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FP50R12KS4CBOSA1

Infineon Technologies

FP50R12KS4CBOSA1 by Infineon Technologies

Infineon Technologies' FP50R12KS4CBOSA1 is an N-CHANNEL IGBT with 7 elements, max. collector current of 70A, and max. collector-emitter voltage of 1200V. It has a nominal turn on time of 110ns and turn off time of 460ns. Ideal for high-power applications requiring fast switching capabilities in industrial settings.

Median Price

$228.628

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

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Rochester

USA . 156 parts In-Stock

1+ parts

$210.230

100+ parts

$197.620

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$185.000

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156

$210.230

$197.620

$185.000

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Verical

USA . 195 parts In-Stock

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$247.025

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$231.250

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195

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$247.025

$231.250

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Distributors (In-Stock)

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Digiode

USA . 262 parts In-Stock

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$232.465

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262

$232.465

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Galco

USA . 10 parts In-Stock

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$255.320

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10

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Vyrian

USA . 2,029 parts In-Stock

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Nova Conductors

Japan . 36 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 301 parts In-Stock

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$1.074

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301

$1.074

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Modulus Dynamics

Lithuania . 18,447 parts In-Stock

1+ parts

$1.879

100+ parts

$1.804

1k+ parts

$1.729

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18,447

$1.879

$1.804

$1.729

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AZTECH Wire

Italy . 1,116 parts In-Stock

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$11.710

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Ampacity Inc.

Singapore . 207 parts In-Stock

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$207.990

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Corphita

USA . 796 parts In-Stock

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$220.230

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Component Stockers USA

USA . 14 parts In-Stock

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$253.220

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QUARKTWIN TECHNOLOGY LTD

USA . 6,692 parts In-Stock

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Microchip USA

USA . 5,501 parts In-Stock

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Continental Prestige Electronics

USA . 2,972 parts In-Stock

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Argo Parts USA

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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Aranea Global

USA . 50 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the FP50R12KS4CBOSA1 from Infineon Technologies. As a leader in the industry, Infineon delivers top-quality Insulated Gate Bipolar Transistors (IGBT) that are known for their reliability and performance. Whether you're looking to optimize your power systems or enhance motor control applications, this N-CHANNEL transistor offers unmatched value, benefits, and advantages. With a maximum collector-emitter voltage of 1200V and a nominal turn-off time of 460ns, the FP50R12KS4CBOSA1 is the perfect choice for demanding applications. Experience the difference with Infineon Technologies.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs typically have lower on-state voltage drop, providing higher efficiency and better performance in high-power applications.

Configuration: COMPLEX

Complex configuration allows for better control over switching and power flow, making the IGBT suitable for complex power electronics systems.

Package Shape: RECTANGULAR

Rectangular package shape makes it easier to mount and integrate the IGBT into various electronic systems.

Nominal Turn Off Time (toff): 460 ns

Fast turn-off time of 460 ns ensures efficient switching and reduces power losses in high-frequency applications.

No. of Terminals: 35

More terminals allow for more connections and flexibility in circuit design, making the IGBT suitable for complex applications.

Maximum Operating Temperature: 150 °C

High maximum operating temperature of 150°C ensures reliable performance even in harsh environments.

Maximum Collector-Emitter Voltage: 1200 V

High maximum collector-emitter voltage of 1200 V allows for use in high-power applications and ensures robust performance.

Transistor Element Material: SILICON

Silicon is a commonly used material for transistor elements due to its high efficiency and reliability.

Maximum Collector Current (IC): 70 A

High maximum collector current of 70 A enables the IGBT to handle high-power loads with ease.

Terminal Position: UPPER

Upper terminal position allows for easier mounting and connection of the IGBT in electronic systems.

Case Connection: ISOLATED

Isolated case connection helps in minimizing interference and improves safety in high-voltage applications.

Nominal Turn On Time (ton): 110 ns

Fast turn-on time of 110 ns ensures quick response and efficient switching in high-power applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FP50R12KS4CBOSA1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Configuration:

JESD-30 Code:

R-XUFM-X35

No. of Elements:

7

No. of Terminals:

35

Maximum Operating Temperature:

150 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

460 ns

Nominal Turn On Time (ton):

110 ns

Trade Compliance

FP50R12KS4CBOSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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