Loading...

FF300R12KT3EHOSA1

Infineon Technologies

FF300R12KT3EHOSA1 by Infineon Technologies

FF300R12KT3EHOSA1 by Infineon Technologies is an N-CHANNEL IGBT with 2 elements and built-in diode. It has a max collector-emitter voltage of 1200V, collector current of 480A, and turn-off time of 680ns. Commonly used in power control applications due to its UL recognized reference standard and isolated case connection.

Median Price

$146.140

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 130 parts In-Stock

1+ parts

$134.380

100+ parts

$126.320

1k+ parts

$118.250

10k+ parts

-

130

$134.380

$126.320

$118.250

-

DigiKey

USA . 130 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

130

-

-

-

-

Verical

USA . 120 parts In-Stock

1+ parts

-

100+ parts

$157.900

1k+ parts

$147.813

10k+ parts

-

120

-

$157.900

$147.813

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 254 parts In-Stock

1+ parts

$135.299

100+ parts

-

1k+ parts

-

10k+ parts

-

254

$135.299

-

-

-

Vyrian

USA . 6,935 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,935

-

-

-

-

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 193 parts In-Stock

1+ parts

$0.881

100+ parts

-

1k+ parts

-

10k+ parts

-

193

$0.881

-

-

-

Modulus Dynamics

Lithuania . 10,289 parts In-Stock

1+ parts

$1.160

100+ parts

$1.114

1k+ parts

$1.067

10k+ parts

-

10,289

$1.160

$1.114

$1.067

-

Aztec Data Supply Inc.

USA . 1,930 parts In-Stock

1+ parts

$1.438

100+ parts

-

1k+ parts

-

10k+ parts

-

1,930

$1.438

-

-

-

AZTECH Wire

Italy . 520 parts In-Stock

1+ parts

$14.453

100+ parts

-

1k+ parts

-

10k+ parts

-

520

$14.453

-

-

-

Ampacity Inc.

Singapore . 10 parts In-Stock

1+ parts

$121.060

100+ parts

-

1k+ parts

-

10k+ parts

-

10

$121.060

-

-

-

Decca Corp

Germany . 10 parts In-Stock

1+ parts

$121.060

100+ parts

$118.639

1k+ parts

$117.452

10k+ parts

-

10

$121.060

$118.639

$117.452

-

Corphita

USA . 415 parts In-Stock

1+ parts

$128.178

100+ parts

-

1k+ parts

-

10k+ parts

-

415

$128.178

-

-

-

Microchip USA

USA . 8,704 parts In-Stock

1+ parts

$244.890

100+ parts

-

1k+ parts

-

10k+ parts

-

8,704

$244.890

-

-

-

Aranea Global

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,000

-

-

-

-

Argo Parts USA

USA . 1,736 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,736

-

-

-

-

Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

-

Perfect Parts

USA . 67 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

67

-

-

-

-

Continental Prestige Electronics

USA . 23 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

23

-

-

-

-

Overview

Unlock the full potential of your power control applications with the FF300R12KT3EHOSA1 from Infineon Technologies, a leading manufacturer in the industry. This insulated gate bipolar transistor (IGBT) offers superior quality and reliability, making it ideal for a wide range of uses. With its N-channel polarity and common emitter configuration, this product provides customers with exceptional performance and efficiency. Experience the value and benefits of the FF300R12KT3EHOSA1, featuring a maximum collector-emitter voltage of 1200V and a maximum collector current of 480A. Trust in Infineon Technologies to deliver cutting-edge solutions for all your power control needs.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL IGBTs are known for their high efficiency and fast switching speed, making them suitable for power control applications.

Configuration: COMMON EMITTER, 2 ELEMENTS WITH BUILT-IN DIODE

The common emitter configuration provides high current gain and the built-in diode allows for efficient switching and protection against voltage spikes.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, this IGBT is optimized for handling high voltages and currents efficiently.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy mounting and efficient heat dissipation, increasing the reliability and performance of the device.

Maximum Collector-Emitter Voltage: 1200 V

With a high maximum collector-emitter voltage, this IGBT can handle high voltage levels, making it suitable for demanding power control applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FF300R12KT3EHOSA1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

JESD-30 Code:

R-XUFM-X7

No. of Elements:

2

No. of Terminals:

7

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Reference Standard:

UL RECOGNIZED

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

680 ns

Nominal Turn On Time (ton):

215 ns

Trade Compliance

FF300R12KT3EHOSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20