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HGT1S12N60A4S9A

Onsemi

HGT1S12N60A4S9A by Onsemi

HGT1S12N60A4S9A by Onsemi is an N-CHANNEL IGBT for POWER CONTROL applications. It has a Max VCEsat of 2.7V, Max Collector-Emitter Voltage of 600V, and Max IC of 54A. With a small outline package style and GULL WING terminals, it operates b/w -55 to 150 °C.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Vyrian

USA . 2,297 parts In-Stock

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ComSIT Distribution GmbH

Germany . 750 parts In-Stock

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Digiode

USA . 374 parts In-Stock

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Native Components

USA . 81 parts In-Stock

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$0.278

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$0.267

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Northwest PG Solutions

USA . 1,747 parts In-Stock

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$0.270

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Andel Nordic

Denmark . 1,379 parts In-Stock

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$9.637

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$9.251

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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Kepictronics

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QUARKTWIN TECHNOLOGY LTD

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Problanco Electronics

Mexico . 7,883 parts In-Stock

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SupplyDigital Components

Austria . 7,658 parts In-Stock

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TANS Electronics

Latvia . 7,555 parts In-Stock

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Authorized Procurement Solutions

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Kulean Microsystems

USA . 5,731 parts In-Stock

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Supply Digital

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Glotronic Ltd.

UK . 1,740 parts In-Stock

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Corphita

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Corohmni

South Africa . 421 parts In-Stock

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UHIMA Technologies

Türkiye . 155 parts In-Stock

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Overview

Unleash the power of innovation with the HGT1S12N60A4S9A by Onsemi. As a leader in the industry, Onsemi delivers top-notch quality and reliability in every product they manufacture. This Insulated Gate Bipolar Transistor (IGBT) is a game-changer in power control applications, offering customers unparalleled performance and efficiency. With a maximum VCEsat of 2.7V and a maximum collector-emitter voltage of 600V, this N-channel transistor is designed to meet the demands of even the most challenging projects. Trust Onsemi to provide you with the tools you need to succeed.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good insulation, durability, and protection for the internal components of the IGBT.

Polarity or Channel Type: N-CHANNEL

N-Channel IGBTs are known for their high efficiency and fast switching speeds, making them suitable for power control applications.

Maximum VCEsat: 2.7 V

Low VCEsat ensures minimal power loss and high efficiency during operation.

Maximum Power Dissipation (Abs): 167 W

High power dissipation allows the IGBT to handle large amounts of power while maintaining reliable performance.

Maximum Operating Temperature: 150 °C

High maximum operating temperature ensures stability and performance under various environmental conditions.

Maximum Collector-Emitter Voltage: 600 V

High maximum collector-emitter voltage rating allows for the IGBT to be used in high voltage applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) HGT1S12N60A4S9A attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Configuration:

Maximum Fall Time (tf):

95 ns

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

265 ns

Nominal Turn Off Time (toff):

180 ns

Nominal Turn On Time (ton):

33 ns

Maximum VCEsat:

2.7 V

Trade Compliance

HGT1S12N60A4S9A Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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