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NGTB03N60R2DT4G

Onsemi

NGTB03N60R2DT4G by Onsemi

NGTB03N60R2DT4G by Onsemi is an N-CHANNEL IGBT with a max VCEsat of 2.1V and IC of 9A, ideal for power control applications. It features a built-in diode, small outline package style, and can operate at temperatures up to 175°C. This transistor has a turn-off time of 105ns and is designed for surface mount assembly with gull wing terminals.

Median Price

$0.396

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 10,662 parts In-Stock

1+ parts

-

100+ parts

$0.396

1k+ parts

$0.329

10k+ parts

$0.293

10,662

-

$0.396

$0.329

$0.293

Verical

USA . 6,160 parts In-Stock

1+ parts

-

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-

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10k+ parts

$0.345

6,160

-

-

-

$0.345

Arrow

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

-

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10k+ parts

$0.510

2,500

-

-

-

$0.510

Distributors (In-Stock)

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Digiode

USA . 2,350 parts In-Stock

1+ parts

$0.309

100+ parts

-

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2,350

$0.309

-

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Vyrian

USA . 6,873 parts In-Stock

1+ parts

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6,873

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Distributors (Availability)

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Ampacity Inc.

Singapore . 6,878 parts In-Stock

1+ parts

$0.276

100+ parts

-

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6,878

$0.276

-

-

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Semicontronic

India . 6,135 parts In-Stock

1+ parts

$0.276

100+ parts

$0.269

1k+ parts

$0.268

10k+ parts

-

6,135

$0.276

$0.269

$0.268

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Corphita

USA . 260 parts In-Stock

1+ parts

$0.292

100+ parts

-

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260

$0.292

-

-

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Aztec Data Supply Inc.

USA . 2,694 parts In-Stock

1+ parts

$0.320

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-

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2,694

$0.320

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Corohmni

South Africa . 91 parts In-Stock

1+ parts

$0.325

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-

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91

$0.325

-

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Modulus Dynamics

Lithuania . 100 parts In-Stock

1+ parts

$2.186

100+ parts

$2.186

1k+ parts

$2.186

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-

100

$2.186

$2.186

$2.186

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AZTECH Wire

Italy . 919 parts In-Stock

1+ parts

$14.650

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919

$14.650

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Kulean Microsystems

USA . 8,350 parts In-Stock

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Continental Prestige Electronics

USA . 4,701 parts In-Stock

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Kepictronics

USA . 4,500 parts In-Stock

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4,500

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Problanco Electronics

Mexico . 3,893 parts In-Stock

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3,893

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Lixinc

USA . 2,815 parts In-Stock

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2,815

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Argo Parts USA

USA . 2,546 parts In-Stock

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2,546

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SupplyDigital Components

Austria . 2,217 parts In-Stock

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2,217

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TANS Electronics

Latvia . 1,788 parts In-Stock

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1,788

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Bastille Electronics

Australia . 1,000 parts In-Stock

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1,000

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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500

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UHIMA Technologies

Türkiye . 211 parts In-Stock

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211

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Overview

Unlock the power of advanced technology with the NGTB03N60R2DT4G by Onsemi. Manufactured by a trusted industry leader, this Insulated Gate Bipolar Transistor (IGBT) offers exceptional quality and performance for power control applications. With a single configuration and built-in diode, this transistor provides unparalleled value and benefits to customers seeking efficient and reliable solutions. Trust in Onsemi's expertise and experience to elevate your projects to new heights with the NGTB03N60R2DT4G.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the components inside, ensuring a longer lifespan for the product.

Polarity or Channel Type: N-CHANNEL

Allows for efficient current flow and control, making it suitable for power control applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies circuit design and saves space by integrating a diode within the transistor.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, ensuring reliable performance.

Maximum VCEsat: 2.1 V

Low saturation voltage results in reduced power losses and increased efficiency.

Package Shape: RECTANGULAR

Provides a compact and space-saving form factor for easy integration into various systems.

Nominal Turn Off Time (toff): 105 ns

Fast turn-off time allows for swift control and response in power switching applications.

Maximum Power Dissipation (Abs): 49 W

High power dissipation capability allows for handling of large power loads without overheating.

Maximum Operating Temperature: 175 °C

Ability to operate at high temperatures ensures reliability and stability in varying environmental conditions.

Maximum Collector-Emitter Voltage: 600 V

High collector-emitter voltage rating enables this IGBT to handle high voltage levels.

Maximum Gate-Emitter Voltage: 20 V

Provides sufficient gate-emitter voltage for effective control and switching of the transistor.

Maximum Collector Current (IC): 9 A

High collector current rating allows for handling of large current loads.

Maximum Gate-Emitter Threshold Voltage: 7 V

Threshold voltage ensures reliable turn-on and turn-off operation of the IGBT.

Terminal Finish: MATTE TIN

Provides a reliable and corrosion-resistant finish for the terminals.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) NGTB03N60R2DT4G attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

9 A

Maximum Collector-Emitter Voltage:

600 V

Maximum Gate-Emitter Threshold Voltage:

7 V

Maximum Gate-Emitter Voltage:

20 V

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

105 ns

Nominal Turn On Time (ton):

134 ns

Maximum VCEsat:

2.1 V

Trade Compliance

NGTB03N60R2DT4G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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