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IKW40N120H3XK

Infineon Technologies

IKW40N120H3XK by Infineon Technologies

IKW40N120H3XK by Infineon Technologies is an N-CHANNEL IGBT with 1200V VCE, 80A IC, and 414ns toff. Ideal for power control applications due to its single configuration with built-in diode. Package style is flange mount with a max operating temperature of 175°C.

Median Price

$7.161

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 10 parts In-Stock

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$7.161

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Vyrian

USA . 847 parts In-Stock

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Digiode

USA . 287 parts In-Stock

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 759 parts In-Stock

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$0.400

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759

$0.400

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Modulus Dynamics

Lithuania . 286 parts In-Stock

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$1.795

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$1.723

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$1.651

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286

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$1.723

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Corohmni

South Africa . 249 parts In-Stock

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$1.933

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Continental Prestige Electronics

USA . 2,884 parts In-Stock

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$7.017

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AZTECH Wire

Italy . 583 parts In-Stock

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$17.003

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Semicontronic

India . 209 parts In-Stock

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$27.050

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$26.374

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$26.238

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Ampacity Inc.

Singapore . 931 parts In-Stock

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$28.050

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Argo Parts USA

USA . 3,400 parts In-Stock

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Bastille Electronics

Australia . 300 parts In-Stock

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Corphita

USA . 27 parts In-Stock

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Overview

Unleash the power of Infineon Technologies with the IKW40N120H3XK Insulated Gate Bipolar Transistor. Designed with precision and quality in mind, this N-channel transistor offers unmatched performance in power control applications. With a built-in diode and a maximum collector-emitter voltage of 1200V, this transistor provides reliable and efficient operation. Whether you're looking to enhance your industrial machinery or improve energy efficiency in your home appliances, the IKW40N120H3XK delivers the value, benefits, and advantages you need to take your projects to the next level. Trust in Infineon Technologies for top-notch quality and innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for applications where weight and durability are important factors.

Polarity or Channel Type: N-CHANNEL

N-CHANNEL configuration offers high efficiency and fast switching speeds, making it suitable for power control applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and saves space, making it a cost-effective solution for power control applications.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, ensuring high performance and reliability in controlling power circuits.

Package Shape: RECTANGULAR

Rectangular shape allows for easy mounting and efficient use of board space, especially in applications where space is limited.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide secure connections and easy soldering, ensuring reliable performance in various applications.

Nominal Turn Off Time (toff): 414 ns

Fast turn-off time ensures efficient switching and minimizes power loss, making it suitable for high-frequency applications.

No. of Terminals: 3

Three terminals provide necessary connections for power control applications, ensuring proper functioning and compatibility.

Package Style (Meter): FLANGE MOUNT

Flange mount style allows for easy installation and secure mounting, making it suitable for applications where stability is crucial.

Maximum Operating Temperature: 175 °C

High maximum operating temperature allows for reliable performance in a wide range of environmental conditions.

Maximum Collector-Emitter Voltage: 1200 V

High collector-emitter voltage rating allows for use in high-power applications, ensuring reliable performance under high voltage conditions.

Transistor Element Material: SILICON

Silicon material offers high reliability and performance in power control applications, ensuring long-term stability and efficiency.

Maximum Collector Current (IC): 80 A

High collector current rating allows for handling large currents, making it suitable for high-power applications.

Terminal Position: SINGLE

Single terminal position simplifies installation and connections, ensuring ease of use and compatibility in various applications.

Nominal Turn On Time (ton): 78 ns

Fast turn-on time ensures quick response and efficient switching, making it suitable for applications requiring rapid power control.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) IKW40N120H3XK attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

414 ns

Nominal Turn On Time (ton):

78 ns

Trade Compliance

IKW40N120H3XK Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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