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IRG4PH40UDPBF

Infineon Technologies

IRG4PH40UDPBF by Infineon Technologies

IRG4PH40UDPBF by Infineon Technologies is an N-CHANNEL IGBT with a max Collector-Emitter Voltage of 1200V and Max Collector Current of 41A. It is used for POWER CONTROL applications, featuring a Nominal Turn Off Time of 750ns and Max Power Dissipation of 65W.

Median Price

$2.980

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1 parts In-Stock

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$2.980

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$2.670

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$2.510

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$2.670

$2.510

Distributors (In-Stock)

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Digiode

USA . 280 parts In-Stock

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$3.135

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Nova Conductors

Japan . 22 parts In-Stock

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$6.401

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Chip Stock

USA . 7,796 parts In-Stock

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Pegasus Components GmbH

Germany . 1,291 parts In-Stock

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Prism Electronics

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Vyrian

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Ampacity Inc.

Singapore . 1 parts In-Stock

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$2.800

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$2.800

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Corphita

USA . 902 parts In-Stock

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$2.970

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$2.970

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AZTECH Wire

Italy . 889 parts In-Stock

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$5.077

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$5.077

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Modulus Dynamics

Lithuania . 20,857 parts In-Stock

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$6.286

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$6.035

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$5.783

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Continental Prestige Electronics

USA . 3,402 parts In-Stock

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$6.401

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$6.273

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$6.401

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Netroflash

USA . 500 parts In-Stock

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$6.401

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$6.081

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$5.953

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$6.401

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$6.081

$5.953

QUARKTWIN TECHNOLOGY LTD

USA . 29,089 parts In-Stock

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Microchip USA

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A-Z Elektronik GmbH

Germany . 7,325 parts In-Stock

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GreenTree Electronics

Israel . 5,100 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,883 parts In-Stock

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Perfect Parts

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Glotronic Ltd.

UK . 1,920 parts In-Stock

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Argo Parts USA

USA . 1,855 parts In-Stock

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S.R.D Solutions

India . 1,200 parts In-Stock

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Authorized Procurement Solutions

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Assy Fe

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Overview

Upgrade your power control solutions with the IRG4PH40UDPBF Insulated Gate Bipolar Transistor from Infineon Technologies. With a single configuration and built-in diode, this N-channel transistor offers superior performance and reliability for a wide range of applications. From industrial automation to renewable energy systems, this high-quality component ensures efficient power management with a maximum collector-emitter voltage of 1200V and a maximum gate-emitter voltage of 20V. Trust in Infineon's expertise to deliver cutting-edge technology that drives your projects forward.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - Provides durability and protection for the internal components, making it suitable for a variety of applications.

Polarity or Channel Type:

N-CHANNEL - Offers efficient current flow and low on-resistance, ideal for power control applications.

Configuration:

SINGLE WITH BUILT-IN DIODE - Simplifies circuit design and saves space, making it convenient for power control applications.

Transistor Application:

POWER CONTROL - Specifically designed for controlling power flow, ensuring reliable performance in power applications.

Package Shape:

RECTANGULAR - Allows for easy integration into different systems and offers a compact form factor.

Terminal Form:

THROUGH-HOLE - Provides strong mechanical connections and ease of soldering, ensuring a reliable connection in power control applications.

Maximum Fall Time (tf):

360 ns - Ensures fast switching speeds, improving efficiency and reducing power loss in power control applications.

Nominal Turn Off Time (toff):

750 ns - Allows for precise control over turn-off timing, crucial for maintaining stability in power control applications.

No. of Terminals:

3 - Provides the necessary connections for effective power control without unnecessary complexity.

Maximum Power Dissipation (Abs):

65 W - Offers high power handling capacity, making it suitable for a wide range of power applications.

Package Style (Meter):

FLANGE MOUNT - Enables secure mounting and heat dissipation, ensuring reliable operation in power control applications.

Maximum Operating Temperature:

150 °C - Can withstand high temperatures, enhancing reliability in harsh operating conditions.

Maximum Collector-Emitter Voltage:

1200 V - Provides high voltage tolerance, suitable for high-power applications requiring reliable voltage handling.

Transistor Element Material:

SILICON - Offers high reliability and performance, ensuring long-term stability in power control applications.

Maximum Gate-Emitter Voltage:

20 V - Ensures safe operation within specified voltage limits, essential for protecting the transistor in power control applications.

Maximum Collector Current (IC):

41 A - Handles high currents with ease, making it suitable for demanding power control applications.

Maximum Gate-Emitter Threshold Voltage:

6 V - Allows for precise control over the transistor, ensuring accurate power regulation in power control applications.

Terminal Finish:

MATTE TIN OVER NICKEL - Provides corrosion resistance and reliable electrical connections, ensuring long-term performance in power control applications.

Terminal Position:

SINGLE - Simplifies installation and wiring, reducing the risk of errors in power control applications.

Case Connection:

COLLECTOR - Streamlines the connection process and enhances reliability in power control applications.

Nominal Turn On Time (ton):

74 ns - Offers fast turn-on times, allowing for quick response and efficient power regulation in power control applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) IRG4PH40UDPBF attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Additional Features:

ULTRA FAST SOFT RECOVERY

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Maximum Fall Time (tf):

360 ns

Maximum Gate-Emitter Threshold Voltage:

6 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247AC

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Finish:

MATTE TIN OVER NICKEL

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

750 ns

Nominal Turn On Time (ton):

74 ns

Trade Compliance

IRG4PH40UDPBF Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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