for precise control and switching of power signals, reducing switching losses in the circuit.

No. of Terminals: 3

3 terminals provide necessary connections for gate, collector, and emitter, enabling proper functioning of the IGBT in the circuit.

Maximum Power Dissipation (Abs): 375 W

High power dissipation capacity ensures the IGBT can handle heavy loads and power levels without overheating.

Package Style (Meter): FLANGE MOUNT

Flange mount package style allows for easy mounting on heat sinks and provides efficient heat dissipation for thermal management.

Maximum Operating Temperature: 175 °C

High maximum operating temperature range ensures the IGBT can operate reliably in harsh environmental conditions without performance degradation.

Maximum Collector-Emitter Voltage: 1200 V

High maximum collector-emitter voltage rating enables the IGBT to handle high voltage levels in power circuits, ensuring safety and reliability.

Transistor Element Material: SILICON

Silicon material provides high electrical conductivity and temperature stability, making the IGBT suitable for power control applications.

Maximum Gate-Emitter Voltage: 20 V

High maximum gate-emitter voltage rating allows for robust gate control signals, ensuring proper switching and operation of the IGBT.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature range allows the IGBT to function effectively in cold environments without performance issues.

Maximum Collector Current (IC): 50 A

High maximum collector current rating enables the IGBT to handle large current loads in power circuits, ensuring efficient power control.

Maximum Gate-Emitter Threshold Voltage: 7 V

A low gate-emitter threshold voltage ensures efficient switching and control of the IGBT, reducing power losses in the circuit.

Terminal Finish: MATTE TIN

Matte tin finish provides corrosion resistance and ensures reliable electrical connections for long-term performance.

Terminal Position: SINGLE

Single terminal position simplifies installation and connection of the IGBT in the circuit, making it user-friendly for assembly and maintenance.

Nominal Turn On Time (ton): 41 ns

Fast turn-on time allows for quick response and switching of power signals, improving the efficiency and performance of the IGBT in power control applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) STGW25H120DF2 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from STMicroelectronics

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Maximum Gate-Emitter Threshold Voltage:

7 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

339 ns

Nominal Turn On Time (ton):

41 ns

Maximum VCEsat:

2.6 V

Trade Compliance

STGW25H120DF2 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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