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IRG4RC10SDPBF

Infineon Technologies

IRG4RC10SDPBF by Infineon Technologies

IRG4RC10SDPBF by Infineon Technologies is an N-CHANNEL IGBT with a max Collector-Emitter Voltage of 600V and Max Collector Current of 14A. It is designed for POWER CONTROL applications, featuring a small outline package style and built-in diode for efficient performance in power electronics systems.

Median Price

$0.999

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 64 parts In-Stock

1+ parts

-

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$0.999

1k+ parts

$0.829

10k+ parts

$0.739

64

-

$0.999

$0.829

$0.739

Distributors (In-Stock)

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Digiode

USA . 703 parts In-Stock

1+ parts

$0.778

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-

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703

$0.778

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Chip Stock

USA . 22,694 parts In-Stock

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22,694

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Ashlea Components Ltd

UK . 1,134 parts In-Stock

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Fibra_Brandt Electronic GMBH

Germany . 258 parts In-Stock

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258

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Vyrian

USA . 64 parts In-Stock

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64

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 5,084 parts In-Stock

1+ parts

$0.615

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-

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5,084

$0.615

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Ampacity Inc.

Singapore . 64 parts In-Stock

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$0.700

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64

$0.700

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Semicontronic

India . 64 parts In-Stock

1+ parts

$0.700

100+ parts

$0.682

1k+ parts

$0.679

10k+ parts

-

64

$0.700

$0.682

$0.679

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Corphita

USA . 585 parts In-Stock

1+ parts

$0.737

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585

$0.737

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Modulus Dynamics

Lithuania . 15,545 parts In-Stock

1+ parts

$0.873

100+ parts

$0.838

1k+ parts

$0.803

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-

15,545

$0.873

$0.838

$0.803

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Corohmni

South Africa . 14 parts In-Stock

1+ parts

$0.873

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14

$0.873

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Microchip USA

USA . 8,502 parts In-Stock

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$5.135

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8,502

$5.135

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AZTECH Wire

Italy . 264 parts In-Stock

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$11.713

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264

$11.713

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Perfect Parts

USA . 27,999 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 20,843 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,385 parts In-Stock

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Continental Prestige Electronics

USA . 5,865 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,923 parts In-Stock

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4,923

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Argo Parts USA

USA . 4,700 parts In-Stock

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4,700

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Bastille Electronics

Australia . 40 parts In-Stock

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40

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Overview

Discover the power of the IRG4RC10SDPBF by Infineon Technologies, a top-quality Insulated Gate Bipolar Transistor designed for efficient power control applications. With a single configuration and built-in diode, this N-channel transistor offers reliable performance and easy surface-mount installation. Experience maximum power dissipation of 38 W and a high collector-emitter voltage of 600 V, making it ideal for a wide range of projects. Trust in Infineon Technologies to deliver cutting-edge technology and superior products that provide value and benefits to customers seeking reliable and high-performance solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation properties and mechanical strength, making the product durable and reliable.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs have lower on-state voltage drop and higher switching speeds compared to P-channel, making them efficient for power control applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Built-in diode allows for easier circuit design and better protection against reverse currents.

Transistor Application: POWER CONTROL

Specifically designed for power control applications, ensuring optimal performance in controlling high power levels.

Maximum Power Dissipation (Abs): 38 W

Can handle high power dissipation levels, suitable for applications requiring power control of up to 38 watts.

Maximum Operating Temperature: 150 °C

Capable of operating at high temperatures, making it suitable for industrial applications where heat dissipation is a concern.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) IRG4RC10SDPBF attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Additional Features:

LOW CONDUCTION LOSS

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Maximum Fall Time (tf):

1080 ns

Maximum Gate-Emitter Threshold Voltage:

6 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-252AA

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

YES

Terminal Finish:

MATTE TIN OVER NICKEL

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

1780 ns

Nominal Turn On Time (ton):

106 ns

Trade Compliance

IRG4RC10SDPBF Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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