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FF300R12ME4PB11BPSA1

Infineon Technologies

FF300R12ME4PB11BPSA1 by Infineon Technologies

FF300R12ME4PB11BPSA1 by Infineon Technologies is an N-CHANNEL IGBT with 2 SERIES CONNECTED elements. It has a Max VCEsat of 2.1V and Nominal Turn Off Time of 720ns, making it ideal for POWER CONTROL applications. With a Max Collector-Emitter Voltage of 1200V and operating temperature range from -40 to 150 °C, this RECTANGULAR package transistor offers efficient performance in various power control systems.

Median Price

$124.200

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 6 parts In-Stock

1+ parts

$124.200

100+ parts

$113.730

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6

$124.200

$113.730

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Distributors (In-Stock)

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Nova Conductors

Japan . 75 parts In-Stock

1+ parts

$211.024

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75

$211.024

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Vyrian

USA . 7,382 parts In-Stock

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Digiode

USA . 927 parts In-Stock

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927

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Distributors (Availability)

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Corohmni

South Africa . 59 parts In-Stock

1+ parts

$0.435

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59

$0.435

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Aztec Data Supply Inc.

USA . 186 parts In-Stock

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$1.180

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186

$1.180

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Modulus Dynamics

Lithuania . 2,433 parts In-Stock

1+ parts

$1.943

100+ parts

$1.865

1k+ parts

$1.788

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-

2,433

$1.943

$1.865

$1.788

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Ampacity Inc.

Singapore . 929 parts In-Stock

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$8.050

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929

$8.050

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AZTECH Wire

Italy . 217 parts In-Stock

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$17.936

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217

$17.936

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Semicontronic

India . 908 parts In-Stock

1+ parts

$22.050

100+ parts

$21.499

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$21.388

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908

$22.050

$21.499

$21.388

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Aranea Global

USA . 100 parts In-Stock

1+ parts

$206.804

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$198.531

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100

$206.804

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$198.531

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Continental Prestige Electronics

USA . 4,202 parts In-Stock

1+ parts

$211.024

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$206.804

4,202

$211.024

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$206.804

Microchip USA

USA . 9,988 parts In-Stock

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$321.142

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9,988

$321.142

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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Argo Parts USA

USA . 1,134 parts In-Stock

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Corphita

USA . 954 parts In-Stock

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954

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Overview

Unlock the power of efficient and reliable power control with the FF300R12ME4PB11BPSA1 by Infineon Technologies. As a leader in the industry, Infineon Technologies delivers top-quality Insulated Gate Bipolar Transistors (IGBT) that are perfect for a wide range of applications. From industrial machinery to renewable energy systems, this N-CHANNEL transistor offers superior performance and durability. With built-in diode and thermistor, this series connected, center tap configuration ensures seamless operation. Experience the value and benefits of Infineon Technologies' cutting-edge technology with the FF300R12ME4PB11BPSA1.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs are known for their high efficiency and fast switching speeds, making them ideal for power control applications.

Configuration: SERIES CONNECTED, CENTER TAP, 2 ELEMENTS WITH BUILT-IN DIODE AND THERMISTOR

This configuration allows for more precise power control and protection against overcurrent conditions, ensuring the reliability of the device.

Maximum VCEsat: 2.1 V

The low VCEsat value indicates minimal power loss during operation, resulting in higher efficiency and lower heat dissipation.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this IGBT can withstand harsh environmental conditions and maintain stable performance.

Maximum Collector-Emitter Voltage: 1200 V

The high collector-emitter voltage rating allows the device to handle high voltage applications without risk of damage.

Nominal Turn On Time (ton): 240 ns

The fast turn-on time ensures quick response to control signals, leading to efficient power switching and improved overall performance.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FF300R12ME4PB11BPSA1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector-Emitter Voltage:

1200 V

Maximum Gate-Emitter Threshold Voltage:

6.4 V

Maximum Gate-Emitter Voltage:

20 V

JESD-30 Code:

R-XUFM-X11

No. of Elements:

2

No. of Terminals:

11

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

720 ns

Nominal Turn On Time (ton):

240 ns

Maximum VCEsat:

2.1 V

Trade Compliance

FF300R12ME4PB11BPSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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