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FP50R07N2E4B11BOSA1

Infineon Technologies

FP50R07N2E4B11BOSA1 by Infineon Technologies

FP50R07N2E4B11BOSA1 by Infineon Technologies is an N-CHANNEL IGBT with 7 elements, 31 terminals, and a max IC of 70 A. It has a VCE of 650 V and toff of 265 ns. Ideal for power control applications due to its fast ton of 43 ns and UL approval.

Median Price

$69.322

Lifecycle Status

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9

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1k+

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Rochester

USA . 210 parts In-Stock

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-

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$61.620

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$55.130

10k+ parts

$51.890

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$61.620

$55.130

$51.890

DigiKey

USA . 210 parts In-Stock

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Verical

USA . 100 parts In-Stock

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$77.025

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$68.912

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$64.862

100

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$77.025

$68.912

$64.862

Distributors (In-Stock)

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Bristol Electronics

USA . 19 parts In-Stock

1+ parts

$56.930

100+ parts

$52.546

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$56.930

$52.546

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Digiode

USA . 468 parts In-Stock

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$65.208

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468

$65.208

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Nova Conductors

Japan . 31 parts In-Stock

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$70.588

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Vyrian

USA . 5,138 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 19 parts In-Stock

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Dan-Mar Components

USA . 19 parts In-Stock

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Modulus Dynamics

Lithuania . 15,674 parts In-Stock

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$0.488

100+ parts

$0.468

1k+ parts

$0.449

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15,674

$0.488

$0.468

$0.449

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Corohmni

South Africa . 525 parts In-Stock

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$0.789

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525

$0.789

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Advanced Electronics

New Zealand . 500 parts In-Stock

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$0.805

100+ parts

$0.733

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$0.660

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500

$0.805

$0.733

$0.660

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Aztec Data Supply Inc.

USA . 2,920 parts In-Stock

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$1.230

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$1.230

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AZTECH Wire

Italy . 501 parts In-Stock

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$15.475

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$15.475

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Andel Nordic

Denmark . 4,902 parts In-Stock

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$38.600

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$27.017

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$27.017

4,902

$38.600

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$27.017

$27.017

Ampacity Inc.

Singapore . 137 parts In-Stock

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$58.340

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Corphita

USA . 267 parts In-Stock

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$61.776

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Component Stockers USA

USA . 13 parts In-Stock

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$69.450

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$69.450

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Continental Prestige Electronics

USA . 4,435 parts In-Stock

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$70.588

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$69.176

4,435

$70.588

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$69.176

Semicontronic

India . 137 parts In-Stock

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$126.980

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$123.806

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$123.171

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$126.980

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$123.171

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QUARKTWIN TECHNOLOGY LTD

USA . 9,896 parts In-Stock

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Microchip USA

USA . 8,133 parts In-Stock

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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Argo Parts USA

USA . 700 parts In-Stock

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Overview

Elevate your power control capabilities with the FP50R07N2E4B11BOSA1 from Infineon Technologies. As a leading manufacturer in the industry, Infineon delivers top-notch quality and reliability in their Insulated Gate Bipolar Transistors (IGBT). With a maximum collector-emitter voltage of 650V and a nominal turn off time of 265ns, this N-channel transistor is perfect for applications requiring efficient power control. Experience the benefits of fast turn on/off times, high collector current capacity, and UL approval for added peace of mind. Upgrade to the FP50R07N2E4B11BOSA1 and unlock the full potential of your power systems.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

Having an N-channel polarity allows for high efficiency and fast switching speeds, making this IGBT a suitable choice for power control applications.

Configuration: COMPLEX

The complex configuration of this IGBT enables it to handle multiple functions simultaneously, offering versatility in various power control scenarios.

Transistor Application: POWER CONTROL

Specifically designed for power control applications, this IGBT provides reliable and precise control over power consumption, making it ideal for industrial use.

Package Shape: RECTANGULAR

The rectangular package shape of this IGBT ensures easy installation and efficient thermal management, contributing to its overall performance and reliability.

No. of Elements: 7

With 7 elements, this IGBT offers enhanced power handling capabilities and improved reliability in high-power applications.

Nominal Turn Off Time (toff): 265 ns

The fast turn-off time of 265 ns enables quick and efficient power control, reducing switching losses and improving overall system efficiency.

No. of Terminals: 31

The 31 terminals provide ample connectivity options and flexibility in system design, allowing for easy integration into various power control circuits.

Package Style (Meter): FLANGE MOUNT

The flange mount package style offers secure mounting and reliable connection, ensuring stability and durability in demanding environments.

Maximum Collector-Emitter Voltage: 650 V

With a high maximum collector-emitter voltage of 650 V, this IGBT can handle high voltage levels with ease, making it suitable for a wide range of power control applications.

Transistor Element Material: SILICON

Made with silicon, a reliable and durable material, this IGBT ensures long-term performance and stability in power control applications.

Maximum Collector Current (IC): 70 A

With a high maximum collector current of 70 A, this IGBT can handle large power loads effectively, making it ideal for high-power industrial applications.

Terminal Position: UPPER

The upper terminal position allows for easy and efficient connection in power control systems, ensuring quick installation and reliable operation.

Case Connection: ISOLATED

The isolated case connection provides enhanced safety and protection against electrical hazards, making this IGBT a reliable choice in high-voltage applications.

Nominal Turn On Time (ton): 43 ns

The fast turn-on time of 43 ns ensures quick response and precise control in power switching operations, improving overall system performance.

Reference Standard: UL APPROVED

Being UL approved guarantees that this IGBT meets rigorous safety and performance standards, ensuring reliability and compliance in various industrial applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FP50R07N2E4B11BOSA1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

650 V

Configuration:

JESD-30 Code:

R-XUFM-X31

No. of Elements:

7

No. of Terminals:

31

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Reference Standard:

UL APPROVED

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

265 ns

Nominal Turn On Time (ton):

43 ns

Trade Compliance

FP50R07N2E4B11BOSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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