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AUIRG4BC30SSTRL

Infineon Technologies

AUIRG4BC30SSTRL by Infineon Technologies

AUIRG4BC30SSTRL by Infineon Technologies is an N-CHANNEL IGBT transistor with a max collector-emitter voltage of 600V and a max gate-emitter voltage of 20V. It has a single configuration, suitable for power control applications, with a max power dissipation of 100W. This surface-mount device has a rectangular package shape and GULL WING terminals, making it ideal for high-power electronic systems.

Median Price

$4.810

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 698 parts In-Stock

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$4.810

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Mouser Electronics

USA . 614 parts In-Stock

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$6.980

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$4.990

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$3.960

10k+ parts

$3.960

614

$6.980

$4.990

$3.960

$3.960

Rochester

USA . 6,930 parts In-Stock

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-

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$3.640

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$3.260

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$3.060

6,930

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$3.640

$3.260

$3.060

Verical

USA . 6,400 parts In-Stock

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$4.550

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$4.075

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$3.825

6,400

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$4.550

$4.075

$3.825

RS (Exports)

UK . 725 parts In-Stock

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$5.686

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Nova Conductors

Japan . 36 parts In-Stock

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$1.738

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$1.738

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Digiode

USA . 848 parts In-Stock

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$3.838

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848

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VNN

France . 22,123 parts In-Stock

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Vyrian

USA . 239 parts In-Stock

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Distributors (Availability)

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Modulus Dynamics

Lithuania . 7,154 parts In-Stock

1+ parts

$0.762

100+ parts

$0.732

1k+ parts

$0.701

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-

7,154

$0.762

$0.732

$0.701

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Argo Parts USA

USA . 4,003 parts In-Stock

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$1.738

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$1.738

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Netroflash

USA . 100 parts In-Stock

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$1.738

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100

$1.738

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Ampacity Inc.

Singapore . 580 parts In-Stock

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$3.150

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Corphita

USA . 228 parts In-Stock

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$3.636

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$3.636

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Continental Prestige Electronics

USA . 153 parts In-Stock

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$6.560

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$4.280

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153

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Microchip USA

USA . 2,608 parts In-Stock

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$14.507

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 14,801 parts In-Stock

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14,801

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Perfect Parts

USA . 327 parts In-Stock

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327

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Overview

Unleash the power of the AUIRG4BC30SSTRL by Infineon Technologies, a top-quality Insulated Gate Bipolar Transistor designed for high-performance power control applications. With Infineon's reputation for excellence in semiconductor technology, this N-CHANNEL transistor offers unmatched reliability and efficiency. Ideal for surface mount applications, this single configuration transistor boasts a fast fall time and a high collector-emitter voltage rating. Elevate your projects with the AUIRG4BC30SSTRL, delivering exceptional value and performance for all your power control needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides good insulation and protection for the internal components of the IGBT.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs typically have lower on-state resistance and higher efficiency compared to P-channel IGBTs.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, ensuring efficient and reliable performance.

Maximum Fall Time (tf): 590 ns

Fast fall time allows for quick switching, reducing power losses and improving overall efficiency.

Maximum Power Dissipation (Abs): 100 W

High power dissipation rating allows the IGBT to handle large amounts of power without overheating.

Maximum Collector-Emitter Voltage: 600 V

High collector-emitter voltage rating makes this IGBT suitable for high-power applications.

Maximum Collector Current (IC): 34 A

High collector current rating allows the IGBT to handle large current loads without issues.

Nominal Turn On Time (ton): 40 ns

Fast turn-on time ensures quick response and efficient operation in power control applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) AUIRG4BC30SSTRL attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Configuration:

Maximum Fall Time (tf):

590 ns

Maximum Gate-Emitter Threshold Voltage:

6 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

YES

Terminal Finish:

MATTE TIN OVER NICKEL

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

1550 ns

Nominal Turn On Time (ton):

40 ns

Trade Compliance

AUIRG4BC30SSTRL Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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