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FF300R17ME4BOSA1

Infineon Technologies

FF300R17ME4BOSA1 by Infineon Technologies

FF300R17ME4BOSA1 by Infineon Technologies is an N-CHANNEL IGBT with 2 SERIES CONNECTED elements, built-in diode, and thermistor. It has a max voltage of 1700V and current of 375A, making it ideal for POWER CONTROL applications. With a turn-off time of 1520ns and turn-on time of 405ns, this RECTANGULAR package transistor operates at temperatures up to 175°C.

Median Price

$172.545

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 70 parts In-Stock

1+ parts

$136.200

100+ parts

$133.490

1k+ parts

$130.760

10k+ parts

-

70

$136.200

$133.490

$130.760

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DigiKey

USA . 8 parts In-Stock

1+ parts

$137.770

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8

$137.770

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Arrow

USA . 2 parts In-Stock

1+ parts

$207.320

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2

$207.320

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Verical

USA . 2 parts In-Stock

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$207.320

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2

$207.320

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Distributors (In-Stock)

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Digiode

USA . 29 parts In-Stock

1+ parts

$129.390

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29

$129.390

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Nova Conductors

Japan . 100 parts In-Stock

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$265.592

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100

$265.592

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Vyrian

USA . 5,267 parts In-Stock

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5,267

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Distributors (Availability)

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Corohmni

South Africa . 89 parts In-Stock

1+ parts

$0.733

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-

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89

$0.733

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Aztec Data Supply Inc.

USA . 184 parts In-Stock

1+ parts

$0.760

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184

$0.760

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Modulus Dynamics

Lithuania . 13,052 parts In-Stock

1+ parts

$1.275

100+ parts

$1.224

1k+ parts

$1.173

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-

13,052

$1.275

$1.224

$1.173

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AZTECH Wire

Italy . 191 parts In-Stock

1+ parts

$19.413

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191

$19.413

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Ampacity Inc.

Singapore . 20 parts In-Stock

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$115.770

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20

$115.770

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Semicontronic

India . 6 parts In-Stock

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$115.770

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$112.876

1k+ parts

$112.297

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6

$115.770

$112.876

$112.297

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Corphita

USA . 443 parts In-Stock

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$122.580

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443

$122.580

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Continental Prestige Electronics

USA . 14 parts In-Stock

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$135.220

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14

$135.220

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Netroflash

USA . 50 parts In-Stock

1+ parts

$265.592

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$252.313

10k+ parts

$247.001

50

$265.592

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$252.313

$247.001

QUARKTWIN TECHNOLOGY LTD

USA . 13,710 parts In-Stock

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13,710

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Microchip USA

USA . 8,191 parts In-Stock

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8,191

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Argo Parts USA

USA . 2,563 parts In-Stock

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2,563

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Perfect Parts

USA . 22 parts In-Stock

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22

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Overview

Unlock the power of efficient power control with the FF300R17ME4BOSA1 from Infineon Technologies. This insulated gate bipolar transistor (IGBT) boasts high-quality construction and advanced technology, making it the ideal choice for a range of applications. With features like built-in diodes and a thermistor, this product offers exceptional value and performance. Whether you're looking to optimize energy usage or improve system reliability, the FF300R17ME4BOSA1 delivers the benefits and advantages you need to stay ahead in today's competitive market.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs typically have lower on-state voltage drop and faster switching speeds compared to P-channel IGBTs, making them more efficient for power control applications.

Configuration: SERIES CONNECTED, CENTER TAP, 2 ELEMENTS WITH BUILT-IN DIODE AND THERMISTOR

This configuration allows for enhanced power control and protection capabilities in the device, making it suitable for applications where reliability and efficiency are key.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, this IGBT provides precise and efficient control over high-power systems.

Maximum Collector Current (IC): 375 A

With a high maximum collector current rating, this IGBT is capable of handling large amounts of current, making it suitable for high-power applications.

Nominal Turn Off Time (toff): 1520 ns

The relatively fast turn-off time of this IGBT allows for efficient switching and control of power, reducing losses and improving overall performance.

Maximum Collector-Emitter Voltage: 1700 V

With a high maximum collector-emitter voltage rating, this IGBT can withstand large voltage spikes and variations, ensuring robust operation in varied conditions.

Nominal Turn On Time (ton): 405 ns

The fast turn-on time of this IGBT enables quick and precise control over power switching, improving overall system efficiency and performance.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FF300R17ME4BOSA1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1700 V

JESD-30 Code:

R-XUFM-X11

No. of Elements:

2

No. of Terminals:

11

Maximum Operating Temperature:

175 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

1520 ns

Nominal Turn On Time (ton):

405 ns

Trade Compliance

FF300R17ME4BOSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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