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FP50R06W2E3B11BOMA1

Infineon Technologies

FP50R06W2E3B11BOMA1 by Infineon Technologies

FP50R06W2E3B11BOMA1 by Infineon Technologies is an N-CHANNEL IGBT with 7 elements, 600V max collector-emitter voltage, and 65A max collector current. It has a complex configuration for power control applications, featuring a nominal turn off time of 355ns and turn on time of 45ns. The transistor's rectangular package style with flange mount makes it suitable for high-power industrial systems.

Median Price

$29.809

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

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DigiKey

USA . 2,196 parts In-Stock

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Rochester

USA . 1,953 parts In-Stock

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$28.540

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$25.530

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$24.030

1,953

-

$28.540

$25.530

$24.030

Verical

USA . 1,946 parts In-Stock

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-

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$35.675

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$31.913

10k+ parts

$30.038

1,946

-

$35.675

$31.913

$30.038

Avnet

USA . 106 parts In-Stock

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$29.809

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$28.945

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106

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$29.809

$28.945

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Distributors (In-Stock)

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Digiode

USA . 128 parts In-Stock

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$34.210

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128

$34.210

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Vyrian

USA . 996 parts In-Stock

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$36.010

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996

$36.010

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Distributors (Availability)

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Modulus Dynamics

Lithuania . 14,024 parts In-Stock

1+ parts

$0.612

100+ parts

$0.588

1k+ parts

$0.563

10k+ parts

-

14,024

$0.612

$0.588

$0.563

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Andel Nordic

Denmark . 5,231 parts In-Stock

1+ parts

$18.370

100+ parts

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$12.860

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$12.860

5,231

$18.370

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$12.860

$12.860

Corphita

USA . 647 parts In-Stock

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$32.409

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647

$32.409

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Microchip USA

USA . 3,958 parts In-Stock

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$107.732

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3,958

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Native Components

USA . 572 parts In-Stock

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Northwest PG Solutions

USA . 208 parts In-Stock

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Perfect Parts

USA . 34 parts In-Stock

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Overview

Unleash the power of innovation with the FP50R06W2E3B11BOMA1 by Infineon Technologies. As a leading manufacturer in the industry, Infineon delivers top-quality Insulated Gate Bipolar Transistors (IGBT) that are perfect for power control applications. With a complex configuration and 7 elements, this N-CHANNEL transistor offers unmatched performance and reliability. Featuring a maximum collector-emitter voltage of 600V and a nominal turn off time of 355ns, this product provides customers with the ultimate solution for their power management needs. Upgrade your systems today with the FP50R06W2E3B11BOMA1 and experience the difference that superior technology can make.

Feature Benefit Bullets

Polarity/Channel Type: N-CHANNEL

N-channel IGBTs typically have lower conduction losses and faster switching speed compared to P-channel IGBTs, making them more efficient for power control applications.

Configuration: COMPLEX

Complex configuration allows for more advanced control and switching capabilities, making this IGBT suitable for complex power control needs.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, ensuring reliable and efficient operation in controlling high power loads.

Package Shape: RECTANGULAR

Rectangular package shape provides easy mounting and integration into power electronics systems.

No. of Elements: 7

Having 7 elements allows for more precise control and distribution of power, making this IGBT suitable for multi-channel power applications.

Nominal Turn Off Time (toff): 355 ns

Fast turn-off time of 355 ns ensures efficient switching and reduced power losses in power control systems.

No. of Terminals: 23

Having 23 terminals provides flexibility in connecting the IGBT to external circuits and components, enabling versatile power control configurations.

Maximum Collector-Emitter Voltage: 600 V

With a maximum voltage of 600 V, this IGBT can handle high voltage applications, making it suitable for a wide range of power control scenarios.

Transistor Element Material: SILICON

Silicon-based IGBTs offer high performance, reliability, and temperature stability, ideal for power control applications where efficiency is crucial.

Maximum Collector Current (IC): 65 A

High collector current rating of 65 A allows for handling substantial power loads, suitable for demanding power control requirements.

Terminal Position: UPPER

Upper terminal position simplifies circuit layout and installation, providing ease of use and maintenance for power control applications.

Case Connection: ISOLATED

Isolated case connection ensures safe operation by preventing short circuits and improving system reliability in power control applications.

Nominal Turn On Time (ton): 45 ns

Fast turn-on time of 45 ns results in quick response and high switching speed, essential for precise power control in dynamic applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FP50R06W2E3B11BOMA1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Configuration:

JESD-30 Code:

R-XUFM-X23

No. of Elements:

7

No. of Terminals:

23

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

355 ns

Nominal Turn On Time (ton):

45 ns

Trade Compliance

FP50R06W2E3B11BOMA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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