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FF450R12KE4PHOSA1

Infineon Technologies

FF450R12KE4PHOSA1 by Infineon Technologies

FF450R12KE4PHOSA1 by Infineon Technologies is an N-CHANNEL IGBT with 2 SERIES CONNECTED elements. It has a Max Collector-Emitter Voltage of 1200V and Nominal Turn Off Time of 800ns, making it ideal for POWER CONTROL applications. The transistor is UL APPROVED and operates in temperatures as low as -40°C.

Median Price

$260.578

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 37 parts In-Stock

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$260.578

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37

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Vyrian

USA . 6,883 parts In-Stock

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6,883

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Digiode

USA . 836 parts In-Stock

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836

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Distributors (Availability)

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AZTECH Wire

Italy . 579 parts In-Stock

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$7.203

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579

$7.203

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Ampacity Inc.

Singapore . 1,075 parts In-Stock

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$64.050

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1,075

$64.050

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Modulus Dynamics

Lithuania . 17,034 parts In-Stock

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$134.177

100+ parts

$128.810

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$123.443

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17,034

$134.177

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Continental Prestige Electronics

USA . 4,884 parts In-Stock

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$260.578

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$255.367

4,884

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$255.367

Netroflash

USA . 500 parts In-Stock

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$260.578

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$247.550

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$242.338

500

$260.578

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$247.550

$242.338

Microchip USA

USA . 8,045 parts In-Stock

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$396.532

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8,045

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Argo Parts USA

USA . 2,735 parts In-Stock

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Corphita

USA . 865 parts In-Stock

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Overview

Unlock the power of the FF450R12KE4PHOSA1 by Infineon Technologies, a high-quality Insulated Gate Bipolar Transistor (IGBT) designed for efficient power control applications. With its N-CHANNEL polarity and SERIES CONNECTED configuration, this transistor offers superior performance and reliability. Whether used in industrial machinery or renewable energy systems, customers can trust in the value and benefits that this product brings, from its fast turn on/off times to its UL approval. Elevate your projects with the FF450R12KE4PHOSA1 and experience the difference of Infineon Technologies' advanced technology.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL IGBTs are known for their high efficiency and fast switching capabilities, making them ideal for power control applications.

Configuration: SERIES CONNECTED, CENTER TAP, 2 ELEMENTS WITH BUILT-IN DIODE

This configuration allows for better current handling and improved thermal performance, making it suitable for high power applications.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, ensuring optimal performance and efficiency in controlling high power levels.

Package Shape: RECTANGULAR

Rectangular packages are commonly used for high power devices as they provide efficient heat dissipation and compact design.

Nominal Turn Off Time (toff): 800 ns

With a fast turn-off time, this IGBT can quickly switch off power, reducing the risk of overheating and improving overall system efficiency.

No. of Terminals: 7

Having 7 terminals allows for more flexibility in circuit design and provides additional control options for power management.

Maximum Collector-Emitter Voltage: 1200 V

With a high voltage rating, this IGBT can handle high power levels without the risk of breakdown or damage, ensuring reliable operation.

Transistor Element Material: SILICON

Silicon-based IGBTs are known for their high switching speed and low on-state voltage drop, providing efficient power control and reduced power loss.

Minimum Operating Temperature: -40 °C

With a wide operating temperature range, this IGBT can perform reliably in harsh environmental conditions, making it suitable for a wide range of applications.

Nominal Turn On Time (ton): 325 ns

With a fast turn-on time, this IGBT can quickly switch on power, providing precise control over power levels and improving system response time.

Reference Standard: UL APPROVED

Being UL approved ensures that this IGBT meets strict safety and performance standards, providing peace of mind for users in various applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FF450R12KE4PHOSA1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector-Emitter Voltage:

1200 V

JESD-30 Code:

R-XUFM-X7

No. of Elements:

2

No. of Terminals:

7

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Reference Standard:

UL APPROVED

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

800 ns

Nominal Turn On Time (ton):

325 ns

Trade Compliance

FF450R12KE4PHOSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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