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IRG4PF50WPBF

Infineon Technologies

IRG4PF50WPBF by Infineon Technologies

IRG4PF50WPBF by Infineon Technologies is an N-CHANNEL IGBT with 900V max collector-emitter voltage, 51A max collector current, and 200W max power dissipation. Ideal for POWER CONTROL applications due to its fast turn-off time of 370ns and low gate-emitter threshold voltage of 6V.

Median Price

$2.650

Lifecycle Status

Suppliers In-Stock

8

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1k+

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RS (Exports)

UK . 113 parts In-Stock

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Nova Conductors

Japan . 550 parts In-Stock

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$4.937

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Vyrian

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Digiode

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Dan-Mar Components

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ECAB

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Bristol Electronics

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Aztec Data Supply Inc.

USA . 3,207 parts In-Stock

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$1.310

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Component Stockers USA

USA . 2,030 parts In-Stock

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$4.090

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$3.890

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$3.760

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$4.090

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Continental Prestige Electronics

USA . 260 parts In-Stock

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$4.937

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$4.838

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Modulus Dynamics

Lithuania . 6,158 parts In-Stock

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$6.504

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$6.244

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$5.984

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Corohmni

South Africa . 454 parts In-Stock

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AZTECH Wire

Italy . 829 parts In-Stock

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Semicontronic

India . 728 parts In-Stock

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$61.050

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$59.524

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Ampacity Inc.

Singapore . 929 parts In-Stock

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RC Electronics

USA . 8,766 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,967 parts In-Stock

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Alle Elektronik GmbH

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Perfect Parts

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Glotronic Ltd.

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Argo Parts USA

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Corphita

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Authorized Procurement Solutions

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Epart123

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GreenTree Electronics

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Assy Fe

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Overview

Unlock the power of efficient and reliable power control with the Infineon Technologies IRG4PF50WPBF IGBT. Manufactured by industry leader Infineon Technologies, this N-CHANNEL transistor offers unparalleled performance in a variety of applications. With a maximum collector-emitter voltage of 900V and a maximum gate-emitter voltage of 20V, this IGBT ensures optimal power dissipation and efficient operation. Experience the benefits of fast turn-off and turn-on times, allowing for precise control and increased productivity. Upgrade to the IRG4PF50WPBF today and revolutionize your power control solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for the internal components of the IGBT, ensuring reliability and durability.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs typically have lower on-state voltage drop and higher efficiency compared to P-channel types.

Configuration: SINGLE

Simplifies circuit design and allows for easy integration into various power control applications.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, ensuring optimal performance in controlling high power loads.

Maximum Power Dissipation (Abs): 200 W

Can handle high power dissipation, making it suitable for applications requiring high power handling capabilities.

Maximum Collector-Emitter Voltage: 900 V

Capable of withstanding high voltages, making it suitable for applications where high voltages are present.

Maximum Collector Current (IC): 51 A

Capable of handling high currents, making it suitable for applications requiring high current handling capabilities.

Maximum Operating Temperature: 150 °C

Can operate at high temperatures without a significant decrease in performance, ensuring reliability under varying operating conditions.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) IRG4PF50WPBF attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Additional Features:

LOW CONDUCTION LOSS

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

900 V

Configuration:

Maximum Fall Time (tf):

220 ns

Maximum Gate-Emitter Threshold Voltage:

6 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247AC

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Finish:

MATTE TIN OVER NICKEL

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

370 ns

Nominal Turn On Time (ton):

54 ns

Trade Compliance

IRG4PF50WPBF Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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