Loading...

NGTB50N60FLWG

Onsemi

NGTB50N60FLWG by Onsemi

NGTB50N60FLWG by Onsemi is an N-CHANNEL IGBT with 600V VCE, 100A IC, and 223W power dissipation. Ideal for high-power applications requiring efficient switching at up to 150°C operating temperature.

Median Price

$2.250

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 30 parts In-Stock

1+ parts

$2.250

100+ parts

$2.210

1k+ parts

$2.160

10k+ parts

-

30

$2.250

$2.210

$2.160

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$4.185

100+ parts

-

1k+ parts

-

10k+ parts

-

10

$4.185

-

-

-

Vyrian

USA . 7,158 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,158

-

-

-

-

Digiode

USA . 1,770 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,770

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 91 parts In-Stock

1+ parts

$4.019

100+ parts

-

1k+ parts

-

10k+ parts

-

91

$4.019

-

-

-

Argo Parts USA

USA . 3,692 parts In-Stock

1+ parts

$4.185

100+ parts

-

1k+ parts

-

10k+ parts

-

3,692

$4.185

-

-

-

AZTECH Wire

Italy . 860 parts In-Stock

1+ parts

$11.041

100+ parts

-

1k+ parts

-

10k+ parts

-

860

$11.041

-

-

-

Ampacity Inc.

Singapore . 317 parts In-Stock

1+ parts

$39.050

100+ parts

-

1k+ parts

-

10k+ parts

-

317

$39.050

-

-

-

GreenTree Electronics

Israel . 17,460 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

17,460

-

-

-

-

Kepictronics

USA . 15,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

15,000

-

-

-

-

Perfect Parts

USA . 3,899 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,899

-

-

-

-

Problanco Electronics

Mexico . 3,549 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,549

-

-

-

-

TANS Electronics

Latvia . 2,084 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,084

-

-

-

-

Corphita

USA . 1,700 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,700

-

-

-

-

Kulean Microsystems

USA . 1,096 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,096

-

-

-

-

SupplyDigital Components

Austria . 843 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

843

-

-

-

-

UHIMA Technologies

Türkiye . 747 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

747

-

-

-

-

Authorized Procurement Solutions

USA . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

500

-

-

-

-

Netroflash

USA . 100 parts In-Stock

1+ parts

-

100+ parts

$4.101

1k+ parts

$3.976

10k+ parts

$3.892

100

-

$4.101

$3.976

$3.892

Overview

Unleash the power of innovation with the NGTB50N60FLWG by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch quality and reliability in their Insulated Gate Bipolar Transistors (IGBT). The N-CHANNEL design ensures enhanced performance and efficiency, making it ideal for a wide range of applications. With a maximum power dissipation of 223 W and a collector-emitter voltage of 600 V, this IGBT offers unmatched value and benefits to customers looking to optimize their systems. Upgrade your technology with Onsemi's NGTB50N60FLWG and experience the difference.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL IGBTs are more efficient and have lower conduction losses compared to P-CHANNEL IGBTs, making them ideal for high power applications.

Maximum Power Dissipation (Abs): 223 W

With a high maximum power dissipation, this IGBT can handle high power levels without overheating, ensuring reliable performance in demanding applications.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature allows this IGBT to operate in harsh environments with elevated temperatures without compromising performance.

Maximum Collector-Emitter Voltage: 600 V

The high maximum collector-emitter voltage rating provides a wide margin of safety in high voltage applications, ensuring stable operation under varying conditions.

Maximum Gate-Emitter Voltage: 20 V

The maximum gate-emitter voltage rating ensures that the IGBT is well protected against overvoltage conditions, reducing the risk of damage and enhancing overall reliability.

Maximum Collector Current (IC): 100 A

With a high maximum collector current rating, this IGBT can handle large currents, making it suitable for high power applications where high currents are required.

Maximum Gate-Emitter Threshold Voltage: 6.5 V

The gate-emitter threshold voltage indicates the minimum voltage required to turn on the IGBT, allowing for precise control of the device in various operating conditions.

Terminal Finish: Tin (Sn)

Tin terminal finish provides good solderability and conductivity, ensuring secure connections and efficient current flow in the IGBT application.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) NGTB50N60FLWG attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Maximum Gate-Emitter Threshold Voltage:

6.5 V

Maximum Gate-Emitter Voltage:

20 V

JESD-609 Code:

e3

Maximum Operating Temperature:

150 Cel

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Finish:

Tin (Sn)

Trade Compliance

NGTB50N60FLWG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 19