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HGT1S12N60A4DS9A

Onsemi

HGT1S12N60A4DS9A by Onsemi

HGT1S12N60A4DS9A by Onsemi is an N-CHANNEL IGBT with 600V VCEsat, 54A IC, and 167W power dissipation. Ideal for power control applications, it features a built-in diode, 95ns fall time, and -55 to 150 °C operating temperature range.

Median Price

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Lifecycle Status

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1k+

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Vyrian

USA . 2,355 parts In-Stock

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Digiode

USA . 1,283 parts In-Stock

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 298 parts In-Stock

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Native Components

USA . 60 parts In-Stock

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$0.342

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$0.328

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Northwest PG Solutions

USA . 2,260 parts In-Stock

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$0.376

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$0.332

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TANS Electronics

Latvia . 5,894 parts In-Stock

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SupplyDigital Components

Austria . 5,865 parts In-Stock

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Kulean Microsystems

USA . 5,013 parts In-Stock

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Corphita

USA . 1,343 parts In-Stock

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Problanco Electronics

Mexico . 1,179 parts In-Stock

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UHIMA Technologies

Türkiye . 981 parts In-Stock

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Supply Digital

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Corohmni

South Africa . 380 parts In-Stock

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Overview

Unlock the power of innovation with the HGT1S12N60A4DS9A by Onsemi. This Insulated Gate Bipolar Transistor (IGBT) boasts exceptional quality and reliability, thanks to Onsemi's unmatched manufacturing standards. Ideal for power control applications, this N-CHANNEL transistor offers a seamless single configuration with a built-in diode, ensuring maximum efficiency and performance. Experience the benefits of its 600V maximum collector-emitter voltage, 54A maximum collector current, and rapid turn-on/off times. Elevate your projects with the HGT1S12N60A4DS9A and unleash a new level of precision and productivity.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the IGBT.

Polarity or Channel Type: N-CHANNEL

Allows for efficient power control and performance.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies circuit design and enhances functionality.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, ensuring reliability and efficiency.

Surface Mount: YES

Facilitates easy installation and space-saving on circuit boards.

Maximum VCEsat: 2.7 V

Low VCEsat ensures minimal energy loss and high efficiency.

Package Shape: RECTANGULAR

Allows for efficient placement on circuit boards.

Terminal Form: GULL WING

Enables secure and reliable connections.

Maximum Fall Time (tf): 95 ns

Fast fall time contributes to quick switching and high performance.

Nominal Turn Off Time (toff): 180 ns

Fast turn off time ensures efficient power control.

No. of Terminals: 2

Simplified connection and control.

Maximum Power Dissipation (Abs): 167 W

High power dissipation capability for demanding applications.

Package Style (Meter): SMALL OUTLINE

Compact package design for space-saving on circuit boards.

Maximum Operating Temperature: 150 °C

Wide operating temperature range for versatility.

Maximum Collector-Emitter Voltage: 600 V

High collector-emitter voltage rating for versatility in power control circuits.

Transistor Element Material: SILICON

Reliable and durable material for long-lasting performance.

Maximum Gate-Emitter Voltage: 20 V

Suitable for a wide range of applications.

Minimum Operating Temperature: -55 °C

Can operate in low-temperature environments.

Maximum Collector Current (IC): 54 A

High collector current rating for demanding power control applications.

Maximum Turn Off Time (toff): 265 ns

Fast turn off time for efficient power control.

Terminal Position: SINGLE

Simplified connection and control.

Case Connection: COLLECTOR

Efficient connection for power control applications.

Nominal Turn On Time (ton): 33 ns

Fast turn on time for quick response.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) HGT1S12N60A4DS9A attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Maximum Fall Time (tf):

95 ns

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

265 ns

Nominal Turn Off Time (toff):

180 ns

Nominal Turn On Time (ton):

33 ns

Maximum VCEsat:

2.7 V

Trade Compliance

HGT1S12N60A4DS9A Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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