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HGT1S10N120BNS

Onsemi

HGT1S10N120BNS by Onsemi

HGT1S10N120BNS by Onsemi is an N-CHANNEL IGBT transistor with a max VCEsat of 4.2V and a max collector-emitter voltage of 1200V. It is designed for motor control applications, featuring a rise time of 15ns and a power dissipation of 298W.

Median Price

$2.470

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 8 parts In-Stock

1+ parts

-

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$2.470

1k+ parts

$2.210

10k+ parts

$2.080

8

-

$2.470

$2.210

$2.080

Distributors (In-Stock)

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Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$2.450

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100

$2.450

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Digiode

USA . 1,505 parts In-Stock

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$2.612

100+ parts

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1,505

$2.612

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Flip Electronics

USA . 800 parts In-Stock

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800

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Pegasus Components GmbH

Germany . 175 parts In-Stock

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175

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Vyrian

USA . 8 parts In-Stock

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8

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Distributors (Availability)

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Corohmni

South Africa . 308 parts In-Stock

1+ parts

$2.401

100+ parts

-

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308

$2.401

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Continental Prestige Electronics

USA . 6,392 parts In-Stock

1+ parts

$2.450

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$2.401

6,392

$2.450

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$2.401

Argo Parts USA

USA . 3,745 parts In-Stock

1+ parts

$2.450

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-

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3,745

$2.450

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Netroflash

USA . 100 parts In-Stock

1+ parts

$2.450

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-

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$2.328

10k+ parts

$2.279

100

$2.450

-

$2.328

$2.279

Corphita

USA . 2,193 parts In-Stock

1+ parts

$2.475

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2,193

$2.475

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Semicontronic

India . 8 parts In-Stock

1+ parts

$5.090

100+ parts

$4.963

1k+ parts

$4.937

10k+ parts

-

8

$5.090

$4.963

$4.937

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AZTECH Wire

Italy . 517 parts In-Stock

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$7.829

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517

$7.829

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 14,238 parts In-Stock

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SupplyDigital Components

Austria . 7,836 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,692 parts In-Stock

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6,692

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Kepictronics

USA . 5,000 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,461 parts In-Stock

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Microchip USA

USA . 3,521 parts In-Stock

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Kulean Microsystems

USA . 2,579 parts In-Stock

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2,579

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Problanco Electronics

Mexico . 2,432 parts In-Stock

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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Assy Fe

Spain . 1,600 parts In-Stock

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Supply Digital

USA . 1,588 parts In-Stock

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Perfect Parts

USA . 1,064 parts In-Stock

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TANS Electronics

Latvia . 507 parts In-Stock

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507

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UHIMA Technologies

Türkiye . 144 parts In-Stock

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144

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Overview

Experience unmatched performance and reliability with the HGT1S10N120BNS by Onsemi, a leading manufacturer in the industry. As an Insulated Gate Bipolar Transistor designed for motor control applications, this product offers superior quality and efficiency. With a maximum collector-emitter voltage of 1200V and a maximum power dissipation of 298W, customers can trust in the durability and effectiveness of this transistor. Say goodbye to costly replacements and hello to seamless operation with the HGT1S10N120BNS.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the transistor, making it suitable for various industrial applications.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs typically have lower on-state voltage drop compared to P-channel types, resulting in higher efficiency.

Maximum Power Dissipation (Abs): 298 W

With a high maximum power dissipation, this IGBT can handle high power applications without overheating.

Maximum Collector-Emitter Voltage: 1200 V

This high voltage rating allows the IGBT to be used in applications that require high voltage switching.

Maximum Collector Current (IC): 35 A

The high maximum collector current rating makes this IGBT suitable for applications that require handling high currents.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) HGT1S10N120BNS attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Additional Features:

LOW CONDUCTION LOSS

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Configuration:

Maximum Fall Time (tf):

200 ns

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Maximum Rise Time (tr):

15 ns

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

MOTOR CONTROL

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

450 ns

Nominal Turn Off Time (toff):

330 ns

Maximum Turn On Time (ton):

40 ns

Nominal Turn On Time (ton):

32 ns

Maximum VCEsat:

4.2 V

Trade Compliance

HGT1S10N120BNS Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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