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HGT1S20N60C3S9A

Onsemi

HGT1S20N60C3S9A by Onsemi

HGT1S20N60C3S9A by Onsemi is an N-CHANNEL IGBT for MOTOR CONTROL applications. It has a Max VCEsat of 1.8V, Max Collector-Emitter Voltage of 600V, and Max Power Dissipation of 164W. With a small outline package style and GULL WING terminals, it operates b/w -55 to 150 °C with fast rise time (28ns) and fall time (210ns).

Median Price

$2.960

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,310 parts In-Stock

1+ parts

$2.960

100+ parts

$2.780

1k+ parts

$2.520

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2,310

$2.960

$2.780

$2.520

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Distributors (In-Stock)

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Digiode

USA . 1,226 parts In-Stock

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$2.812

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1,226

$2.812

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Vyrian

USA . 1,990 parts In-Stock

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1,990

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Nova Conductors

Japan . 200 parts In-Stock

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200

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 1,912 parts In-Stock

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$1.328

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1,912

$1.328

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Corphita

USA . 649 parts In-Stock

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$2.664

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649

$2.664

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Corohmni

South Africa . 180 parts In-Stock

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$2.960

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180

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 12,514 parts In-Stock

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12,514

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Kulean Microsystems

USA . 7,996 parts In-Stock

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TANS Electronics

Latvia . 6,799 parts In-Stock

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6,799

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Continental Prestige Electronics

USA . 4,626 parts In-Stock

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Supply Digital

USA . 2,331 parts In-Stock

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Glotronic Ltd.

UK . 1,800 parts In-Stock

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1,800

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Problanco Electronics

Mexico . 1,293 parts In-Stock

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Aranea Global

USA . 1,000 parts In-Stock

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Kepictronics

USA . 800 parts In-Stock

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800

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SupplyDigital Components

Austria . 730 parts In-Stock

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730

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UHIMA Technologies

Türkiye . 224 parts In-Stock

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224

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Argo Parts USA

USA . 184 parts In-Stock

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184

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Overview

Unlock the power of precision and efficiency with the HGT1S20N60C3S9A by Onsemi. This high-quality Insulated Gate Bipolar Transistor (IGBT) is a game-changer in motor control applications, offering unparalleled performance and reliability. With Onsemi's reputation for excellence in semiconductor manufacturing, you can trust that this N-CHANNEL transistor delivers superior results. Say goodbye to inefficiency and hello to optimal performance with the HGT1S20N60C3S9A - your key to unlocking endless possibilities in electronic design.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for the components within the package, ensuring reliable performance.

Polarity or Channel Type: N-CHANNEL

Allows for efficient control of current flow in the transistor, enhancing its performance in motor control applications.

Configuration: SINGLE

Simplifies circuit design and integration, making it easier to use in various motor control systems.

Transistor Application: MOTOR CONTROL

Specifically designed for motor control applications, ensuring optimal performance and efficiency in such systems.

Maximum Rise Time (tr): 28 ns

Ensures fast switching speeds, crucial for responsive motor control and overall system efficiency.

Maximum VCEsat: 1.8 V

Low VCEsat minimizes power loss and heat dissipation, improving the efficiency of the transistor.

Package Shape: RECTANGULAR

Allows for space-efficient mounting and easy integration into circuit layouts.

Terminal Form: GULL WING

Facilitates surface mount installation, saving space and enhancing thermal performance.

Maximum Fall Time (tf): 210 ns

Ensures quick turn-off time, crucial for minimizing power loss and optimizing system response.

Nominal Turn Off Time (toff): 388 ns

Specifies the average turn-off time, critical for controlling the switching behavior of the transistor in motor control applications.

No. of Terminals: 2

Provides a simple two-terminal connection setup, making it easy to integrate into circuit designs.

Maximum Power Dissipation (Abs): 164 W

Can handle relatively high power levels, suitable for motor control applications that require high power outputs.

Package Style (Meter): SMALL OUTLINE

Compact package design saves board space and allows for efficient layout of components.

Maximum Operating Temperature: 150 °C

Can operate at high temperatures without compromising performance, ideal for demanding industrial environments.

Maximum Collector-Emitter Voltage: 600 V

High maximum voltage rating allows for safe operation in high voltage motor control applications.

Transistor Element Material: SILICON

Silicon is a common semiconductor material known for its reliability and performance in electronic devices.

Maximum Turn On Time (ton): 60 ns

Quick turn-on time ensures efficient switching behavior and reduces power loss during operation.

Maximum Gate-Emitter Voltage: 20 V

Safe gate-emitter voltage rating to prevent damage to the transistor during operation.

Minimum Operating Temperature: -55 °C

Can operate in low temperatures without performance degradation, suitable for a wide range of operating conditions.

Maximum Collector Current (IC): 45 A

High collector current rating enables the transistor to handle large current loads, essential for motor control applications.

Maximum Gate-Emitter Threshold Voltage: 6.3 V

Defines the minimum voltage required to turn on the transistor, ensuring reliable switching behavior.

Maximum Turn Off Time (toff): 660 ns

Specifies the maximum turn-off time, crucial for controlling the switching behavior in motor control applications.

Terminal Finish: Matte Tin (Sn) - annealed

Provides a reliable and durable terminal finish for long-term performance and solderability.

Terminal Position: SINGLE

Simple single terminal position for easy mounting and connectivity in circuit designs.

Case Connection: COLLECTOR

Collector case connection for efficient heat dissipation and thermal management.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperatures for a specified duration without affecting performance.

Peak Reflow Temperature °C: 260

Can withstand high reflow temperatures during assembly processes without damage.

Nominal Turn On Time (ton): 52 ns

Specifies the average turn-on time, important for controlling the switching behavior of the transistor in motor control applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) HGT1S20N60C3S9A attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Configuration:

Maximum Fall Time (tf):

210 ns

Maximum Gate-Emitter Threshold Voltage:

6.3 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Maximum Rise Time (tr):

28 ns

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

MOTOR CONTROL

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

660 ns

Nominal Turn Off Time (toff):

388 ns

Maximum Turn On Time (ton):

60 ns

Nominal Turn On Time (ton):

52 ns

Maximum VCEsat:

1.8 V

Trade Compliance

HGT1S20N60C3S9A Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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