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IKW40N120T2

Infineon Technologies

IKW40N120T2 by Infineon Technologies

IKW40N120T2 by Infineon Technologies is an N-CHANNEL IGBT with a max collector-emitter voltage of 1200V and a max collector current of 75A. It is designed for power control applications, featuring a nominal turn-off time of 600ns and a max power dissipation of 480W. The transistor has a single configuration with built-in diode, suitable for high-power operations in various industries.

Median Price

$7.528

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

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Mouser Electronics

USA . 1,204 parts In-Stock

1+ parts

$7.250

100+ parts

$4.700

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$4.170

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$3.690

1,204

$7.250

$4.700

$4.170

$3.690

Verical

USA . 720 parts In-Stock

1+ parts

-

100+ parts

$7.806

1k+ parts

$7.356

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720

-

$7.806

$7.356

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Distributors (In-Stock)

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Digiode

USA . 322 parts In-Stock

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$8.218

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322

$8.218

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Sensible Micro Corp

USA . 8,368 parts In-Stock

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Cyclops Electronics Ltd

UK . 4,045 parts In-Stock

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Vyrian

USA . 1,205 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 720 parts In-Stock

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720

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Rutronik

Germany . 90 parts In-Stock

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$5.620

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$5.080

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90

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$5.620

$5.080

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Micros

Poland . 25 parts In-Stock

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$6.556

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25

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$6.556

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Partservice

France . 25 parts In-Stock

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$6.390

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$6.390

10k+ parts

$6.390

25

-

$6.390

$6.390

$6.390

Micros sp.j. W. Kędra i J. Lic

Poland . 25 parts In-Stock

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-

100+ parts

$6.845

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$6.845

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$6.845

25

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$6.845

$6.845

$6.845

Nova Conductors

Japan . 15 parts In-Stock

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LWI Electronics Inc

India . 4 parts In-Stock

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Distributors (Availability)

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Modulus Dynamics

Lithuania . 16,681 parts In-Stock

1+ parts

$1.497

100+ parts

$1.437

1k+ parts

$1.377

10k+ parts

-

16,681

$1.497

$1.437

$1.377

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CoreStaff

Japan . 720 parts In-Stock

1+ parts

$5.530

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$4.170

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$4.050

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720

$5.530

$4.170

$4.050

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Corphita

USA . 997 parts In-Stock

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$7.785

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997

$7.785

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Ampacity Inc.

Singapore . 559 parts In-Stock

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$12.730

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559

$12.730

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Infinite Electronics LLP (Excess)

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S.R.D Solutions

India . 30,500 parts In-Stock

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Lixinc

USA . 8,568 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,605 parts In-Stock

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Continental Prestige Electronics

USA . 6,031 parts In-Stock

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GreenTree Electronics

Israel . 4,500 parts In-Stock

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Technoshack Inc. (Excess)

Canada . 4,000 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,170 parts In-Stock

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Bastille Electronics

Australia . 1,000 parts In-Stock

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Argo Parts USA

USA . 909 parts In-Stock

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Kepictronics

USA . 758 parts In-Stock

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758

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Overview

Infineon 1200V Gen8 IGBTs feature trench gate field stop technology delivered in industry standard TO-247 packages to provide best-in-class performance for industrial and energy-saving applications. The Gen8 technology offers softer turn-off characteristics ideal for motor drive applications, minimizing dv/dt to reduce EMI, and over-voltage, increasing reliability and ruggedness. Infineon 1200V Gen8 IGBTs have current ratings from 8A up to 60A with typical VCE(ON) of 1.7V, and a short-circuit rating of 10µs to reduce power dissipation, resulting in increased power density and robustness. Using thin wafer technology, 1200V Gen8 IGBTs deliver improved thermal resistance and maximum junction temperature up to +175°C.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This material provides excellent insulation and durability, making it a reliable choice for various applications.

Polarity or Channel Type:

N-CHANNEL - N-channel IGBTs typically have lower on-state voltage drop and higher switching speeds, making them suitable for high-power applications.

Configuration:

SINGLE WITH BUILT-IN DIODE - Having a built-in diode simplifies circuit design and eliminates the need for an external diode, reducing component count and cost.

Transistor Application:

POWER CONTROL - Designed for power control applications, ensuring efficient performance and reliable operation in high-power systems.

Package Shape:

RECTANGULAR - The rectangular shape allows for easy mounting and integration into electronic systems, saving space and enhancing overall efficiency.

Terminal Form:

THROUGH-HOLE - Through-hole terminals provide a secure and reliable connection, making it easier for soldering and ensuring stable operation.

Nominal Turn Off Time (toff):

600 ns - The fast turn-off time helps in reducing switching losses and improving overall efficiency in high-frequency applications.

No. of Terminals:

3 - The three terminals allow for easy connection and control of the IGBT, simplifying integration into electronic circuits.

Maximum Power Dissipation (Abs):

480 W - The high power dissipation capability makes it suitable for handling high power levels without overheating, ensuring long-term reliability.

Package Style (Meter):

FLANGE MOUNT - The flange mount design provides a secure mounting option, ideal for applications requiring mechanical stability.

Maximum Operating Temperature:

175 °C - With a high operating temperature range, this IGBT can withstand harsh environmental conditions and operate reliably in demanding applications.

Maximum Collector-Emitter Voltage:

1200 V - The high collector-emitter voltage rating allows for safe operation in high voltage applications, ensuring reliable performance under varying load conditions.

Transistor Element Material:

SILICON - Silicon provides excellent electrical properties and high-temperature resistance, offering dependable performance and longevity.

Maximum Gate-Emitter Voltage:

20 V - The high gate-emitter voltage rating ensures reliable and stable gate control, enabling precise switching and control of the IGBT.

Maximum Collector Current (IC):

75 A - The high collector current rating allows for handling high current loads, making it suitable for power control and switching applications.

Maximum Gate-Emitter Threshold Voltage:

6.4 V - The gate-emitter threshold voltage ensures proper turn-on and turn-off characteristics, facilitating efficient power control and switching.

Terminal Finish:

TIN - The tin terminal finish provides corrosion resistance and ensures reliable electrical connections, extending the lifespan of the IGBT.

Terminal Position:

SINGLE - The single terminal position simplifies installation and connection, making it easier to integrate the IGBT into electronic circuits.

Case Connection:

COLLECTOR - The case connection at the collector terminal ensures efficient heat dissipation and electrical isolation, enhancing overall performance and reliability.

Nominal Turn On Time (ton):

60 ns - The fast turn-on time facilitates quick response and switching, improving efficiency and performance in high-speed applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) IKW40N120T2 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Maximum Gate-Emitter Threshold Voltage:

6.4 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247AD

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

600 ns

Nominal Turn On Time (ton):

60 ns

Trade Compliance

IKW40N120T2 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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