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FS75R12KE3GBOSA1

Infineon Technologies

FS75R12KE3GBOSA1 by Infineon Technologies

FS75R12KE3GBOSA1 by Infineon Technologies is an N-CHANNEL IGBT with 6 elements in a bridge configuration. It has a max collector-emitter voltage of 1200V, collector current of 100A, and turn-off time of 610ns. Ideal for applications requiring high power switching such as motor drives and inverters due to its silicon transistor element material and isolated case connection.

Median Price

$120.915

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

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DigiKey

USA . 10 parts In-Stock

1+ parts

$94.830

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10

$94.830

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Chip1Stop

Japan . 10 parts In-Stock

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$147.000

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$147.000

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Verical

USA . 10 parts In-Stock

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$154.000

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$154.000

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Rochester

USA . 28 parts In-Stock

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$77.600

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$69.430

10k+ parts

$65.340

28

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$77.600

$69.430

$65.340

Distributors (In-Stock)

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Digiode

USA . 318 parts In-Stock

1+ parts

$92.996

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318

$92.996

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TodayComponents

USA . 100 parts In-Stock

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$140.940

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$127.400

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100

$140.940

$127.400

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Nova Conductors

Japan . 59 parts In-Stock

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$154.520

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Vyrian

USA . 7,196 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 557 parts In-Stock

1+ parts

$0.382

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557

$0.382

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Aztec Data Supply Inc.

USA . 163 parts In-Stock

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$1.663

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163

$1.663

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Modulus Dynamics

Lithuania . 13,007 parts In-Stock

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$1.992

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$1.912

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$1.833

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13,007

$1.992

$1.912

$1.833

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Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$2.184

100+ parts

$1.987

1k+ parts

$1.791

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$2.184

$1.987

$1.791

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AZTECH Wire

Italy . 463 parts In-Stock

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$18.260

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Andel Nordic

Denmark . 500 parts In-Stock

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$59.060

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$41.343

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$41.343

500

$59.060

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$41.343

$41.343

Semicontronic

India . 23 parts In-Stock

1+ parts

$83.210

100+ parts

$81.130

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$80.714

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$80.714

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Corphita

USA . 415 parts In-Stock

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$88.101

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Netroflash

USA . 2,000 parts In-Stock

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$154.520

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$154.520

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Continental Prestige Electronics

USA . 8 parts In-Stock

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$155.390

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8

$155.390

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Ampacity Inc.

Singapore . 23 parts In-Stock

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$181.100

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Microchip USA

USA . 8,510 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Argo Parts USA

USA . 3,045 parts In-Stock

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Overview

Unleash the power of Infineon Technologies with the FS75R12KE3GBOSA1 Insulated Gate Bipolar Transistor (IGBT). This N-CHANNEL transistor boasts a BRIDGE configuration with 6 elements, built-in diode, and thermistor for optimal performance. With a maximum collector-emitter voltage of 1200V and a nominal turn-off time of just 610 ns, this IGBT is a game-changer in power electronics. From motor drives to renewable energy systems, the FS75R12KE3GBOSA1 offers unmatched reliability and efficiency, making it the go-to choice for your next project. Elevate your designs with the industry-leading quality and performance of Infineon Technologies.

Feature Benefit Bullets

Polarity or Channel Type

N-channel IGBTs generally have lower on-state voltage drop and faster switching speed compared to P-channel types, making them suitable for high-power applications.

Configuration

The built-in diode and thermistor enhance the overall performance and efficiency of the IGBT bridge configuration.

Package Shape

Rectangular packages are easier to mount and provide better thermal management for the IGBT components.

Nominal Turn Off Time (toff)

The fast turn-off time helps improve the switching speed and efficiency of the IGBT, making it suitable for high-frequency applications.

Maximum Collector-Emitter Voltage

With a high maximum collector-emitter voltage rating, this IGBT can handle high voltage levels, making it suitable for power electronics applications.

Maximum Collector Current (IC)

The high collector current rating enables the IGBT to handle high current loads, making it suitable for high-power applications.

Nominal Turn On Time (ton)

The fast turn-on time helps improve the switching speed and efficiency of the IGBT, making it suitable for high-frequency applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FS75R12KE3GBOSA1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

JESD-30 Code:

R-XUFM-X35

No. of Elements:

6

No. of Terminals:

35

Maximum Operating Temperature:

150 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

610 ns

Nominal Turn On Time (ton):

340 ns

Trade Compliance

FS75R12KE3GBOSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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