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HGT1S3N60A4DS

Onsemi

HGT1S3N60A4DS by Onsemi

HGT1S3N60A4DS by Onsemi is an N-CHANNEL IGBT with a max VCEsat of 2.7V and a max collector-emitter voltage of 600V. It is designed for power control applications, featuring a single configuration with built-in diode and a package style of small outline.

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2

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1k+

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Digiode

USA . 2,311 parts In-Stock

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Vyrian

USA . 607 parts In-Stock

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Andel Nordic

Denmark . 1,594 parts In-Stock

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$1.670

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$1.603

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$1.603

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Advanced Electronics

New Zealand . 500 parts In-Stock

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$2.223

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$2.023

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$1.823

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$2.223

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Native Components

USA . 388 parts In-Stock

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$22.596

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Northwest PG Solutions

USA . 1,431 parts In-Stock

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$22.370

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SupplyDigital Components

Austria . 7,440 parts In-Stock

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TANS Electronics

Latvia . 6,472 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,819 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,879 parts In-Stock

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Problanco Electronics

Mexico . 2,745 parts In-Stock

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Supply Digital

USA . 2,185 parts In-Stock

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Kulean Microsystems

USA . 1,145 parts In-Stock

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Corphita

USA . 784 parts In-Stock

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UHIMA Technologies

Türkiye . 706 parts In-Stock

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Corohmni

South Africa . 397 parts In-Stock

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Overview

Enhance your power control applications with the HGT1S3N60A4DS by Onsemi. This top-quality Insulated Gate Bipolar Transistor (IGBT) offers a single configuration with a built-in diode, ensuring efficient performance and reliability. With a maximum operating temperature of 150 °C and a collector-emitter voltage of 600V, this transistor is ideal for a wide range of industrial and automotive applications. Trust Onsemi's reputation for excellence and invest in the HGT1S3N60A4DS for enhanced power control solutions with superior value and benefits.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good durability and protection for the internal components, extending the lifespan of the product.

Polarity or Channel Type: N-CHANNEL

Enhances power control capabilities and efficiency.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies circuit design and saves space with the built-in diode.

Transistor Application: POWER CONTROL

Specifically designed for efficient power control applications.

Surface Mount: YES

Allows for easy and convenient installation on circuit boards.

Maximum Rise Time (tr): 15 ns

Ensures fast response time for power control operations.

Maximum VCEsat: 2.7 V

Low saturation voltage leads to reduced power dissipation and improved efficiency.

Terminal Form: GULL WING

Facilitates easy soldering and handling during assembly.

Maximum Power Dissipation (Abs): 70 W

Can handle high power levels effectively for demanding applications.

Maximum Operating Temperature: 150 °C

Operates reliably even in high-temperature environments.

Maximum Collector-Emitter Voltage: 600 V

Suitable for applications requiring high voltage handling capabilities.

Transistor Element Material: SILICON

Provides good performance and reliability as a semiconductor material.

Minimum Operating Temperature: -55 °C

Operates reliably even in low-temperature environments.

Maximum Collector Current (IC): 17 A

Capable of handling high current levels for power control operations.

Maximum Gate-Emitter Threshold Voltage: 7 V

Allows for precise control of the transistor's switching behavior.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) HGT1S3N60A4DS attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Maximum Fall Time (tf):

100 ns

Maximum Gate-Emitter Threshold Voltage:

7 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Rise Time (tr):

15 ns

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

265 ns

Nominal Turn Off Time (toff):

180 ns

Maximum Turn On Time (ton):

23 ns

Nominal Turn On Time (ton):

17.5 ns

Maximum VCEsat:

2.7 V

Trade Compliance

HGT1S3N60A4DS Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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