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IKD04N60RFAATMA1

Infineon Technologies

IKD04N60RFAATMA1 by Infineon Technologies

IKD04N60RFAATMA1 by Infineon is an N-CHANNEL IGBT with 600V max. collector-emitter voltage and 8A max. collector current. It has a built-in diode, 216ns turn-off time, and is ideal for power control applications requiring fast switching speeds in automotive electronics (AEC-Q101 compliant).

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,764 parts In-Stock

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Nova Conductors

Japan . 100 parts In-Stock

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Digiode

USA . 81 parts In-Stock

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Ampacity Inc.

Singapore . 1,481 parts In-Stock

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$0.050

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Aztec Data Supply Inc.

USA . 2,485 parts In-Stock

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$0.880

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$0.880

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Modulus Dynamics

Lithuania . 10,933 parts In-Stock

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$1.305

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$1.253

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$1.201

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10,933

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Corohmni

South Africa . 327 parts In-Stock

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$1.910

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327

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AZTECH Wire

Italy . 591 parts In-Stock

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$14.377

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Semicontronic

India . 685 parts In-Stock

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$32.050

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$31.249

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$31.088

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685

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$31.088

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Continental Prestige Electronics

USA . 6,593 parts In-Stock

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Microchip USA

USA . 5,798 parts In-Stock

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Argo Parts USA

USA . 1,499 parts In-Stock

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Corphita

USA . 401 parts In-Stock

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Bastille Electronics

Australia . 10 parts In-Stock

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Overview

Experience the power of the IKD04N60RFAATMA1 by Infineon Technologies, a top-tier manufacturer known for delivering high-quality Insulated Gate Bipolar Transistors (IGBT). This N-CHANNEL transistor with built-in diode is perfect for power control applications, offering unparalleled performance and reliability. With a maximum collector-emitter voltage of 600V and a nominal turn-off time of just 216ns, this transistor is designed to meet the demands of today's technology-driven world. Trust Infineon Technologies to provide you with cutting-edge solutions that deliver value and efficiency to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for the internal components, ensuring reliability and longevity.

Polarity or Channel Type: N-CHANNEL

Allows for efficient power control capabilities in electronic circuits.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies circuit design and saves space by incorporating a diode within the transistor package.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, ensuring optimal performance in such scenarios.

Surface Mount: YES

Enables easy and efficient installation on circuit boards, enhancing the manufacturing process.

Package Shape: RECTANGULAR

Provides a compact form factor, making it suitable for space-constrained applications.

Nominal Turn Off Time (toff): 216 ns

Fast turn-off time helps in reducing switching losses and improving efficiency in power control.

No. of Terminals: 2

Simple 2-terminal design for easy integration into circuits.

Maximum Collector-Emitter Voltage: 600 V

High breakdown voltage allows for operation in high voltage applications.

Transistor Element Material: SILICON

Silicon material offers good performance and reliability in power switching applications.

Minimum Operating Temperature: -40 °C

Capable of functioning in a wide range of temperatures, suitable for various environments.

Maximum Collector Current (IC): 8 A

High collector current rating for handling large power loads.

Terminal Position: SINGLE

Simplified terminal layout for ease of connection in circuits.

Case Connection: COLLECTOR

Collector connection for convenient interfacing with other circuit components.

Nominal Turn On Time (ton): 18 ns

Fast turn-on time ensures quick response in power switching applications.

Reference Standard: AEC-Q101

Compliance with automotive industry standards ensures reliability for automotive applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) IKD04N60RFAATMA1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

8 A

Maximum Collector-Emitter Voltage:

600 V

JEDEC-95 Code:

TO-252

JESD-30 Code:

R-PSSO-G2

No. of Elements:

1

No. of Terminals:

2

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

216 ns

Nominal Turn On Time (ton):

18 ns

Trade Compliance

IKD04N60RFAATMA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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