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FS150R12KT3BOSA1

Infineon Technologies

FS150R12KT3BOSA1 by Infineon Technologies

Infineon FS150R12KT3BOSA1 is a N-CHANNEL IGBT with 6 elements, built-in diode, and thermistor. It has a max voltage of 1200V, current rating of 200A, and turn-off time of 610ns. Ideal for high-power applications requiring fast switching such as motor drives and power supplies.

Median Price

$143.520

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

< 1k

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 47 parts In-Stock

1+ parts

$103.150

100+ parts

-

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47

$103.150

-

-

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Newark

USA . 55 parts In-Stock

1+ parts

$114.020

100+ parts

-

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-

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55

$114.020

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-

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DigiKey

USA . 8 parts In-Stock

1+ parts

$131.040

100+ parts

-

1k+ parts

-

10k+ parts

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8

$131.040

-

-

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Verical

USA . 10 parts In-Stock

1+ parts

$156.000

100+ parts

-

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10

$156.000

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Chip1Stop

Japan . 10 parts In-Stock

1+ parts

$156.000

100+ parts

$155.000

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-

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10

$156.000

$155.000

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Element14

Singapore . 47 parts In-Stock

1+ parts

$371.860

100+ parts

-

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47

$371.860

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RS (Exports)

UK . 10 parts In-Stock

1+ parts

$384.982

100+ parts

-

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-

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10

$384.982

-

-

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Rochester

USA . 4 parts In-Stock

1+ parts

-

100+ parts

$113.740

1k+ parts

$101.770

10k+ parts

$95.780

4

-

$113.740

$101.770

$95.780

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Tomark Electronics Ltd

UK . 7 parts In-Stock

1+ parts

$61.330

100+ parts

-

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7

$61.330

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Digiode

USA . 462 parts In-Stock

1+ parts

$104.443

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-

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462

$104.443

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Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$290.780

100+ parts

-

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100

$290.780

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TodayComponents

USA . 100 parts In-Stock

1+ parts

$345.120

100+ parts

$311.960

1k+ parts

-

10k+ parts

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100

$345.120

$311.960

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Vyrian

USA . 26 parts In-Stock

1+ parts

-

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26

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Rutronik

Germany . 20 parts In-Stock

1+ parts

-

100+ parts

$153.050

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20

-

$153.050

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 19,352 parts In-Stock

1+ parts

$0.538

100+ parts

$0.516

1k+ parts

$0.495

10k+ parts

-

19,352

$0.538

$0.516

$0.495

-

Corohmni

South Africa . 513 parts In-Stock

1+ parts

$1.047

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513

$1.047

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Aztec Data Supply Inc.

USA . 60 parts In-Stock

1+ parts

$1.657

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-

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60

$1.657

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AZTECH Wire

Italy . 691 parts In-Stock

1+ parts

$9.230

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691

$9.230

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Ampacity Inc.

Singapore . 26 parts In-Stock

1+ parts

$93.450

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26

$93.450

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Semicontronic

India . 25 parts In-Stock

1+ parts

$93.450

100+ parts

$91.114

1k+ parts

$90.646

10k+ parts

-

25

$93.450

$91.114

$90.646

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Corphita

USA . 257 parts In-Stock

1+ parts

$98.946

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257

$98.946

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Continental Prestige Electronics

USA . 2 parts In-Stock

1+ parts

$203.940

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2

$203.940

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Aranea Global

USA . 50 parts In-Stock

1+ parts

$284.964

100+ parts

-

1k+ parts

$273.566

10k+ parts

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50

$284.964

-

$273.566

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Microchip USA

USA . 6,284 parts In-Stock

1+ parts

$475.965

100+ parts

-

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6,284

$475.965

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Argo Parts USA

USA . 4,544 parts In-Stock

1+ parts

-

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4,544

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Perfect Parts

USA . 22 parts In-Stock

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22

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Overview

Unlock unparalleled performance with the FS150R12KT3BOSA1 by Infineon Technologies. As a leading manufacturer in insulated gate bipolar transistors, Infineon ensures top-notch quality and reliability in every product. This N-channel IGBT features a bridge configuration with 6 elements, built-in diode, and thermistor for seamless integration. With a maximum collector-emitter voltage of 1200V and a nominal turn off time of 610 ns, this transistor caters to a wide range of applications, from industrial automation to renewable energy systems. Elevate your projects with the unmatched value and benefits that the FS150R12KT3BOSA1 offers.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL IGBTs generally have lower conduction losses compared to P-CHANNEL types, making them more efficient for high-power applications.

Configuration: BRIDGE, 6 ELEMENTS WITH BUILT-IN DIODE AND THERMISTOR

Bridge configuration with built-in diode and thermistor provides easier integration and better protection against high voltage and temperature variations.

Package Shape: RECTANGULAR

Rectangular package shape allows for efficient mounting and space-saving in electronic systems.

Nominal Turn Off Time (toff): 610 ns

Fast turn-off time helps in reducing switching losses and improving overall efficiency of the system.

Maximum Collector-Emitter Voltage: 1200 V

High maximum voltage rating allows for operation in high voltage applications without risk of component failure.

Maximum Collector Current (IC): 200 A

High collector current rating enables the IGBT to handle large amounts of current without saturation, making it suitable for high-power applications.

Nominal Turn On Time (ton): 340 ns

Fast turn-on time ensures quick response of the IGBT, reducing power losses and improving overall system performance.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FS150R12KT3BOSA1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

JESD-30 Code:

R-XUFM-X35

No. of Elements:

6

No. of Terminals:

35

Maximum Operating Temperature:

150 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

610 ns

Nominal Turn On Time (ton):

340 ns

Trade Compliance

FS150R12KT3BOSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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