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IKD06N60RAATMA1

Infineon Technologies

IKD06N60RAATMA1 by Infineon Technologies

IKD06N60RAATMA1 by Infineon is an N-CHANNEL IGBT with 600V max collector-emitter voltage and 12A max collector current. It has a turn-off time of 335ns and turn-on time of 22ns, suitable for applications requiring fast switching such as motor drives and power supplies.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,351 parts In-Stock

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4,351

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Digiode

USA . 679 parts In-Stock

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679

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Distributors (Availability)

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Advanced Electronics

New Zealand . 600 parts In-Stock

1+ parts

$0.368

100+ parts

$0.335

1k+ parts

$0.302

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600

$0.368

$0.335

$0.302

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Aztec Data Supply Inc.

USA . 2,435 parts In-Stock

1+ parts

$0.790

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2,435

$0.790

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Corohmni

South Africa . 176 parts In-Stock

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$1.444

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176

$1.444

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Modulus Dynamics

Lithuania . 5,202 parts In-Stock

1+ parts

$1.727

100+ parts

$1.658

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$1.589

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5,202

$1.727

$1.658

$1.589

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AZTECH Wire

Italy . 835 parts In-Stock

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$8.000

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835

$8.000

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Andel Nordic

Denmark . 1,000 parts In-Stock

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$32.760

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$22.934

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$22.934

1,000

$32.760

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$22.934

$22.934

Semicontronic

India . 826 parts In-Stock

1+ parts

$35.050

100+ parts

$34.174

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$33.998

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826

$35.050

$34.174

$33.998

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Ampacity Inc.

Singapore . 1,510 parts In-Stock

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$55.050

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$55.050

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QUARKTWIN TECHNOLOGY LTD

USA . 6,995 parts In-Stock

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Authorized Procurement Solutions

USA . 4,500 parts In-Stock

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4,500

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Continental Prestige Electronics

USA . 3,819 parts In-Stock

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Argo Parts USA

USA . 825 parts In-Stock

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825

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Corphita

USA . 396 parts In-Stock

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396

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Bastille Electronics

Australia . 200 parts In-Stock

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200

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Overview

Unleash the power of cutting-edge technology with the IKD06N60RAATMA1 Insulated Gate Bipolar Transistor by Infineon Technologies. Crafted with precision and expertise, this N-channel transistor boasts a single configuration with a built-in diode, perfect for a wide range of applications. From power supplies to motor controls, this transistor delivers unmatched performance and reliability. With a maximum collector-emitter voltage of 600V and a nominal turn-off time of 335ns, this small outline package is designed to exceed expectations. Elevate your projects with the exceptional quality and value that only Infineon Technologies can provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the IGBT lightweight and durable, ideal for applications where weight and space are limited.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs typically have lower on-state voltage drop and higher current carrying capacity compared to P-channel types, making them more efficient for power switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies the circuit design and protects against reverse voltage spikes, improving the reliability of the overall system.

Surface Mount: YES

Surface mount IGBTs are easier to assemble and take up less board space, making them suitable for compact designs and high-density layouts.

Package Shape: RECTANGULAR

The rectangular package allows for easier mounting and alignment on circuit boards, simplifying the assembly process.

Maximum Collector-Emitter Voltage: 600V

With a high maximum voltage rating, this IGBT can handle higher voltages in power switching applications, increasing its versatility and reliability.

Maximum Collector Current (IC): 12A

The high collector current rating allows this IGBT to handle higher power levels, suitable for applications that require efficient power switching.

Nominal Turn On Time (ton): 22 ns

The fast turn-on time of 22 nanoseconds ensures quick switching speeds, reducing power losses and improving overall efficiency.

Nominal Turn Off Time (toff): 335 ns

The relatively fast turn-off time of 335 nanoseconds allows for rapid switching transitions, minimizing heat generation and maximizing efficiency.

Reference Standard: AEC-Q101

Compliance with the AEC-Q101 automotive standard ensures high quality and reliability for use in automotive applications, meeting stringent industry requirements.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) IKD06N60RAATMA1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Additional Features:

LOW CONDUCTION LOSS

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

JEDEC-95 Code:

TO-252

JESD-30 Code:

R-PSSO-G2

No. of Elements:

1

No. of Terminals:

2

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

GENERAL PURPOSE

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

335 ns

Nominal Turn On Time (ton):

22 ns

Trade Compliance

IKD06N60RAATMA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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