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IKW50N60TXK

Infineon Technologies

IKW50N60TXK by Infineon Technologies

IKW50N60TXK by Infineon is an N-CHANNEL IGBT with 600V max collector-emitter voltage and 80A max collector current. It has a turn-off time of 396ns and turn-on time of 60ns, suitable for power control applications. The transistor comes in a rectangular package with through-hole terminals and operates at a max temperature of 150°C.

Median Price

$7.740

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

< 1k

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Chip1Stop

Japan . 167 parts In-Stock

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$7.740

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$3.900

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167

$7.740

$3.900

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Distributors (In-Stock)

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Digiode

USA . 514 parts In-Stock

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$7.353

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514

$7.353

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Vyrian

USA . 167 parts In-Stock

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167

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Nova Conductors

Japan . 93 parts In-Stock

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Corohmni

South Africa . 21 parts In-Stock

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$0.425

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21

$0.425

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Modulus Dynamics

Lithuania . 16,004 parts In-Stock

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$0.639

100+ parts

$0.613

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$0.588

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16,004

$0.639

$0.613

$0.588

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Aztec Data Supply Inc.

USA . 4,561 parts In-Stock

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$0.997

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4,561

$0.997

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Corphita

USA . 26 parts In-Stock

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$6.966

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26

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AZTECH Wire

Italy . 272 parts In-Stock

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$11.349

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272

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Ampacity Inc.

Singapore . 38 parts In-Stock

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$14.320

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38

$14.320

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Continental Prestige Electronics

USA . 6,635 parts In-Stock

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Argo Parts USA

USA . 3,752 parts In-Stock

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Aranea Global

USA . 50 parts In-Stock

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Overview

Unlock the power of advanced technology with the IKW50N60TXK by Infineon Technologies. As a leading manufacturer in the industry, Infineon delivers top-quality Insulated Gate Bipolar Transistors that are perfect for power control applications. With its N-CHANNEL polarity and built-in diode configuration, this transistor ensures efficient performance and reliability. The IKW50N60TXK offers customers unmatched value with its high operating temperature, maximum voltage, and collector current capabilities. Take your projects to the next level with this state-of-the-art transistor from Infineon Technologies.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for the transistor, making it durable and reliable for long-term use.

Polarity or Channel Type: N-CHANNEL

N-Channel IGBTs generally have lower on-state voltage drop and higher efficiency compared to P-Channel types, making them suitable for power control applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Built-in diode helps in clamping high voltage spikes and provides reverse current protection, enhancing the reliability of the device.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, ensuring efficient and stable performance in high power systems.

Maximum Collector-Emitter Voltage: 600 V

High voltage rating allows the transistor to handle large voltage levels, making it suitable for high power applications.

Maximum Collector Current (IC): 80 A

High current handling capability enables the transistor to switch and control large currents, making it ideal for power control applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) IKW50N60TXK attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

JEDEC-95 Code:

TO-247AC

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

396 ns

Nominal Turn On Time (ton):

60 ns

Trade Compliance

IKW50N60TXK Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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