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IRGB4062DPBF

Infineon Technologies

IRGB4062DPBF by Infineon Technologies

IRGB4062DPBF by Infineon Technologies is an N-CHANNEL IGBT with a max Collector-Emitter Voltage of 600V and Max Power Dissipation of 250W. It has a single configuration with built-in diode, ideal for power control applications requiring fast switching times (tr: 31ns, tf: 41ns).

Median Price

$3.000

Lifecycle Status

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7

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1k+

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DF Sales Co.

USA . 100 parts In-Stock

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$3.000

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DF Sales Co.

USA . 100 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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$3.835

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Chip Stock

USA . 5,735 parts In-Stock

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Digiode

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Vyrian

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LWI Electronics Inc

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Ampacity Inc.

Singapore . 319 parts In-Stock

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$0.050

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319

$0.050

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Modulus Dynamics

Lithuania . 19,783 parts In-Stock

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$3.829

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$3.676

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$3.523

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$3.829

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Argo Parts USA

USA . 4,761 parts In-Stock

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$3.835

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Continental Prestige Electronics

USA . 4,144 parts In-Stock

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$3.835

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$3.758

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Netroflash

USA . 500 parts In-Stock

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$3.835

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$3.758

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AZTECH Wire

Italy . 471 parts In-Stock

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$18.564

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Andel Nordic

Denmark . 245 parts In-Stock

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$52.620

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$36.833

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$36.833

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$36.833

Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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Lixinc

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QUARKTWIN TECHNOLOGY LTD

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Microchip USA

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Perfect Parts

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A-Z Elektronik GmbH

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Authorized Procurement Solutions

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Alle Elektronik GmbH

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Corphita

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GreenTree Electronics

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Overview

Elevate your power control applications with the top-notch IRGB4062DPBF Insulated Gate Bipolar Transistor from leading manufacturer Infineon Technologies. With a single configuration featuring a built-in diode, this N-channel transistor offers reliable performance and efficient power control. Designed for maximum power dissipation of 250W and a collector-emitter voltage of 600V, this transistor is ideal for a wide range of industrial and automotive applications. Trust in the quality and expertise of Infineon Technologies to deliver cutting-edge technology that exceeds expectations. Unlock the potential of your projects with the IRGB4062DPBF today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this IGBT lightweight and durable, perfect for various power control applications.

Polarity or Channel Type: N-CHANNEL

The N-channel type allows for efficient power control and high performance in different electronic systems.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and provides protection against reverse voltage spikes, enhancing the overall reliability of the system.

Transistor Application: POWER CONTROL

Specifically designed for power control applications, this IGBT offers high power dissipation and reliable performance in demanding environments.

Maximum Rise Time (tr): 31 ns

The fast rise time of 31 ns ensures quick switching between on and off states, improving the efficiency of power control operations.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy mounting and integration into different electronic systems, offering versatility in design.

Terminal Form: THROUGH-HOLE

The through-hole terminal form provides secure connections and stable performance, making it suitable for applications that require robust construction.

Maximum Fall Time (tf): 41 ns

With a fast fall time of 41 ns, this IGBT ensures rapid switching off to prevent power loss and improve overall efficiency.

Nominal Turn Off Time (toff): 164 ns

The nominal turn off time of 164 ns contributes to precise control over power dissipation and enhances the overall performance of the IGBT.

No. of Terminals: 3

The 3 terminals provide essential connections for input, output, and control signals, enabling seamless integration into various power control circuits.

Maximum Power Dissipation (Abs): 250 W

With a high maximum power dissipation of 250 W, this IGBT can handle heavy loads and maintain stable performance under demanding conditions.

Package Style (Meter): FLANGE MOUNT

The flange mount package style offers secure mounting and efficient heat dissipation, ensuring reliable operation in power control systems.

Maximum Operating Temperature: 175 °C

The maximum operating temperature of 175°C allows this IGBT to withstand high temperature environments, making it suitable for industrial applications.

Maximum Collector-Emitter Voltage: 600 V

The high collector-emitter voltage of 600 V provides ample headroom for power control operations, ensuring reliable performance in various voltage ranges.

Transistor Element Material: SILICON

Made from high-quality silicon material, this IGBT offers excellent thermal conductivity and reliability for long-term use in power control applications.

Maximum Gate-Emitter Voltage: 20 V

The maximum gate-emitter voltage of 20 V ensures safe and efficient control over the IGBT, enhancing its overall performance and reliability.

Maximum Collector Current (IC): 48 A

With a high collector current of 48 A, this IGBT can handle heavy loads and provide stable power control in various electronic systems.

Maximum Gate-Emitter Threshold Voltage: 6.5 V

The gate-emitter threshold voltage of 6.5 V ensures precise control over the switching behavior of the IGBT, optimizing power control operations.

Terminal Position: SINGLE

The single terminal position simplifies installation and wiring, making this IGBT easy to integrate into different power control circuits.

Case Connection: COLLECTOR

The case connection to the collector terminal enhances the cooling efficiency of the IGBT, ensuring stable performance and longevity in power control applications.

Nominal Turn On Time (ton): 64 ns

The nominal turn on time of 64 ns allows for quick switching between off and on states, improving the efficiency and responsiveness of power control operations.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) IRGB4062DPBF attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Maximum Fall Time (tf):

41 ns

Maximum Gate-Emitter Threshold Voltage:

6.5 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Maximum Rise Time (tr):

31 ns

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

164 ns

Nominal Turn On Time (ton):

64 ns

Trade Compliance

IRGB4062DPBF Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

NSN

5961-01-653-2159, 5961016532159

NIIN

016532159

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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