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NXH50C120L2C2ES1G

Onsemi

NXH50C120L2C2ES1G by Onsemi

NXH50C120L2C2ES1G by Onsemi is an IGBT transistor with 6 elements in a bridge configuration. It has a max VCEsat of 2.4V and can handle up to 50A of collector current. Ideal for power control applications, it operates b/w -40°C to 150°C temperature range.

Median Price

$107.920

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 10 parts In-Stock

1+ parts

$107.920

100+ parts

$91.440

1k+ parts

$87.490

10k+ parts

$87.460

10

$107.920

$91.440

$87.490

$87.460

DigiKey

USA . 1,237 parts In-Stock

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Rochester

USA . 18 parts In-Stock

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$79.270

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$70.920

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$66.750

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$79.270

$70.920

$66.750

Verical

USA . 12 parts In-Stock

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$112.537

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$101.763

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$101.763

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Distributors (In-Stock)

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Nova Conductors

Japan . 100 parts In-Stock

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$85.420

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$85.420

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Digiode

USA . 942 parts In-Stock

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$90.991

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Flip Electronics

USA . 1,237 parts In-Stock

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Vyrian

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DigiKey Marketplace

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 4,534 parts In-Stock

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$1.410

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$1.410

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Advanced Electronics

New Zealand . 270 parts In-Stock

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$1.591

100+ parts

$1.512

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$1.512

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270

$1.591

$1.512

$1.512

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Ampacity Inc.

Singapore . 67 parts In-Stock

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$81.410

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$81.410

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Corohmni

South Africa . 82 parts In-Stock

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$83.711

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Continental Prestige Electronics

USA . 4,510 parts In-Stock

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$85.420

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$83.711

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$83.711

Netroflash

USA . 500 parts In-Stock

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$85.420

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$85.420

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Corphita

USA . 642 parts In-Stock

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$86.202

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642

$86.202

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Semicontronic

India . 163 parts In-Stock

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$177.190

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$172.760

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$171.874

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163

$177.190

$172.760

$171.874

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Microchip USA

USA . 3,514 parts In-Stock

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$194.442

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QUARKTWIN TECHNOLOGY LTD

USA . 18,574 parts In-Stock

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Kulean Microsystems

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SupplyDigital Components

Austria . 6,343 parts In-Stock

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Problanco Electronics

Mexico . 5,891 parts In-Stock

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TANS Electronics

Latvia . 3,174 parts In-Stock

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Authorized Procurement Solutions

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Argo Parts USA

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UHIMA Technologies

Türkiye . 785 parts In-Stock

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Overview

Elevate your power control systems with the NXH50C120L2C2ES1G by Onsemi. As a leading manufacturer in the industry, Onsemi has crafted this insulated gate bipolar transistor to deliver exceptional performance and reliability. Ideal for applications requiring high efficiency and precision, this N-channel IGBT offers a seamless integration into various power control setups. With a maximum collector-emitter voltage of 1200V and a collector current of 50A, this transistor provides unmatched power handling capabilities. Experience the value and benefits of superior quality with the NXH50C120L2C2ES1G by Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the transistor, making it a reliable choice for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs offer high efficiency and fast switching speeds, making them suitable for power control applications.

Configuration: BRIDGE, 6 ELEMENTS WITH BUILT-IN DIODE

The bridge configuration with built-in diode allows for convenient circuit design and efficient power control in diverse systems.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, this IGBT offers high performance and reliability in managing power output.

Maximum VCEsat: 2.4 V

With a low VCEsat value, this IGBT minimizes power loss and heat generation, improving overall efficiency in power control systems.

Package Shape: RECTANGULAR

The rectangular shape of the package offers easy mounting and space-saving design, making it ideal for compact electronic devices.

Terminal Form: THROUGH-HOLE

The through-hole terminals provide secure connections and easy installation in circuit boards, ensuring stable operation.

No. of Elements: 6

With 6 elements, this IGBT offers enhanced performance and power handling capabilities, making it suitable for high-power applications.

Nominal Turn Off Time (toff): 616 ns

The fast turn-off time of 616 ns allows for precise control and efficient power switching, improving system performance.

No. of Terminals: 26

The 26 terminals provide ample connectivity options and flexibility in circuit design, making it versatile for different applications.

Package Style (Meter): IN-LINE

The in-line package style offers easy integration into existing systems, allowing for seamless power control implementation.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this IGBT can withstand harsh environments and maintain stable performance under varying conditions.

Maximum Collector-Emitter Voltage: 1200 V

The high VCE voltage rating ensures reliable operation and protection against voltage spikes, making it suitable for high-voltage applications.

Transistor Element Material: SILICON

Made of silicon material, this IGBT provides excellent performance, durability, and reliability in power control applications.

Maximum Gate-Emitter Voltage: 20 V

The 20 V maximum gate-emitter voltage ensures safe and efficient operation, protecting the transistor from damage due to overvoltage.

Minimum Operating Temperature: -40 °C

With a low minimum operating temperature, this IGBT can function effectively in cold environments, offering reliability in various conditions.

Maximum Collector Current (IC): 50 A

With a high collector current rating of 50 A, this IGBT can handle large power loads and provide stable operation in high-current applications.

Maximum Gate-Emitter Threshold Voltage: 6.8 V

The 6.8 V gate-emitter threshold voltage ensures precise control and efficient switching, improving overall system performance.

Terminal Position: DUAL

The dual terminal position offers flexibility in circuit connection and layout, allowing for easy integration into different systems.

Case Connection: ISOLATED

The isolated case connection provides enhanced safety and protection against electrical hazards, ensuring reliable operation in power control applications.

Nominal Turn On Time (ton): 248 ns

The fast turn-on time of 248 ns facilitates quick response and precise power switching, enhancing performance in power control systems.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) NXH50C120L2C2ES1G attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Maximum Gate-Emitter Threshold Voltage:

6.8 V

Maximum Gate-Emitter Voltage:

20 V

JESD-30 Code:

R-PDIP-T26

No. of Elements:

6

No. of Terminals:

26

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Polarity or Channel Type:

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

DUAL

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

616 ns

Nominal Turn On Time (ton):

248 ns

Maximum VCEsat:

2.4 V

Trade Compliance

NXH50C120L2C2ES1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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