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NXH50M65L4Q1SG

Onsemi

NXH50M65L4Q1SG by Onsemi

NXH50M65L4Q1SG by Onsemi is an N-CHANNEL IGBT with 650V VCE, 48A IC, and 86W power dissipation. Ideal for POWER CONTROL applications, it features a fast turn-off time of 130ns and a gate-emitter voltage of 20V. Suitable for high-power systems requiring efficient switching capabilities.

Median Price

$66.650

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 17 parts In-Stock

1+ parts

$66.640

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$54.150

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17

$66.640

$54.150

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DigiKey

USA . 21 parts In-Stock

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$66.660

100+ parts

$54.158

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21

$66.660

$54.158

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Flip Electronics (Authorized)

USA . 2,394 parts In-Stock

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2,394

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Distributors (In-Stock)

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Digiode

USA . 1,195 parts In-Stock

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$63.308

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1,195

$63.308

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Vyrian

USA . 924 parts In-Stock

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$66.640

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924

$66.640

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Flip Electronics

USA . 2,394 parts In-Stock

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2,394

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Distributors (Availability)

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Corphita

USA . 1,912 parts In-Stock

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$59.976

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1,912

$59.976

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Corohmni

South Africa . 426 parts In-Stock

1+ parts

$66.640

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426

$66.640

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Microchip USA

USA . 3,797 parts In-Stock

1+ parts

$174.869

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3,797

$174.869

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Authorized Procurement Solutions

USA . 20,000 parts In-Stock

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20,000

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SupplyDigital Components

Austria . 6,808 parts In-Stock

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6,808

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Kulean Microsystems

USA . 6,421 parts In-Stock

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6,421

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Problanco Electronics

Mexico . 6,226 parts In-Stock

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6,226

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TANS Electronics

Latvia . 5,625 parts In-Stock

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5,625

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UHIMA Technologies

Türkiye . 785 parts In-Stock

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785

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Overview

Experience the power and efficiency of the NXH50M65L4Q1SG by Onsemi, a top-of-the-line Insulated Gate Bipolar Transistor (IGBT) designed for precision power control applications. With a maximum VCEsat of 2.22V and a nominal turn-off time of 130ns, this N-channel transistor delivers unrivaled performance and reliability. Manufactured by Onsemi, a trusted name in the industry known for their high-quality products, the NXH50M65L4Q1SG offers seamless integration, superior durability, and unmatched efficiency. Ideal for a wide range of applications, this IGBT is a game-changer in the world of power control technology, providing customers with exceptional value and unparalleled benefits.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs are known for their high efficiency and fast switching speeds, making them a good choice for power control applications.

Maximum VCEsat: 2.22 V

Low VCEsat means less power loss and higher efficiency in power control applications.

No. of Elements: 6

Having 6 elements allows for complex configurations and more versatility in power control applications.

Maximum Power Dissipation (Abs): 86 W

With a high power dissipation capability, this IGBT can handle high power loads without overheating.

Maximum Collector-Emitter Voltage: 650 V

The high collector-emitter voltage rating makes this IGBT suitable for high voltage applications.

Maximum Gate-Emitter Voltage: 20 V

A higher gate-emitter voltage allows for better control over the switching characteristics of the IGBT.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) NXH50M65L4Q1SG attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

650 V

Configuration:

Maximum Gate-Emitter Threshold Voltage:

5.2 V

Maximum Gate-Emitter Voltage:

20 V

JESD-30 Code:

R-XUFM-X27

No. of Elements:

6

No. of Terminals:

27

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

130 ns

Nominal Turn On Time (ton):

39 ns

Maximum VCEsat:

2.22 V

Trade Compliance

NXH50M65L4Q1SG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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