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HGT1S12N60A4DS

Onsemi

HGT1S12N60A4DS by Onsemi

HGT1S12N60A4DS by Onsemi is an N-CHANNEL IGBT with 600V VCE, 54A IC, and 2.7V VCEsat. Ideal for POWER CONTROL applications, it features a single configuration with built-in diode and operates at temperatures ranging from -55 to 150 °C.

Median Price

$4.132

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Master Electronics

USA . 147 parts In-Stock

1+ parts

$7.700

100+ parts

-

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$2.340

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147

$7.700

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$2.340

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Rochester

USA . 7,126 parts In-Stock

1+ parts

-

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$3.220

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$2.880

10k+ parts

$2.710

7,126

-

$3.220

$2.880

$2.710

Verical

USA . 6,326 parts In-Stock

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$4.025

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$3.600

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6,326

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$4.025

$3.600

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Flip Electronics (Authorized)

USA . 4,000 parts In-Stock

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DigiKey

USA . 2,395 parts In-Stock

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$4.240

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2,395

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$4.240

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Distributors (In-Stock)

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Digiode

USA . 2,577 parts In-Stock

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$3.392

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2,577

$3.392

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Vyrian

USA . 785 parts In-Stock

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$3.570

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785

$3.570

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Flip Electronics

USA . 4,000 parts In-Stock

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4,000

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ComSIT Distribution GmbH

Germany . 350 parts In-Stock

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350

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Corphita

USA . 1,352 parts In-Stock

1+ parts

$3.213

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1,352

$3.213

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Corohmni

South Africa . 459 parts In-Stock

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$3.570

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459

$3.570

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Component Stockers USA

USA . 2,018 parts In-Stock

1+ parts

$3.680

100+ parts

$3.450

1k+ parts

$3.130

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2,018

$3.680

$3.450

$3.130

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 16,860 parts In-Stock

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Microchip USA

USA . 10,233 parts In-Stock

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Continental Prestige Electronics

USA . 7,126 parts In-Stock

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Kulean Microsystems

USA . 6,304 parts In-Stock

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TANS Electronics

Latvia . 6,095 parts In-Stock

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SupplyDigital Components

Austria . 4,856 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,751 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,167 parts In-Stock

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Glotronic Ltd.

UK . 1,965 parts In-Stock

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Supply Digital

USA . 1,762 parts In-Stock

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Northwest PG Solutions

USA . 1,394 parts In-Stock

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UHIMA Technologies

Türkiye . 888 parts In-Stock

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Kepictronics

USA . 800 parts In-Stock

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800

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Native Components

USA . 509 parts In-Stock

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509

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Problanco Electronics

Mexico . 438 parts In-Stock

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Overview

Unleash the power of the HGT1S12N60A4DS by Onsemi, a high-quality Insulated Gate Bipolar Transistor that offers unmatched performance for power control applications. With a single configuration and built-in diode, this N-CHANNEL transistor provides maximum efficiency and reliability. Trust in Onsemi's reputation for excellence in semiconductor manufacturing, and experience the benefits of faster fall time, lower VCEsat, and superior heat dissipation. Whether you're looking to optimize your power management system or enhance your electronic designs, this IGBT delivers exceptional value and performance that sets you apart from the competition. Upgrade to the HGT1S12N60A4DS today and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and protection for the IGBT, making it durable and long-lasting.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs are known for their high efficiency and fast switching speeds, making them suitable for power control applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and saves space, making this IGBT a cost-effective choice.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, this IGBT ensures efficient and reliable performance.

Maximum VCEsat: 2.7 V

Low VCEsat voltage minimizes power dissipation and improves overall efficiency of the circuit.

Maximum Collector-Emitter Voltage: 600 V

With a high maximum voltage rating, this IGBT can handle high power applications without the risk of breakdown.

Maximum Collector Current (IC): 54 A

High collector current rating allows this IGBT to handle heavy loads and deliver robust performance.

Surface Mount: YES

Being surface mountable makes this IGBT easy to integrate into circuit boards, saving assembly time and effort.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) HGT1S12N60A4DS attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Maximum Fall Time (tf):

95 ns

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

265 ns

Nominal Turn Off Time (toff):

180 ns

Nominal Turn On Time (ton):

33 ns

Maximum VCEsat:

2.7 V

Trade Compliance

HGT1S12N60A4DS Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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