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HGT1S7N60A4DS

Onsemi

HGT1S7N60A4DS by Onsemi

HGT1S7N60A4DS by Onsemi is an N-CHANNEL IGBT with a max VCEsat of 2.7V and a max IC of 34A. It is designed for power control applications, featuring a built-in diode and small outline package style. With a collector-emitter voltage of 600V and operating temperature range from -55 to 150 °C, it offers efficient performance in various power management systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Digiode

USA . 2,040 parts In-Stock

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Vyrian

USA . 862 parts In-Stock

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Q Components

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Andel Nordic

Denmark . 5,838 parts In-Stock

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$7.222

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$6.933

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$6.933

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$6.933

Component Stockers USA

USA . 755 parts In-Stock

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$99.990

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Problanco Electronics

Mexico . 7,313 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,969 parts In-Stock

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TANS Electronics

Latvia . 5,230 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,979 parts In-Stock

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Supply Digital

USA . 3,825 parts In-Stock

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Authorized Procurement Solutions

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Glotronic Ltd.

UK . 1,965 parts In-Stock

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SupplyDigital Components

Austria . 1,770 parts In-Stock

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Corphita

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Assy Fe

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Native Components

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Kulean Microsystems

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UHIMA Technologies

Türkiye . 570 parts In-Stock

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Northwest PG Solutions

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Corohmni

South Africa . 330 parts In-Stock

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Overview

Enhance your power control capabilities with the HGT1S7N60A4DS by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Insulated Gate Bipolar Transistors (IGBT) like no other. This N-CHANNEL transistor, featuring a single configuration with a built-in diode, is perfect for a wide range of power control applications. With a maximum VCEsat of 2.7V and a maximum collector-emitter voltage of 600V, this transistor offers superior performance and reliability. Trust Onsemi to provide you with the solution you need for all your power control needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and cost-effective.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs generally have lower on-state voltage drop and higher switching speed compared to P-channel, making them more efficient for power control applications.

Maximum VCEsat: 2.7 V

Low VCEsat value indicates minimal conduction losses, enhancing the efficiency of power control operations.

Maximum Collector-Emitter Voltage: 600 V

With a high maximum voltage rating, this IGBT can handle large power loads and high voltages, making it suitable for power control applications.

Maximum Power Dissipation (Abs): 125 W

This IGBT can dissipate up to 125W of power without getting damaged, ensuring reliable operation under high-power conditions.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature allows this IGBT to operate in challenging environmental conditions without performance degradation.

Nominal Turn On Time (ton): 17 ns

Fast turn-on time of 17 ns enables quick switching, leading to efficient power control and reduced switching losses.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) HGT1S7N60A4DS attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Additional Features:

LOW CONDUCTION LOSS

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Maximum Fall Time (tf):

85 ns

Maximum Gate-Emitter Threshold Voltage:

7 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

235 ns

Nominal Turn Off Time (toff):

205 ns

Nominal Turn On Time (ton):

17 ns

Maximum VCEsat:

2.7 V

Trade Compliance

HGT1S7N60A4DS Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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