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NXH50C120L2C2ESG

Onsemi

NXH50C120L2C2ESG by Onsemi

NXH50C120L2C2ESG by Onsemi is an N-CHANNEL IGBT with 1200V VCEsat, 50A IC, and 616ns toff. Ideal for power control applications requiring a BRIDGE configuration with built-in diode and thermistor. Package: PLASTIC/EPOXY, Terminals: THROUGH-HOLE, Temp Range: -40°C to 150°C.

Median Price

$95.480

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 3 parts In-Stock

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$85.990

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Mouser Electronics

USA . 13 parts In-Stock

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$100.100

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$98.560

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$100.100

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Element14

Singapore . 3 parts In-Stock

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$131.060

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$131.060

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Rochester

USA . 36 parts In-Stock

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$90.860

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$81.290

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$76.510

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$90.860

$81.290

$76.510

Verical

USA . 36 parts In-Stock

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$113.575

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$101.612

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$95.638

36

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$113.575

$101.612

$95.638

DigiKey

USA . 18 parts In-Stock

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$72.840

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Flip Electronics (Authorized)

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Digiode

USA . 2,448 parts In-Stock

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$37.753

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$37.753

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Vyrian

USA . 2,908 parts In-Stock

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Flip Electronics

USA . 18 parts In-Stock

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Corphita

USA . 1,157 parts In-Stock

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$35.766

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Corohmni

South Africa . 452 parts In-Stock

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$39.740

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$39.740

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Continental Prestige Electronics

USA . 3 parts In-Stock

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$69.240

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Microchip USA

USA . 2,724 parts In-Stock

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$192.510

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Kulean Microsystems

USA . 7,848 parts In-Stock

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TANS Electronics

Latvia . 7,421 parts In-Stock

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Problanco Electronics

Mexico . 6,160 parts In-Stock

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Authorized Procurement Solutions

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SupplyDigital Components

Austria . 3,566 parts In-Stock

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UHIMA Technologies

Türkiye . 504 parts In-Stock

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Perfect Parts

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Overview

Enhance your power control solutions with the NXH50C120L2C2ESG by Onsemi. As a leading manufacturer in insulated gate bipolar transistors (IGBT), Onsemi delivers top-notch quality and reliability. This versatile product is perfect for a wide range of applications, offering a seamless blend of performance and efficiency. With its N-channel configuration and built-in diode, this transistor ensures optimal power control. Experience the value and benefits of the NXH50C120L2C2ESG and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for the transistor, ensuring durability and reliable performance.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs generally have lower conduction losses and higher switching speeds, making them suitable for high-power applications.

Configuration: BRIDGE, 6 ELEMENTS WITH BUILT-IN DIODE, 1 BRAKE IGBT, THREE PHASE DIODE BRIDGE AND THERMISTOR

Complex configuration allows for versatile power control capabilities and efficient thermal management.

Transistor Application: POWER CONTROL

Specifically designed for power control applications, ensuring efficient and precise control over power circuits.

Maximum VCEsat: 2.4 V

Low saturation voltage results in reduced power dissipation and improved efficiency in power switching applications.

Package Shape: RECTANGULAR

Rectangular shape allows for easy mounting and compact design, ideal for space-constrained applications.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide strong mechanical connections, ensuring reliability in high-vibration environments.

No. of Elements: 7

Multiple elements allow for increased power handling capacity and improved performance in complex power circuits.

Nominal Turn Off Time (toff): 616 ns

Fast turn-off time enhances efficiency and reduces switching losses in power control applications.

No. of Terminals: 26

Higher number of terminals provide more flexibility in circuit connections and configurations.

Package Style (Meter): IN-LINE

In-line package style allows for easy integration into existing circuit designs and layouts.

Maximum Operating Temperature: 150 °C

High maximum operating temperature range ensures reliability in demanding industrial environments.

Maximum Collector-Emitter Voltage: 1200 V

High collector-emitter voltage rating enables operation in high-voltage circuits, suitable for power control applications.

Transistor Element Material: SILICON

Silicon material offers high performance and reliability in power semiconductor devices.

Maximum Gate-Emitter Voltage: 20 V

High gate-emitter voltage rating allows for safe and stable gate control in power switching applications.

Minimum Operating Temperature: -40 °C

Wide temperature range ensures operation in extreme cold conditions, suitable for various industrial applications.

Maximum Collector Current (IC): 50 A

High collector current rating enables handling of large currents in power circuits.

Maximum Gate-Emitter Threshold Voltage: 6.8 V

Low gate-emitter threshold voltage ensures efficient gate control in power switching applications.

Terminal Position: DUAL

Dual terminal position allows for easy connection and integration into circuit layouts.

Case Connection: ISOLATED

Isolated case connection provides enhanced safety and protection in high-voltage applications.

Nominal Turn On Time (ton): 248 ns

Fast turn-on time enables quick response and precise control over power switching operations.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) NXH50C120L2C2ESG attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Maximum Gate-Emitter Threshold Voltage:

6.8 V

Maximum Gate-Emitter Voltage:

20 V

JESD-30 Code:

R-PDIP-T26

No. of Elements:

7

No. of Terminals:

26

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Polarity or Channel Type:

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

DUAL

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

616 ns

Nominal Turn On Time (ton):

248 ns

Maximum VCEsat:

2.4 V

Trade Compliance

NXH50C120L2C2ESG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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