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IRGB4060DPBF

Infineon Technologies

IRGB4060DPBF by Infineon Technologies

N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: NO; Maximum Power Dissipation (Abs): 99 W; Maximum Collector Current (IC): 16 A; Maximum Operating Temperature: 175 Cel;

Median Price

$1.550

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 91,200 parts In-Stock

1+ parts

-

100+ parts

$1.490

1k+ parts

$1.240

10k+ parts

$1.100

91,200

-

$1.490

$1.240

$1.100

DigiKey

USA . 91,200 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.860

10k+ parts

-

91,200

-

-

$1.860

-

Verical

USA . 20,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.550

10k+ parts

$1.375

20,000

-

-

$1.550

$1.375

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 905 parts In-Stock

1+ parts

$1.159

100+ parts

-

1k+ parts

-

10k+ parts

-

905

$1.159

-

-

-

Vyrian

USA . 336 parts In-Stock

1+ parts

$1.220

100+ parts

-

1k+ parts

-

10k+ parts

-

336

$1.220

-

-

-

Bristol Electronics

USA . 450 parts In-Stock

1+ parts

$2.827

100+ parts

$1.329

1k+ parts

$1.216

10k+ parts

-

450

$2.827

$1.329

$1.216

-

Voyager Components

USA . 3,763 parts In-Stock

1+ parts

$10.901

100+ parts

-

1k+ parts

-

10k+ parts

-

3,763

$10.901

-

-

-

DigiKey Marketplace

USA . 91,200 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

91,200

-

-

-

-

ComSIT Distribution GmbH

Germany . 1,150 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,150

-

-

-

-

ComSIT USA

USA . 1,150 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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-

1,150

-

-

-

-

Dan-Mar Components

USA . 450 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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450

-

-

-

-

ACDS - Activité Composants Distribution Service

France . 400 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

400

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 422 parts In-Stock

1+ parts

$1.098

100+ parts

-

1k+ parts

-

10k+ parts

-

422

$1.098

-

-

-

Modulus Dynamics

Lithuania . 21,063 parts In-Stock

1+ parts

$1.232

100+ parts

$1.183

1k+ parts

$1.133

10k+ parts

-

21,063

$1.232

$1.183

$1.133

-

Component Stockers USA

USA . 31,360 parts In-Stock

1+ parts

$1.240

100+ parts

$1.170

1k+ parts

$1.060

10k+ parts

$1.060

31,360

$1.240

$1.170

$1.060

$1.060

Microchip USA

USA . 6,856 parts In-Stock

1+ parts

$7.605

100+ parts

-

1k+ parts

-

10k+ parts

-

6,856

$7.605

-

-

-

A-Z Elektronik GmbH

Germany . 5,189 parts In-Stock

1+ parts

-

100+ parts

-

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-

10k+ parts

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5,189

-

-

-

-

Alle Elektronik GmbH

Germany . 3,459 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,459

-

-

-

-

Perfect Parts

USA . 2,034 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,034

-

-

-

-

RC Electronics

USA . 1,300 parts In-Stock

1+ parts

-

100+ parts

$1.660

1k+ parts

$1.560

10k+ parts

$1.530

1,300

-

$1.660

$1.560

$1.530

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) IRGB4060DPBF attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Maximum Fall Time (tf):

26 ns

Maximum Gate-Emitter Threshold Voltage:

6.5 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Maximum Rise Time (tr):

21 ns

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

152 ns

Nominal Turn On Time (ton):

45 ns

Trade Compliance

IRGB4060DPBF Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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