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FF300R12KE4HOSA1

Infineon Technologies

FF300R12KE4HOSA1 by Infineon Technologies

FF300R12KE4HOSA1 by Infineon Technologies is a N-CHANNEL IGBT with 2 SERIES CONNECTED elements, built-in diode, and 800 ns turn off time. It operates at a max temperature of 150°C, has a collector-emitter voltage of 1200V, and can handle a max current of 460A. Ideal for high-power applications requiring fast switching capabilities.

Median Price

$103.914

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 10 parts In-Stock

1+ parts

$98.390

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-

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10

$98.390

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Arrow

USA . 10 parts In-Stock

1+ parts

$99.177

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10

$99.177

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DigiKey

USA . 292 parts In-Stock

1+ parts

$108.650

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292

$108.650

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Newark

USA . 55 parts In-Stock

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$112.580

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55

$112.580

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Chip1Stop

Japan . 20 parts In-Stock

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$133.000

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20

$133.000

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Rochester

USA . 4 parts In-Stock

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$91.280

1k+ parts

$81.670

10k+ parts

$76.860

4

-

$91.280

$81.670

$76.860

Distributors (In-Stock)

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Digiode

USA . 187 parts In-Stock

1+ parts

$90.155

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187

$90.155

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Nova Conductors

Japan . 500 parts In-Stock

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$168.070

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500

$168.070

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Vyrian

USA . 3,118 parts In-Stock

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3,118

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Chip Stock

USA . 131 parts In-Stock

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Rutronik

Germany . 10 parts In-Stock

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$97.160

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10

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$97.160

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NAC Semi

USA . 10 parts In-Stock

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10

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Distributors (Availability)

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Modulus Dynamics

Lithuania . 12,572 parts In-Stock

1+ parts

$1.558

100+ parts

$1.496

1k+ parts

$1.433

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12,572

$1.558

$1.496

$1.433

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AZTECH Wire

Italy . 482 parts In-Stock

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$13.166

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482

$13.166

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Semicontronic

India . 13 parts In-Stock

1+ parts

$80.670

100+ parts

$78.653

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$78.250

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13

$80.670

$78.653

$78.250

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Corphita

USA . 868 parts In-Stock

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$85.410

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868

$85.410

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Continental Prestige Electronics

USA . 6,309 parts In-Stock

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$168.070

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$164.709

6,309

$168.070

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$164.709

Netroflash

USA . 50 parts In-Stock

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$168.070

100+ parts

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$159.667

10k+ parts

$156.305

50

$168.070

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$159.667

$156.305

Ampacity Inc.

Singapore . 13 parts In-Stock

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$175.570

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13

$175.570

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Microchip USA

USA . 7,959 parts In-Stock

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$242.310

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$242.310

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A-Z Elektronik GmbH

Germany . 4,797 parts In-Stock

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4,797

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Argo Parts USA

USA . 3,904 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,198 parts In-Stock

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3,198

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Perfect Parts

USA . 27 parts In-Stock

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27

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Overview

Enhance your power electronics projects with the FF300R12KE4HOSA1 by Infineon Technologies, a top-quality Insulated Gate Bipolar Transistor (IGBT) that offers superior performance and reliability. Infineon's reputation for excellence ensures that you are investing in a product that will meet your needs and exceed your expectations. Ideal for a wide range of applications, this N-CHANNEL IGBT with built-in diode is designed for efficiency and durability. Experience the value and benefits of Infineon's cutting-edge technology with the FF300R12KE4HOSA1, your ultimate solution for advanced power control.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs typically have lower conduction losses and higher efficiency compared to P-channel IGBTs, making them a good choice for high power applications.

Configuration: SERIES CONNECTED, CENTER TAP, 2 ELEMENTS WITH BUILT-IN DIODE

This configuration allows for higher voltage ratings and increased reliability, making it suitable for applications requiring robust performance.

Nominal Turn Off Time (toff): 800 ns

Fast turn off time helps in reducing switching losses and improving efficiency, making this IGBT suitable for high-speed applications.

Maximum Collector-Emitter Voltage: 1200 V

High voltage rating allows for use in applications requiring high breakdown voltages, such as power supplies and motor control.

Maximum Collector Current (IC): 460 A

High collector current rating enables the IGBT to handle large amounts of current, making it suitable for high power applications.

Nominal Turn On Time (ton): 325 ns

Fast turn on time helps in reducing switching losses and improving efficiency, making this IGBT ideal for applications requiring rapid switching.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FF300R12KE4HOSA1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

JESD-30 Code:

R-XUFM-X7

No. of Elements:

2

No. of Terminals:

7

Maximum Operating Temperature:

150 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

800 ns

Nominal Turn On Time (ton):

325 ns

Trade Compliance

FF300R12KE4HOSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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