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FS75R12KE3BOSA1

Infineon Technologies

FS75R12KE3BOSA1 by Infineon Technologies

FS75R12KE3BOSA1 by Infineon is a N-CHANNEL IGBT with 6 elements, built-in diode, and thermistor. It has a max voltage of 1200V, current of 105A, and turn off time of 610ns. Ideal for high-power applications requiring fast switching such as motor drives and power supplies.

Median Price

$139.410

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 900 parts In-Stock

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$139.410

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900

$139.410

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Vyrian

USA . 5,363 parts In-Stock

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Digiode

USA . 426 parts In-Stock

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426

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 242 parts In-Stock

1+ parts

$0.690

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242

$0.690

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Modulus Dynamics

Lithuania . 22,180 parts In-Stock

1+ parts

$1.677

100+ parts

$1.610

1k+ parts

$1.543

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22,180

$1.677

$1.610

$1.543

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Corohmni

South Africa . 342 parts In-Stock

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$1.767

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342

$1.767

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Ampacity Inc.

Singapore . 1,026 parts In-Stock

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$13.050

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1,026

$13.050

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AZTECH Wire

Italy . 336 parts In-Stock

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$17.852

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336

$17.852

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Semicontronic

India . 1,490 parts In-Stock

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$38.050

100+ parts

$37.099

1k+ parts

$36.908

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1,490

$38.050

$37.099

$36.908

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Component Stockers USA

USA . 714 parts In-Stock

1+ parts

$99.990

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714

$99.990

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Continental Prestige Electronics

USA . 6,512 parts In-Stock

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$136.680

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$133.946

6,512

$136.680

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$133.946

Netroflash

USA . 100 parts In-Stock

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$139.410

100+ parts

$136.622

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100

$139.410

$136.622

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$140.797

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$140.797

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$140.797

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1,000

$140.797

$140.797

$140.797

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QUARKTWIN TECHNOLOGY LTD

USA . 8,691 parts In-Stock

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Authorized Procurement Solutions

USA . 8,000 parts In-Stock

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Microchip USA

USA . 3,701 parts In-Stock

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Argo Parts USA

USA . 660 parts In-Stock

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660

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Corphita

USA . 390 parts In-Stock

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390

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Perfect Parts

USA . 11 parts In-Stock

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Overview

Discover the superior performance and reliability of the FS75R12KE3BOSA1 by Infineon Technologies. As a leading manufacturer in the industry, Infineon Technologies brings you an Insulated Gate Bipolar Transistor (IGBT) that excels in a variety of applications. With its N-CHANNEL polarity and 6-element configuration, this product offers unmatched efficiency and power handling capabilities. Whether you're looking to optimize your industrial processes or enhance your renewable energy systems, the FS75R12KE3BOSA1 delivers exceptional value with its high-quality construction and advanced features. Elevate your projects with the innovative technology of Infineon Technologies.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL IGBTs typically have lower on-state voltage drops and higher switching speeds compared to P-CHANNEL IGBTs, making them more efficient for many applications.

Configuration: BRIDGE, 6 ELEMENTS WITH BUILT-IN DIODE AND THERMISTOR

The built-in diode and thermistor add convenience and functionality to the IGBT, making it easier to integrate into circuits and providing temperature protection.

Maximum Collector-Emitter Voltage: 1200 V

This high voltage rating allows the IGBT to handle high voltages safely, making it suitable for applications where high power levels are required.

Maximum Collector Current (IC): 105 A

With a high collector current rating, this IGBT can handle large currents without overheating, making it suitable for high-power applications.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature allows the IGBT to withstand elevated temperatures, ensuring reliable performance even in demanding environments.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FS75R12KE3BOSA1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

JESD-30 Code:

R-XUFM-X28

No. of Elements:

6

No. of Terminals:

28

Maximum Operating Temperature:

150 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

610 ns

Nominal Turn On Time (ton):

340 ns

Trade Compliance

FS75R12KE3BOSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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