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HGT1S12N60C3DS

Onsemi

HGT1S12N60C3DS by Onsemi

HGT1S12N60C3DS by Onsemi is an N-CHANNEL IGBT with 600V VCEsat, 24A IC, and 104W power dissipation. Ideal for power control applications, it features a built-in diode, 275ns fall time, and -40 to 150 °C operating temperature range.

Median Price

$2.025

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 565 parts In-Stock

1+ parts

-

100+ parts

$1.810

1k+ parts

$1.620

10k+ parts

$1.520

565

-

$1.810

$1.620

$1.520

DigiKey

USA . 565 parts In-Stock

1+ parts

-

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$2.380

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565

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$2.380

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Verical

USA . 565 parts In-Stock

1+ parts

-

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1k+ parts

$2.025

10k+ parts

$1.900

565

-

-

$2.025

$1.900

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,547 parts In-Stock

1+ parts

$1.670

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2,547

$1.670

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Digiode

USA . 3,001 parts In-Stock

1+ parts

$1.919

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3,001

$1.919

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DigiKey Marketplace

USA . 565 parts In-Stock

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565

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Distributors (Availability)

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Native Components

USA . 188 parts In-Stock

1+ parts

$0.980

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188

$0.980

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Northwest PG Solutions

USA . 1,475 parts In-Stock

1+ parts

$1.078

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1,475

$1.078

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Corohmni

South Africa . 432 parts In-Stock

1+ parts

$1.670

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432

$1.670

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Corphita

USA . 2,255 parts In-Stock

1+ parts

$1.818

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2,255

$1.818

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Andel Nordic

Denmark . 1,921 parts In-Stock

1+ parts

$3.920

100+ parts

-

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$3.763

10k+ parts

$3.763

1,921

$3.920

-

$3.763

$3.763

Microchip USA

USA . 362 parts In-Stock

1+ parts

$12.545

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362

$12.545

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A-Z Elektronik GmbH

Germany . 6,743 parts In-Stock

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6,743

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Problanco Electronics

Mexico . 5,450 parts In-Stock

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SupplyDigital Components

Austria . 5,291 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,962 parts In-Stock

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TANS Electronics

Latvia . 2,055 parts In-Stock

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Glotronic Ltd.

UK . 1,965 parts In-Stock

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Kulean Microsystems

USA . 1,763 parts In-Stock

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Supply Digital

USA . 1,033 parts In-Stock

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Kepictronics

USA . 800 parts In-Stock

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800

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UHIMA Technologies

Türkiye . 756 parts In-Stock

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756

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Continental Prestige Electronics

USA . 565 parts In-Stock

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$2.420

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565

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$2.420

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Overview

With the HGT1S12N60C3DS by Onsemi, you're getting a top-quality Insulated Gate Bipolar Transistor that guarantees high performance and reliability. This N-CHANNEL transistor is perfect for power control applications, offering a maximum VCEsat of 2.2V and a maximum Collector-Emitter Voltage of 600V. Its SINGLE configuration with BUILT-IN DIODE makes installation a breeze, while its small outline package ensures compatibility with various devices. Trust Onsemi's expertise in semiconductor manufacturing to deliver the best-in-class products like the HGT1S12N60C3DS, providing you with the value and advantages you need for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a lightweight and durable housing for the IGBT, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs typically have better performance characteristics such as lower conduction losses and faster switching speeds compared to P-channel IGBTs.

Configuration: SINGLE WITH BUILT-IN DIODE

Built-in diode simplifies circuit design and allows for more efficient power control in applications.

Transistor Application: POWER CONTROL

Specifically designed for power control applications, ensuring reliable performance in high-power circuits.

Maximum VCEsat: 2.2 V

Low VCEsat helps in reducing energy losses and improving overall efficiency of the IGBT.

Package Shape: RECTANGULAR

Rectangular shape allows for easy mounting and integration into electronic devices.

Terminal Form: GULL WING

Gull wing terminals provide secure and reliable connections for the IGBT.

Maximum Fall Time (tf): 275 ns

Fast fall time indicates quick switching speed, making it suitable for high-frequency applications.

Nominal Turn Off Time (toff): 480 ns

Low turn-off time ensures efficient switching and reduces power dissipation.

No. of Terminals: 2

Simple 2-terminal configuration simplifies circuit design and reduces complexity.

Maximum Power Dissipation (Abs): 104 W

High power dissipation capacity allows the IGBT to handle large amounts of power without overheating.

Package Style (Meter): SMALL OUTLINE

Small outline package saves space and allows for compact designs in electronic systems.

Maximum Operating Temperature: 150 °C

High maximum operating temperature ensures reliable performance in demanding environmental conditions.

Maximum Collector-Emitter Voltage: 600 V

High maximum voltage rating enables the IGBT to be used in high-voltage applications with safety and reliability.

Transistor Element Material: SILICON

Silicon material provides good thermal conductivity and electrical properties, ensuring stable operation of the IGBT.

Maximum Gate-Emitter Voltage: 20 V

Safe maximum gate-emitter voltage protects the IGBT from overvoltage conditions and ensures longevity.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows the IGBT to be used in cold environments without performance degradation.

Maximum Collector Current (IC): 24 A

High collector current rating enables the IGBT to handle large current loads reliably.

Maximum Gate-Emitter Threshold Voltage: 6 V

Low threshold voltage allows for efficient control of the IGBT and reduces power losses during operation.

Maximum Turn Off Time (toff): 675 ns

Fast turn-off time ensures quick response and efficient power control in the circuit.

Terminal Position: SINGLE

Single terminal position simplifies installation and connectivity in electronic circuits.

Case Connection: COLLECTOR

Collector case connection provides easy interfacing with other components and ensures proper heat dissipation.

Nominal Turn On Time (ton): 48 ns

Fast turn-on time allows for quick activation of the IGBT, ensuring efficient power control in the circuit.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) HGT1S12N60C3DS attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Additional Features:

RC-IGBT

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Maximum Fall Time (tf):

275 ns

Maximum Gate-Emitter Threshold Voltage:

6 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

675 ns

Nominal Turn Off Time (toff):

480 ns

Nominal Turn On Time (ton):

48 ns

Maximum VCEsat:

2.2 V

Trade Compliance

HGT1S12N60C3DS Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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