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HGT1S11N120CNS9A

Onsemi

HGT1S11N120CNS9A by Onsemi

HGT1S11N120CNS9A by Onsemi is an N-CHANNEL IGBT with 1200V VCEsat, 298W power dissipation, and 43A collector current. Ideal for power control applications, it features a rise time of 16ns and fall time of 400ns. This single configuration transistor operates b/w -55 to 150 °C temperatures.

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Overview

Unleash the power of innovation with the HGT1S11N120CNS9A by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch quality and reliability in their Insulated Gate Bipolar Transistors (IGBT). This N-CHANNEL transistor is perfect for power control applications, offering a quick rise time of 16 ns and a low VCEsat of 2.4 V. With a maximum collector-emitter voltage of 1200 V and a maximum operating temperature of 150 °C, this transistor ensures optimal performance in diverse conditions. Elevate your projects with the HGT1S11N120CNS9A and experience unparalleled efficiency and durability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides good insulation and protection for the transistor, making it durable and suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs typically have faster switching speeds and lower conduction losses compared to P-channel IGBTs, making them more efficient for power control applications.

Configuration: SINGLE

The single configuration simplifies the design and installation process, making it easier to integrate this IGBT into power control systems.

Transistor Application: POWER CONTROL

Specifically designed for power control applications, this IGBT is optimized for high power handling and efficient operation in controlling electrical power.

Surface Mount: YES

The surface mount option allows for easy and compact PCB assembly, saving space and facilitating mass production of electronic devices.

Maximum Rise Time (tr): 16 ns

With a fast rise time, this IGBT can switch on/off quickly, reducing switching losses and improving overall efficiency in power control applications.

Maximum VCEsat: 2.4 V

The low VCEsat voltage drop indicates minimal conduction losses when the IGBT is in the on-state, leading to higher efficiency in power control operations.

Maximum Power Dissipation (Abs): 298 W

The high power dissipation capability allows this IGBT to handle heavy loads and operate reliably in high-power applications.

Maximum Collector-Emitter Voltage: 1200 V

The high breakdown voltage rating ensures safe and robust operation in high-voltage circuits, making it suitable for a wide range of power control applications.

Maximum Turn On Time (ton): 40 ns

The fast turn-on time reduces switching losses and improves the overall performance of the transistor in power control applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) HGT1S11N120CNS9A attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Additional Features:

AVALANCHE RATED, LOW CONDUCTION LOSS

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Configuration:

Maximum Fall Time (tf):

400 ns

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Rise Time (tr):

16 ns

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

680 ns

Nominal Turn Off Time (toff):

550 ns

Maximum Turn On Time (ton):

40 ns

Nominal Turn On Time (ton):

33 ns

Maximum VCEsat:

2.4 V

Trade Compliance

HGT1S11N120CNS9A Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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