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IKW50N60DTPXKSA1

Infineon Technologies

IKW50N60DTPXKSA1 by Infineon Technologies

IKW50N60DTPXKSA1 by Infineon is an N-CHANNEL IGBT with 600V max collector-emitter voltage and 80A max collector current. Ideal for power control applications, it features a single configuration with built-in diode and a nominal turn-off time of 332ns. The transistor operates in temperatures as low as -40°C, making it suitable for various industrial uses.

Median Price

$2.558

Lifecycle Status

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17

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1k+

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Chip1Stop

Japan . 25 parts In-Stock

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$2.380

100+ parts

$1.760

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-

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25

$2.380

$1.760

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Arrow

USA . 25 parts In-Stock

1+ parts

$3.630

100+ parts

$1.625

1k+ parts

$1.288

10k+ parts

$1.179

25

$3.630

$1.625

$1.288

$1.179

DigiKey

USA . 203 parts In-Stock

1+ parts

$3.730

100+ parts

$2.039

1k+ parts

$1.392

10k+ parts

$1.231

203

$3.730

$2.039

$1.392

$1.231

Mouser Electronics

USA . 916 parts In-Stock

1+ parts

$3.810

100+ parts

$1.940

1k+ parts

$1.410

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-

916

$3.810

$1.940

$1.410

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RS (Exports)

UK . 220 parts In-Stock

1+ parts

-

100+ parts

$2.737

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220

-

$2.737

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Farnell

UK . 38 parts In-Stock

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$2.309

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38

-

-

$2.309

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Verical

USA . 25 parts In-Stock

1+ parts

-

100+ parts

$1.625

1k+ parts

$1.288

10k+ parts

$1.179

25

-

$1.625

$1.288

$1.179

Rochester

USA . 17 parts In-Stock

1+ parts

-

100+ parts

$1.240

1k+ parts

$1.110

10k+ parts

$1.040

17

-

$1.240

$1.110

$1.040

Distributors (In-Stock)

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Digiode

USA . 170 parts In-Stock

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$1.814

100+ parts

-

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170

$1.814

-

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Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$2.366

100+ parts

-

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500

$2.366

-

-

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TME

Poland . 3 parts In-Stock

1+ parts

$3.470

100+ parts

$1.980

1k+ parts

$1.820

10k+ parts

-

3

$3.470

$1.980

$1.820

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Flip Electronics

USA . 32,850 parts In-Stock

1+ parts

-

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32,850

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Chip Stock

USA . 15,706 parts In-Stock

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15,706

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Rutronik

Germany . 8,160 parts In-Stock

1+ parts

-

100+ parts

$1.750

1k+ parts

$1.540

10k+ parts

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8,160

-

$1.750

$1.540

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Vyrian

USA . 2,092 parts In-Stock

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2,092

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NAC Semi

USA . 720 parts In-Stock

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720

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IBS Electronics

USA . 180 parts In-Stock

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100+ parts

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$3.029

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180

-

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$3.029

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Semicontronic

India . 1,423 parts In-Stock

1+ parts

$1.620

100+ parts

$1.580

1k+ parts

$1.571

10k+ parts

-

1,423

$1.620

$1.580

$1.571

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Corphita

USA . 565 parts In-Stock

1+ parts

$1.719

100+ parts

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565

$1.719

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Aztec Data Supply Inc.

USA . 1,782 parts In-Stock

1+ parts

$1.930

100+ parts

-

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1,782

$1.930

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Argo Parts USA

USA . 2,853 parts In-Stock

1+ parts

$2.366

100+ parts

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2,853

$2.366

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Modulus Dynamics

Lithuania . 22,247 parts In-Stock

1+ parts

$2.402

100+ parts

$2.306

1k+ parts

$2.210

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-

22,247

$2.402

$2.306

$2.210

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Corohmni

South Africa . 1,048 parts In-Stock

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$2.402

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1,048

$2.402

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Ampacity Inc.

Singapore . 1,119 parts In-Stock

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$3.530

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1,119

$3.530

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Continental Prestige Electronics

USA . 310 parts In-Stock

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$4.400

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$2.700

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$2.050

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310

$4.400

$2.700

$2.050

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Microchip USA

USA . 1,975 parts In-Stock

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$58.857

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1,975

$58.857

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GreenTree Electronics

Israel . 18,000 parts In-Stock

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18,000

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Authorized Procurement Solutions

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Perfect Parts

USA . 806 parts In-Stock

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806

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iodParts Technologies Inc.

India . 453 parts In-Stock

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453

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Overview

Experience superior power control with the IKW50N60DTPXKSA1 Insulated Gate Bipolar Transistor (IGBT) from Infineon Technologies. This N-CHANNEL transistor offers unmatched quality and reliability, making it perfect for a variety of applications. Whether you're looking to optimize energy efficiency or improve performance, this transistor with a built-in diode is sure to meet your needs. Trust in the trusted manufacturer, Infineon Technologies, to deliver value and benefits that will elevate your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides robust protection for the internal components of the IGBT, ensuring durability and reliability in various operating conditions.

Polarity or Channel Type: N-CHANNEL

N-Channel IGBTs typically have lower ON-state resistance, making them more efficient for high-power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for easier implementation of circuit protection and reduces the need for additional components.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, ensuring optimal performance and efficiency in controlling high power levels.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient thermal management and space-saving in circuit designs.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide secure mechanical mounting and soldering connections for reliable operation in various environments.

Nominal Turn Off Time (toff): 332 ns

The fast turn-off time helps in reducing power dissipation and improving overall efficiency in switching applications.

No. of Terminals: 3

The 3-terminal design simplifies connection and integration with other components in the circuit.

Maximum Collector-Emitter Voltage: 600 V

The high maximum voltage rating allows for handling of high voltage levels, making it suitable for a wide range of power applications.

Transistor Element Material: SILICON

Silicon is a commonly used material for transistor elements due to its reliable and stable electrical properties.

Minimum Operating Temperature: -40 °C

Capable of operating at low temperatures, making it suitable for use in harsh environments or industrial applications.

Maximum Collector Current (IC): 80 A

With a high collector current rating, it can handle large currents without compromising performance or reliability.

Terminal Finish: TIN

Tin terminal finish provides good solderability for easy and reliable connections during assembly.

Terminal Position: SINGLE

Single terminal position simplifies installation and connection, making it easier to integrate into the circuit design.

Nominal Turn On Time (ton): 55 ns

The fast turn-on time ensures quick and efficient switching, improving overall performance in power control applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) IKW50N60DTPXKSA1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

332 ns

Nominal Turn On Time (ton):

55 ns

Trade Compliance

IKW50N60DTPXKSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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